Semiconductor Laser and Optical Amplifier Photonic Package

    公开(公告)号:US20250035752A1

    公开(公告)日:2025-01-30

    申请号:US18794534

    申请日:2024-08-05

    Abstract: A light detection and ranging (LIDAR) device includes a first wafer layer, a laser assembly disposed on the first wafer layer, a capping layer, a second wafer layer, and a photonic integrated circuit (PIC). The capping layer is coupled to the first wafer layer and configured to seal the laser assembly. The second wafer layer is at least partially coupled to the first wafer layer. The PIC is formed on the second wafer layer. The second wafer includes an exit feature configured to outcouple laser light from the laser assembly.

    LIDAR with Switchable Local Oscillator Signals

    公开(公告)号:US20240219574A1

    公开(公告)日:2024-07-04

    申请号:US18404620

    申请日:2024-01-04

    CPC classification number: G01S17/931 G01S7/484 G01S7/4863

    Abstract: A light detection and ranging (LIDAR) sensor system includes a plurality of LIDAR pixels and a local oscillator module. The local oscillator module is coupled to the plurality of LIDAR pixels. The local oscillator module includes a first local oscillator input configured to receive a first local oscillator signal and a second local oscillator input configured to receive a second local oscillator signal. The local oscillator module is configured to provide the first local oscillator signal or the second local oscillator signal to a first LIDAR pixel of the plurality of LIDAR pixels.

    Silicon Photonics Device for LIDAR Sensor and Method for Fabrication

    公开(公告)号:US20240151820A1

    公开(公告)日:2024-05-09

    申请号:US18412119

    申请日:2024-01-12

    CPC classification number: G01S7/4813 G01S17/931

    Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

    LIDAR sensor system including integrated transceiver

    公开(公告)号:US11965982B1

    公开(公告)日:2024-04-23

    申请号:US18484930

    申请日:2023-10-11

    CPC classification number: G01S7/4815 B60W60/00 G01S17/931 B60W2420/52

    Abstract: A LIDAR sensor system for a vehicle can include a light source configured to generate a beam; at least one optical amplifier configured to amplify the beam to produce an amplified beam; an optical power distribution network; a transmitter configured to receive the plurality of distributed beams; and one or more optics configured to emit the plurality of distributed beams. The optical power distribution network can include at least one input port configured to receive the amplified beam; one or more optical splitters configured to split the amplified beam into a plurality of distributed beams; a plurality of output ports respectively configured to provide the plurality of distributed beams; and one or more optical isolators configured to attenuate reflected signals at the plurality of output ports by coherently interfering the reflected signals.

    SYSTEMS AND METHODS FOR TESTING LIDAR SENSOR SYSTEMS

    公开(公告)号:US20250138170A1

    公开(公告)日:2025-05-01

    申请号:US18883809

    申请日:2024-09-12

    Abstract: A device testing circuit for a LIDAR sensor system of a vehicle includes a first splitter optically coupled to a first connection and to a first device, the first device configured to generate a first output signal in response to receiving a first optical signal from the first connection through the first splitter, and a second splitter optically coupled to a second connection and to a second device, the second device configured to generate a second output signal in response to receiving a second optical signal from the second connection through the second splitter. The first splitter and the second splitter are optically coupled to each other.

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