公开(公告)号：US20150126047A1

公开(公告)日：2015-05-07

申请号：US14596172

申请日：2015-01-13

Applicant: Keyssa, Inc.

Inventor： Gary D. McCormack

IPC: H01R13/62

CPC classification number: H01R13/6205 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A first connector may include a housing defining a first connector face to be positioned in a first position or a second position proximate to a second connector face of a second connector. A first extremely high frequency (EHF) communication unit may be disposed in the housing for communicating with a second EHF communication unit of the second connector when the first connector face is positioned in first or second position relative to the second connector face. A first magnet may be disposed in the housing. The first magnet may align with and repel a second magnet disposed relative to the second connector face when the first connector face is positioned in the second position. The first magnet may be configured not to align with and not to repel the second magnet when first connector face is positioned in the first position relative to the second connector face.

Abstract translation: 第一连接器可以包括壳体，其限定要定位在第一位置的第一连接器面或靠近第二连接器的第二连接器面的第二位置。 当第一连接器面相对于第二连接器面定位在第一或第二位置时，第一极高频（EHF）通信单元可以设置在壳体中，用于与第二连接器的第二EHF通信单元通信。 第一磁体可以设置在壳体中。 当第一连接器面定位在第二位置时，第一磁体可以对准并排斥相对于第二连接器面设置的第二磁体。 当第一连接器面相对于第二连接器面定位在第一位置时，第一磁体可以被配置为不与第二磁体对准并且不排斥第二磁体。

公开(公告)号：US08929834B2

公开(公告)日：2015-01-06

申请号：US13787789

申请日：2013-03-06

Applicant: Keyssa, Inc.

Inventor： Ian A. Kyles ,  Gary D. McCormack

IPC: H04B17/00

CPC classification number: H04B1/40 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H04B17/102 ,  H04B17/13 ,  H04B17/21 ,  H04B2001/0416 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An EHF communication system including an EHF communication chip. The EHF communication chip may include an EHF communication circuit having at least one controllable parameter-based module having a testable and controllable operating parameter The EHF communication chip may further include a test and trim circuit coupled to the EHF communication circuit, where the test and trim circuit includes a logic circuit having one or more memory elements, where the logic circuit is coupled to the controllable parameter-based module.

Abstract translation: 包括EHF通信芯片的EHF通信系统。 EHF通信芯片可以包括具有至少一个可控参数的模块的EHF通信电路，其具有可测试和可控的操作参数.EHF通信芯片还可以包括耦合到EHF通信电路的测试和微调电路，其中测试和修剪 电路包括具有一个或多个存储器元件的逻辑电路，其中逻辑电路耦合到基于可控参数的模块。

公开(公告)号：US20140355700A1

公开(公告)日：2014-12-04

申请号：US14462560

申请日：2014-08-18

Applicant: Keyssa, Inc.

Inventor： Gary D. McCormack ,  Ian A. Kyles

IPC: H04L25/40

CPC classification number: H04L25/40 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49861 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01Q7/00 ,  H01Q9/26 ,  H04L7/0087 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A system for communicating modulated EHF signals may include a modulation circuit responsive to a bi-level transmit information signal for generating a transmit output signal. The transmit output signal may have an EHF frequency when the transmit information signal is at a first information state and may be suppressed when the transmit information signal is at a second information state. A transmit transducer operatively coupled to the modulation circuit may be responsive to the transmit output signal for converting the transmit output signal into an electromagnetic signal.

Abstract translation: 用于传送调制的EHF信号的系统可以包括响应于双电平发射信息信号的调制电路，用于产生发射输出信号。 当发送信息信号处于第一信息状态时，发送输出信号可以具有EHF频率，并且当发送信息信号处于第二信息状态时可以抑制发送输出信号。 可操作地耦合到调制电路的发射传感器可以响应于发射输出信号，以将发射输出信号转换成电磁信号。

公开(公告)号：US11013057B2

公开(公告)日：2021-05-18

申请号：US16435281

申请日：2019-06-07

Applicant: Keyssa, Inc.

Inventor： Ian A. Kyles ,  Kenneth R. Kveton ,  Michael A. Bourdess ,  John Wolcott ,  Steve Novak ,  Roger D. Isaac ,  Gary D. McCormack

IPC: H04B7/00 ,  H04W76/28 ,  H04B5/02 ,  H04B1/401 ,  H04W76/14 ,  H04L29/06 ,  H04W12/08 ,  H01L23/31

Abstract: Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors. The link may be a low-latency protocol-transparent communication link capable of supporting a range of data rates. The link may be established through a close proximity coupling between devices, each including at least one EHF communication unit. Each EHF unit involved in establishing an EHF communication link may progress through a series of steps before data can be transferred between the devices. These steps may be controlled by one or more state machines that are being implemented in each EHF communication unit.

