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公开(公告)号：US11942580B2
公开(公告)日：2024-03-26
申请号：US17498105
申请日：2021-10-11
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Simon Gubser , Mario Cesana , Markus Rossi , Hartmut Rudmann
IPC: H01L33/56 , H01L23/00 , H01L27/146 , H01L31/0203 , H01L31/0216 , H01L31/0232 , H01L31/18 , H01L33/00 , H01L33/44 , H01L33/48 , H01L33/54 , H01L33/58 , H01S5/02 , H01S5/183 , H10K50/84 , H10K50/858 , H10K71/00
CPC classification number: H01L33/56 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L31/0203 , H01L31/02164 , H01L31/02327 , H01L31/186 , H01L33/0095 , H01L33/44 , H01L33/486 , H01L33/54 , H01L33/58 , H01S5/02 , H01S5/183 , H10K50/84 , H10K50/858 , H10K71/00 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/181 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/181 , H01L2924/00012 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00 , H01L2924/15311 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00
Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
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公开(公告)号：US20220176597A1
公开(公告)日：2022-06-09
申请号：US17436823
申请日：2020-03-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Hartmut Rudmann , Nicola Spring , Sebastiano Lazzi Gazzini
IPC: B29C43/02 , B29C43/38 , B29C64/112 , B29C64/379 , B29D11/00
Abstract: A method of manufacturing a plurality of optical elements (140) comprising the steps of providing a substrate (120), and a tool (101) comprising a plurality of replication sections (106), each defining a surface structure of one of the optical elements (140), the tool (101) further comprising at least one contact spacer portion (112), aligning the tool (101) and the substrate (120) with respect to each other and bringing the tool (101) and a first side of the substrate (122) together, with replication material (124) between the tool (101) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (122), and thereby causing the spacer portion (112) to adhere to the first side of the substrate (122), hardening the replication material (124), wherein the substrate (120) has yard line features (138) around at least a portion of the replication sections (106), the yard line features (138) containing the replication material (124) on a first side of the yard line with respect to the tool (101) and the substrate (120).
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公开(公告)号：US20210333445A1
公开(公告)日：2021-10-28
申请号：US17318345
申请日：2021-05-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Nicola Spring , Hartmut Rudmann , Markus Rossi
Abstract: The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.
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公开(公告)号：US11114573B2
公开(公告)日：2021-09-07
申请号：US16719194
申请日：2019-12-18
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Martin Lukas Balimann , Matthias Gloor , Philippe Bouchilloux , Jukka Alasirnio , Hartmut Rudmann , Nicola Spring
IPC: H01L31/02 , H01L31/0203 , H01L27/146 , H01L31/0232 , H05K1/02 , H01S5/023 , H01S5/0233 , H01S5/0235 , H01S5/02253 , H01L31/024 , H01L33/48 , H01L33/58 , H01L33/62 , H01L33/64 , H01L51/52 , H01S5/02208 , H01S5/024 , H01L31/18
Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
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公开(公告)号：US10771714B2
公开(公告)日：2020-09-08
申请号：US15121459
申请日：2015-02-23
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Jukka Alasirniö , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
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Patent Agency Ranking
公开(公告)号：US10564262B2
公开(公告)日：2020-02-18
申请号：US15334587
申请日：2016-10-26
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Liu Yang , Hartmut Rudmann
Abstract: An optical ranging system includes a demodulation pixel array and a multi-mode light emitter. The multi-mode light emitter includes an illumination source and can generate a diffuse illumination and a discrete illumination in a first and second mode, respectively. Accordingly, in some implementations, the optical ranging system collects distance data via a time-of-flight technique and a structure-light technique. The illumination source can be operable to produce a diffuse illumination in a first mode and a discrete illumination in a second mode.
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公开(公告)号：US10527762B2
公开(公告)日：2020-01-07
申请号：US15441515
申请日：2017-02-24
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Hartmut Rudmann , Susanne Westenhöfer , Bojan Tesanovic
Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).
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公开(公告)号：US12005658B2
公开(公告)日：2024-06-11
申请号：US17436823
申请日：2020-03-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Hartmut Rudmann , Nicola Spring , Sebastiano Lazzi Gazzini
IPC: B29D11/00 , B29C43/02 , B29C43/38 , B29C64/112 , B29C64/188 , B29C64/30 , B29C64/379 , G02B3/00 , B29L11/00
CPC classification number: B29D11/00307 , B29C43/021 , B29C43/38 , B29C64/112 , B29C64/188 , B29C64/30 , B29C64/379 , B29D11/00298 , B29D11/00365 , B29D11/00413 , G02B3/0075 , B29L2011/0016
Abstract: A method of manufacturing a plurality of optical elements (140) comprising the steps of providing a substrate (120), and a tool (101) comprising a plurality of replication sections (106), each defining a surface structure of one of the optical elements (140), the tool (101) further comprising at least one contact spacer portion (112), aligning the tool (101) and the substrate (120) with respect to each other and bringing the tool (101) and a first side of the substrate (122) together, with replication material (124) between the tool (101) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (122), and thereby causing the spacer portion (112) to adhere to the first side of the substrate (122), hardening the replication material (124), wherein the substrate (120) has yard line features (138) around at least a portion of the replication sections (106), the yard line features (138) containing the replication material (124) on a first side of the yard line with respect to the tool (101) and the substrate (120).
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公开(公告)号：US20210014429A1
公开(公告)日：2021-01-14
申请号：US17013287
申请日：2020-09-04
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Jukka Alasirnio , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
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公开(公告)号：US10886420B2
公开(公告)日：2021-01-05
申请号：US16091352
申请日：2017-04-05
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Qichuan Yu , Hartmut Rudmann , Ji Wang , Kian Siang Ng , Simon Gubser , James Eilertsen , Sundar Raman Gnana Sambandam
IPC: H01L31/0203 , H01L31/0232 , H01L31/16 , H01L31/18 , H01L33/58 , H01L33/54 , H01L31/0216 , H01L21/76 , H01L27/14 , H01L33/56 , H01L33/00 , H01S5/022
Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.
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