IN-EAR HEADPHONE
    22.
    发明申请

    公开(公告)号:US20210029438A1

    公开(公告)日:2021-01-28

    申请号:US17069599

    申请日:2020-10-13

    Applicant: Apple Inc.

    Abstract: A low-profile earbud is disclosed that sits securely within an ear of a user. The earbud includes a protruding portion that passes through a channel defined by the tragus and anti-tragus of the ear. In some embodiments, the protruding portion can take the form of a cable configured to supply power and transfer data to the earbud. In some embodiments, the protruding portion can provide additional space for electrical components and sensors supporting the earbud.

    IN-EAR HEADPHONE
    23.
    发明申请
    IN-EAR HEADPHONE 审中-公开

    公开(公告)号:US20200288230A1

    公开(公告)日:2020-09-10

    申请号:US16883031

    申请日:2020-05-26

    Applicant: Apple Inc.

    Abstract: A low-profile earbud is disclosed that sits securely within an ear of a user. The earbud includes a protruding portion that passes through a channel defined by the tragus and anti-tragus of the ear. In some embodiments, the protruding portion can take the form of a cable configured to supply power and transfer data to the earbud. In some embodiments, the protruding portion can provide additional space for electrical components and sensors supporting the earbud.

    HEADPHONE EARTIPS WITH INTERNAL SUPPORT COMPONENTS FOR OUTER EARTIP BODIES

    公开(公告)号:US20190141430A1

    公开(公告)日:2019-05-09

    申请号:US16148552

    申请日:2018-10-01

    Applicant: Apple Inc.

    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

    USER INTERFACE COOLING USING AUDIO COMPONENT
    25.
    发明申请

    公开(公告)号:US20180091901A1

    公开(公告)日:2018-03-29

    申请号:US15613079

    申请日:2017-06-02

    Applicant: Apple Inc.

    Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

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