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公开(公告)号：US11581470B2
公开(公告)日：2023-02-14
申请号：US17271057
申请日：2019-08-27
Applicant: LINTEC CORPORATION
Inventor： Wataru Morita , Kunihisa Kato , Tsuyoshi Muto , Yuma Katsuta
Abstract: The present invention is to provide a method of producing a thermoelectric conversion device having a thermoelectric element layer with excellent shape controllability and capable of being highly integrated. The present invention relates to a method of producing a thermoelectric conversion device including a thermoelectric element layer formed of a thermoelectric semiconductor composition containing a thermoelectric semiconductor material on a substrate, the method including a step of providing a pattern frame having openings on a substrate; a step of filling the thermoelectric semiconductor composition in the openings; a step of drying the thermoelectric semiconductor composition filled in the openings, to form a thermoelectric element layer; and a step of releasing the pattern frame from the substrate.
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公开(公告)号：US20230044413A1
公开(公告)日：2023-02-09
申请号：US17786269
申请日：2020-12-01
Applicant: LINTEC Corporation
Inventor： Yuta SEKI , Kunihisa KATO , Tsuyoshi MUTO
Abstract: Provided are: a thermoelectric conversion body that has high electrical conductivity, achieving high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a fired product of a composition containing a thermoelectric semiconductor material and a heat resistant resin, wherein, with the heat resistant resin being subjected to temperature elevation and a weight of the heat resistant resin at 400° C. being defined as 100%, a temperature at which the heat resistant resin undergoes a further 5% reduction in weight is 480° C. or lower; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.
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公开(公告)号：US11522114B2
公开(公告)日：2022-12-06
申请号：US16467745
申请日：2017-12-07
Applicant: LINTEC CORPORATION
Inventor： Kunihisa Kato , Wataru Morita , Tsuyoshi Mutou , Yuma Katsuta , Takeshi Kondo
Abstract: The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.
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公开(公告)号：US11479020B2
公开(公告)日：2022-10-25
申请号：US16094446
申请日：2017-04-25
Applicant: LINTEC CORPORATION , LINTEC OF AMERICA, INC.
Inventor： Akio Kabuto , Masaharu Ito , Kanzan Inoue
Abstract: A carbon nanotube sheet structure includes: a carbon nanotube sheet; a first base material including a first base material surface facing the carbon nanotube sheet; and a first spacer providing a gap between the carbon nanotube sheet and the first base material. A first base material surface of the first base material includes a first region on which the first spacer is provided and a second region on which the first spacer is not provided. The first base material is spaced apart from the carbon nanotube sheet at the second region on the first base material surface.
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公开(公告)号：US20220317507A1
公开(公告)日：2022-10-06
申请号：US17708133
申请日：2022-03-30
Applicant: LINTEC CORPORATION
Inventor： Baku KATAGIRI , Kentaro KUSAMA , Tatsuki KURAMOTO
IPC: G02F1/1335 , G02B5/02
Abstract: An external light use type display body including: a light diffusion control layer; a display layer; and a reflective layer. The light diffusion control layer has a regular internal structure that comprises a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The reflective layer has a patterned indented structure when at least one cross section cut in a thickness direction is viewed. When the entrance plane is irradiated with light rays that travel on the light ray traveling plane with a predetermined incident angle while being scanned along an intersection line of the light ray traveling plane and the entrance plane, the ratio of the light rays satisfying the following Formula (1) or Formula (2) is 50% or more. θid
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Patent Agency Ranking
公开(公告)号：US20220293554A1
公开(公告)日：2022-09-15
申请号：US17636211
申请日：2020-08-20
Applicant: LINTEC CORPORATION
Inventor： Isao ICHIKAWA , Hidekazu NAKAYAMA , Yosuke SATO
Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying a back surface side of the semiconductor chip to the film-form firing material on the support sheet to face each other; peeling off the film-form firing material and the semiconductor chip from the support sheet; applying, to a substrate, a film-form firing material side of the semiconductor chip to which the film-form firing material has been applied; and heating the film-form firing material to 200° C. or higher to sinter-bond the semiconductor chip and the substrate.
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27.发明授权公开(公告)号：US11424397B2
公开(公告)日：2022-08-23
申请号：US16493345
申请日：2018-03-13
Applicant: LINTEC CORPORATION
Inventor： Kunihisa Kato , Wataru Morita , Tsuyoshi Muto , Yuma Katsuta
Abstract: Provided are an electrode material for thermoelectric conversion modules capable of preventing cracking and peeling of electrodes that may occur at the bonding parts of a thermoelectric element and an electrode under high-temperature conditions to thereby maintain a low resistance at the bonding parts, and a thermoelectric conversion module using the material. The electrode material for thermoelectric conversion modules includes a first substrate and a second substrate facing each other, a thermoelectric element formed between the first substrate and the second substrate, and an electrode formed on at least one substrate of the first substrate and the second substrate, wherein the substrate is a plastic film, the thermoelectric element contains a bismuth-tellurium-based thermoelectric semiconductor material, a telluride-based thermoelectric semiconductor material, an antimony-tellurium-based thermoelectric semiconductor material, or a bismuth-selenide-based thermoelectric semiconductor material, the electrode that is in contact with the thermoelectric element is formed of a metal material, and the metal material is gold, nickel, aluminum, rhodium, platinum, chromium, palladium, stainless steel, molybdenum or an alloy containing any of these metals.
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公开(公告)号：US20220220641A1
公开(公告)日：2022-07-14
申请号：US17615028
申请日：2020-05-26
Applicant: LINTEC CORPORATION
Inventor： Yoshiaki HAGIHARA
Abstract: A 3D-printer modeling material includes for instance, a resin and a wire rod including a carbon nanotube yarn. The resin is a thermoplastic resin.
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公开(公告)号：US20220135828A1
公开(公告)日：2022-05-05
申请号：US17575811
申请日：2022-01-14
Applicant: LINTEC Corporation
Inventor： Masanori YAMAGISHI , Akinori SATO
IPC: C09D133/04 , C09J163/00 , C09J7/20 , C09J7/30 , C09J4/06 , C09J7/25 , C09J7/38 , C08L63/00 , H01L23/00
Abstract: A curable resin film of the present invention forms a first protective film (la) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 μm, an average diameter of 60 to 500 μm, and an average pitch of 100 to 800 μm, heating the attached curable resin film at 100° C. to 200° C. for 0.5 to 3 hours, and curing the heated curable resin film, and when longitudinal sections thereof are observed by a scanning electron microscope, a ratio (h3/h1) of an average thickness (h3) of the first protective film (1a) at a center position between the bumps (51) to an average peak height (h1) of the bumps (51), and a ratio (h2/h1) of an average thickness (h2) of the first protective film (1a) at a position being in contact with the plurality of bumps (51) to the average peak height (h1) satisfy a relationship represented by the following expression of [{(h2/h1)−(h3/h1)}≤0.1].
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30.发明授权公开(公告)号：US11322385B2
公开(公告)日：2022-05-03
申请号：US17083462
申请日：2020-10-29
Applicant: LINTEC Corporation
Inventor： Kazuto Aizawa , Jun Maeda
IPC: H01L21/683 , C09J201/00 , H01L21/304 , H01L21/78 , C09J7/38
Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.
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