HEADPHONES WITH AN ANTI-BUCKLING ASSEMBLY

    公开(公告)号:US20220386009A1

    公开(公告)日:2022-12-01

    申请号:US17804274

    申请日:2022-05-26

    Applicant: APPLE INC.

    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

    HEADPHONES WITH INCREASED BACK VOLUME

    公开(公告)号:US20250159396A1

    公开(公告)日:2025-05-15

    申请号:US19021992

    申请日:2025-01-15

    Applicant: APPLE INC.

    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

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