公开(公告)号：US09686602B2

公开(公告)日：2017-06-20

申请号：US14739636

申请日：2015-06-15

Applicant: UNEO Inc.

Inventor： Chih-Sheng Hou ,  Cheng-Tsung Chen ,  Chia-Hung Chou

IPC: H04R1/10

CPC classification number: H04R1/1041 ,  H04R1/1008

Abstract: A green headphone is disclosed. A force sensor is configured between a speaker cover and a cushion of the headphone. The headphone switches on automatically to play audio when a user puts the headphone on his head. The headphone switches off automatically to stop playing audio when a user puts the headphone off his head, the power consumption is saved.

公开(公告)号：US09677954B2

公开(公告)日：2017-06-13

申请号：US14466667

申请日：2014-08-22

Applicant: UNEO INC.

Inventor： Chia-Hung Chou ,  Chih-Sheng Hou

IPC: G01L1/22 ,  G01L1/18 ,  G06F3/0354 ,  G01L5/00 ,  H01C10/12

CPC classification number: G01L1/18 ,  G01L5/0019 ,  G06F3/0338 ,  G06F3/03545 ,  H01C10/12

Abstract: An instant response pressure sensor is disclosed. An embodiment shows no continuous gap is configured between a piezoresistor and neighboring element(s) in thickness direction. The instant response pressure sensor is able to respond immediately to an extremely small pressure applied thereupon in the early stage with an extremely small distance movement because the instant response pressure sensor without having an extra press journey to move before trigging.

公开(公告)号：US20170045405A1

公开(公告)日：2017-02-16

申请号：US14823142

申请日：2015-08-11

Applicant: UNEO INC.

Inventor： Chih-Sheng HOU

IPC: G01L1/16

CPC classification number: G01L1/16

Abstract: A surface mount force sensing module is disclosed. A first embodiment shows that the surface mount force sensing module has a bottom electrode designed to be mounted on a circuit board. A second, third, and fourth embodiments show that the sensing module has a pair of bottom electrodes amenable for mounting onto a circuit board.

Abstract translation: 公开了表面安装力感测模块。 第一实施例示出了表面安装力感测模块具有设计成安装在电路板上的底部电极。 第二，第三和第四实施例示出了感测模块具有适于安装到电路板上的一对底部电极。

公开(公告)号：US20160313839A1

公开(公告)日：2016-10-27

申请号：US14693567

申请日：2015-04-22

Applicant: UNEO Inc.

Inventor： Chih-Sheng HOU ,  Chia-Hung CHOU

IPC: G06F3/041 ,  G06F3/0354

CPC classification number: G06F3/03545 ,  G01L1/16 ,  G01L1/18 ,  G06F3/0383

Abstract: A force sensing module is disclosed. One of the embodiments disclosed a first force sensor, and a second force sensor stacked on a top surface of the first force sensor; a signal processing circuit electrically coupled to the first signal force sensor and the second force sensor; when a force is applied on a top surface of the stack, a corresponding force signal is generated; wherein a strength of the force signal is related to an amount of the force applied against the stack.

Abstract translation: 公开了力传感模块。 其中一个实施例公开了第一力传感器和堆叠在第一力传感器的顶表面上的第二力传感器; 电耦合到第一信号力传感器和第二力传感器的信号处理电路; 当施加在堆叠的顶表面上的力时，产生相应的力信号; 其中所述力信号的强度与对所述堆叠施加的力的量相关。