公开(公告)号：US07751141B2

公开(公告)日：2010-07-06

申请号：US12116175

申请日：2008-05-06

Applicant: German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

Inventor： German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

IPC: G11B19/02

CPC classification number: G11B15/682 ,  G11B15/689 ,  G11B17/22 ,  G11B17/225 ,  G11B17/228

Abstract: In an automated library, data cartridges, such as magnetic tape cartridges, are stored in storage cells and accessed by data storage drives. An accessor with a gripper transports cartridges between storage cells and storage drives. Cartridges are prioritized according to their relative importance. A processor manages the placement of the cartridges in cells by having higher priority cartridges stored closer to the front of multi-cartridge cells than cartridges with a lower priority. Cartridges with a higher priority may also be stored closer to a storage drive than cartridges with a lower priority. A pusher may be used to push cartridges towards the front of multi-cartridge cells with an empty position to enable the gripper to reach the front cartridge.

Abstract translation: 在自动化库中，数据盒式磁带（如磁带盒）存储在存储单元中，并由数据存储驱动器访问。 具有夹持器的存取器在存储单元和存储驱动器之间传送墨盒。 墨盒根据其相对重要性进行优先排序。 处理器通过将较高优先级的存储盒存储在比多盒单元的前面更靠近具有较低优先级的盒，来管理盒中的盒的放置。 具有较高优先级的墨盒也可以比具有较低优先级的墨盒更靠近存储驱动器。 可以使用推动器将空盒朝向多盒单元的前部推送，以使夹具能够到达前盒。

公开(公告)号：US20090151893A1

公开(公告)日：2009-06-18

申请号：US11956311

申请日：2007-12-13

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: F28F7/00

CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding areas of the stacked sheets using thermo-compression bonding.

Abstract translation: 用于制造用于冷却集成电路的柔性热界面装置的方法包括以下步骤：根据至少一种图案切割多个高导热性片材，所述片材由第一材料制成; 在所述多个片材中的至少一个片材中形成弹簧元件; 用第二材料涂覆片材，其中第二材料不同于第一材料; 堆叠高导热片材; 以及使用热压接合的层叠片材的接合区域。

公开(公告)号：US07545647B2

公开(公告)日：2009-06-09

申请号：US12037067

申请日：2008-02-25

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20 ,  H01L23/36

CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的固体导热层。 固体导热层是与电子设备接触的平面。 该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中 多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大， 导电层。

公开(公告)号：US07518822B1

公开(公告)日：2009-04-14

申请号：US11374190

申请日：2006-03-13

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: G11B15/68

CPC classification number: G11B15/6835 ,  G11B17/225

Abstract: In an automated library, data cartridges, such as magnetic tape cartridges, are stored in multi-cartridge storage cells or shelves and accessed by data storage drives. An accessor with a deep-reach gripper transports cartridges between storage cells and storage drives. The gripper is capable of extending into the cell to grip and remove a cartridge stored in any position therein. The gripper may include a scissors mechanism, a set of units extendable with lead screws, or another extendable mechanism.

Abstract translation: 在自动化库中，数据盒式磁带（如磁带盒）存储在多盒式存储单元或架子中，并由数据存储驱动器访问。 具有深度夹持器的存取器在存储单元和存储驱动器之间传送墨盒。 夹具能够延伸到电池中以夹持和移除存储在其中任何位置的盒。 夹具可以包括剪刀机构，一组可用导螺杆延伸的单元或另一可延伸机构。

公开(公告)号：US20080298016A1

公开(公告)日：2008-12-04

申请号：US12180711

申请日：2008-07-28

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin portion has a narrowed tip; coupling the spring structure with a planar heat-conducting material to form a first heat-conducting layer; positioning the first heat-conducting layer such that the planar heat-conducting material is on top; and placing the first heat-conducting layer over the electronic device such that the fin portion is oriented at an angle toward the electronic device, and such that the narrowed tip of the fin portion is in contact with the top surface of the electronic device.

Abstract translation: 一种用于冷却电子设备的方法包括：通过将多个弹簧元件与一个以一定角度取向的翅片部分联接来形成弹簧结构，其中，翅片部分的第一端具有变窄的尖端; 将弹簧结构与平面导热材料联接以形成第一导热层; 将第一导热层定位成使得平面导热材料位于顶部; 并且将第一导热层放置在电子设备上，使得翅片部分朝向电子设备成一定角度，并且使得翅片部分的变窄的尖端与电子设备的顶表面接触。

公开(公告)号：US20080185118A1

公开(公告)日：2008-08-07

申请号：US11670080

申请日：2007-02-01

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: B22D11/07

CPC classification number: H05K3/3457 ,  H05K2203/0113

Abstract: A process of reducing friction, which is encountered in molds utilized in injection molded, solder processing, and wherein glass mold plates have mold pits etched therein. The mold pates are subjected to a heat treatment so as to smooth or round-off sharp edges along the periphery of the mold pits.