公开(公告)号：US20200185816A1

公开(公告)日：2020-06-11

申请号：US16790662

申请日：2020-02-13

Applicant: Keyssa, Inc.

Inventor： Gary D. McCormack ,  Ian A. Kyles

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q1/48 ,  H01Q5/25 ,  H04B5/00

Abstract: A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.

公开(公告)号：US10523278B2

公开(公告)日：2019-12-31

申请号：US16010403

申请日：2018-06-15

Applicant: Keyssa, Inc.

Inventor： Gary D. McCormack ,  Roger Isaac ,  Ian A. Kyles

IPC: H04B5/00 ,  H04B1/40 ,  G09G3/20 ,  G06F1/16 ,  G06F1/18 ,  H02J50/10 ,  H01F7/02 ,  H01P3/16 ,  G09G5/00

Abstract: A computing device includes an integrated unit having a plurality of functional components, and an extremely high frequency (EHF) communication unit operatively coupled to the integrated unit. The EHF communication unit includes a transducer configured to transmit and receive EHF electromagnetic signals, and convert between electrical signals and electromagnetic signals. The computing device includes a transceiver operatively coupled to the transducer. The EHF communication unit may enable at least one of the functional components of the computing device to be supplemented by a functional component of an external computing device.

公开(公告)号：US20190379103A1

公开(公告)日：2019-12-12

申请号：US16450790

申请日：2019-06-24

Applicant: Keyssa, Inc.

Inventor： Gary D. McCormack ,  Ian A. Kyles

IPC: H01Q1/22 ,  H04B1/18 ,  H01L23/552 ,  H04B5/00 ,  H05K1/14 ,  H01L23/48 ,  H01L23/66 ,  H01Q7/00 ,  H01Q9/26 ,  H01Q23/00 ,  H05K9/00 ,  H05K1/02 ,  H01L23/495 ,  H04B1/40 ,  H01Q1/38 ,  H01Q9/04

Abstract: An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.

公开(公告)号：US10381713B2

公开(公告)日：2019-08-13

申请号：US15988957

申请日：2018-05-24

Applicant: Keyssa, Inc.

Inventor： Gary D. McCormack ,  Ian A. Kyles

IPC: H04B7/00 ,  H01Q1/22 ,  H04B1/18 ,  H04B5/00 ,  H05K1/14 ,  H01L23/48 ,  H01L23/66 ,  H01Q7/00 ,  H01Q9/26 ,  H01Q23/00 ,  H05K9/00 ,  H05K1/02 ,  H01L23/495 ,  H01L23/552 ,  H04B1/40 ,  H01Q1/38 ,  H01Q9/04 ,  H01L23/00 ,  H05K1/18

Abstract: An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.

公开(公告)号：US10122059B2

公开(公告)日：2018-11-06

申请号：US15423499

申请日：2017-02-02

Applicant: Keyssa, Inc.

Inventor： Eric Almgren ,  Anthony Michael Fadell ,  Roger D. Isaac ,  Gary D. McCormack ,  Mariel van Tatenhove

IPC: H01P5/00 ,  H01P5/02 ,  H01P3/00

Abstract: Contactless extremely high frequency connector assemblies, passive cable connector assemblies, and active cable connector assemblies are disclosed herein. In one embodiment, a contactless connector assembly can include several (EHF) contactless communication units operable to selectively transmit and receive EHF signals, and several signal directing structures coupled to the EHF CCUs. The signal directing structures can direct the EHF signals along a plurality of EHF signal pathways.

公开(公告)号：US10110324B2

公开(公告)日：2018-10-23

申请号：US15845036

申请日：2017-12-18

Applicant: Keyssa, Inc.

Inventor： Gary D. McCormack ,  Roger D. Isaac

IPC: H04B17/00 ,  H04B15/00 ,  H04B5/00 ,  H04W12/06 ,  H04W4/00 ,  H04W4/80 ,  H01L23/00

Abstract: Shielded extremely high frequency (EHF) connector assemblies are disclosed herein. In some embodiments, a first extremely high frequency (EHF) shielded connector assembly configured to be coupled with a second EHF shielded connector assembly. The first EHF connector assembly can include a first EHF communication unit operative to contactlessly communicate EHF signals with a second EHF communication unit included in the second EHF shielded connector assembly. The first connector can include a connector interface that includes a configuration to interface with a respective connector interface of the second EHF shield connector assembly, and several different material compositions that, in conjunction with the configuration, provide shielding to prevent or substantially reduce EHF signal leakage when the first EHF assembly connector is coupled to the second EHF assembly connector and the first EHF communication unit is contactlessly communicating EHF signals with the second EHF communication unit.