Abstract translation: 一种降低摩擦的方法，其在注射成型，焊接加工中使用的模具中遇到，并且其中玻璃模板在其中蚀刻有模具凹坑。 对模具进行热处理，以沿着模具凹坑的周边平滑或圆形的锐利边缘。

公开(公告)号：US07355855B2

公开(公告)日：2008-04-08

申请号：US11151830

申请日：2005-06-14

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance. In one alternative, the structure further includes a solid heat-conducting layer disposed over the electronic device, wherein the plurality of spring elements are coupled to the solid heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的顶层。 该结构还包括设置在顶层和电子设备之间的多个弹簧元件，用于从电子设备提供热路径，并且其中多个弹簧元件提供机械顺应性。 在一个替代方案中，该结构还包括设置在电子设备上的固体导热层，其中多个弹簧元件联接到固体导热层。

公开(公告)号：US07188667B2

公开(公告)日：2007-03-13

申请号：US10901695

申请日：2004-07-29

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: F28F7/02

CPC classification number: F28F13/00 ,  F28F2013/006 ,  H01L23/36 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device. The structure includes a first layer disposed over the electronic device for providing a heat path from the electronic device and a bottom layer including a fin structure and a lower surface opposite the fin structure, wherein the lower surface contacts the first layer. The structure further includes a liquid layer disposed over the fin structure of the bottom layer and a top layer including a fin structure and a top surface opposite the fin structure, wherein the fin structure of the top layer contacts the liquid layer. The structure further includes a heat sink in contact with or integral with the top layer.

Abstract translation: 一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的第一层，用于提供来自电子设备的热路径以及包括翅片结构的底层和与翅片结构相对的下表面，其中下表面接触第一层。 该结构还包括设置在底层的翅片结构上的液体层和包括翅片结构的顶层和与翅片结构相对的顶表面，其中顶层的翅片结构接触液体层。 该结构还包括与顶层接触或与顶层一体的散热器。

公开(公告)号：US07136243B2

公开(公告)日：2006-11-14

申请号：US11015130

申请日：2004-12-17

Applicant: Timothy J. Chainer ,  Anthony P. Praino ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

Inventor： Timothy J. Chainer ,  Anthony P. Praino ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

IPC: G11B5/09 ,  G11B21/02

CPC classification number: G11B5/59633 ,  G11B5/5565 ,  G11B21/106

Abstract: Improvements in placement of timing patterns in self-servowriting include correcting for systematic errors due to geometric effects. A correction is made for varying systematic errors, such as when the recording head has spatially separate read and write elements. Further, servopattern rotation due to residual or unmeasured systematic errors is reduced by using a once per revolution clock index derived from the motor drive current waveform or any other sensor. In one aspect of correcting for systematic errors in the writing of timing patterns on a storage medium of a storage device, a time interval between a trigger pattern written at a first radial position of the storage medium and a rotational index is measured. The rotational index is related to the rotational orientation of the storage medium with respect to a fixed frame of the storage device. The location of another trigger pattern to be written is shifted, using the measured time interval to determine the shift in location for the another trigger pattern.

Abstract translation: 自我维护中定时模式布局的改进包括纠正由于几何效应引起的系统误差。 对变化的系统误差进行校正，例如当记录头具有空间上分离的读和写元件时。 此外，通过使用从电动机驱动电流波形或任何其他传感器导出的每转一次的时钟指数来减少由于残余或未测量的系统误差引起的伺服模式旋转。 在对存储装置的存储介质上的定时模式的写入进行校正系统错误的一个方面，测量在存储介质的第一径向位置上写入的触发模式与旋转指标之间的时间间隔。 旋转指数与存储介质相对于存储装置的固定框架的旋转取向有关。 使用测量的时间间隔来移动要写入的另一个触发模式的位置，以确定另一个触发模式的位置偏移。

公开(公告)号：US07016140B1

公开(公告)日：2006-03-21

申请号：US10990913

申请日：2004-11-16

Applicant: Mark D. Schultz ,  Timothy J. Chainer

Inventor： Mark D. Schultz ,  Timothy J. Chainer

IPC: G11B21/10

CPC classification number: G11B5/59633 ,  G11B5/59666

Abstract: Embodiments of the present invention provide a technique to correct timing mark position error in self-servo write (SSW). In one embodiment, a method of correcting a timing mark position error of a SSW pattern of a disk drive comprises writing a plurality of timing mark bursts over a plurality of steps on a disk, the plurality of timing mark bursts including at least one misaligned burst having an intentional misalignment in a first step with respect to a corresponding burst in a neighboring second step; reading the misaligned burst and the corresponding burst at a seam between the first step and the second step to obtain a measured burst amplitude; and using the measure burst amplitude to obtain a timing mark position error, which may involve comparing the measured burst amplitude and an expected burst amplitude computed based on the intentional misalignment between the misaligned burst and the corresponding burst to obtain a timing mark position error.

Abstract translation: 本发明的实施例提供了一种校正自伺服写入（SSW）中的定时标记位置误差的技术。 在一个实施例中，校正磁盘驱动器的SSW模式的定时标记位置误差的方法包括在盘上的多个步骤上写入多个定时标记脉冲串，所述多个定时标记脉冲串包括至少一个未对准脉冲串 在相邻的第二步骤中相对于相应的突发在第一步骤中有意的未对准; 在第一步骤和第二步骤之间的接缝处读取不对齐的突发和相应的突发，以获得测量的突发幅度; 并且使用测量脉冲串幅度来获得定时标记位置误差，其可以涉及比较所测量的脉冲串幅度和基于未对准脉冲串与对应脉冲串之间的有意错位而计算出的预期脉冲串幅度，以获得定时标记位置误差。