公开(公告)号：US20210199415A1

公开(公告)日：2021-07-01

申请号：US17122301

申请日：2020-12-15

Applicant: EBARA CORPORATION

Inventor： Hiroto YAMADA ,  Taro TAKAHASHI ,  Hiroaki SHIBUE ,  Atsushi ABE ,  Shinpei TOKUNAGA

IPC: G01B7/06 ,  H01L21/67

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

公开(公告)号：US20190193242A1

公开(公告)日：2019-06-27

申请号：US16230614

申请日：2018-12-21

Applicant: EBARA CORPORATION

Inventor： Taro TAKAHASHI ,  Hiroaki SHIBUE ,  Katsuhide WATANABE

IPC: B24B49/10 ,  B24B49/12 ,  B24B49/16 ,  B24B37/013 ,  G01N27/90

CPC classification number: B24B49/105 ,  B24B37/013 ,  B24B49/12 ,  B24B49/16 ,  G01N27/90

Abstract: A magnetic element for strengthening a magnetic field formed in an object and an eddy current sensor using the magnetic field are provided. The eddy current sensor includes a bottom face portion which is a magnetic body, a magnetic core portion provided at the middle of the bottom face portion and a peripheral wall portion provided on the periphery of the bottom face portion. The eddy current sensor further includes an excitation coil disposed on an outer periphery of the magnetic core portion and capable of generating a magnetic field and an excitation coil disposed on an outer periphery of the peripheral wall portion and capable of generating a magnetic field.

公开(公告)号：US20180147687A1

公开(公告)日：2018-05-31

申请号：US15816061

申请日：2017-11-17

Applicant: EBARA CORPORATION

Inventor： Taro TAKAHASHI ,  Akihiko OGAWA

IPC: B24B37/013 ,  B24B37/20

CPC classification number: B24B37/013 ,  B24B37/20

Abstract: A polishing apparatus of the present disclosure polishes a polishing target by pressing the polishing target against a polishing pad. An eddy current sensor measures an impedance that is changeable according to a change of a film thickness of the polishing target, at a plurality of positions of the polishing target, and outputs measurement signals. A difference calculator generates data corresponding to a film thickness based on a measurement signal. The difference calculator calculates a difference between data at different times based on measurement signals output by the eddy current sensor at different times at a center of the polishing target. An end point detector detects a polishing end point indicating the end of polishing based on the difference calculated by the difference calculator.

公开(公告)号：US20170106493A1

公开(公告)日：2017-04-20

申请号：US15293158

申请日：2016-10-13

Applicant: EBARA CORPORATION

Inventor： Taro TAKAHASHI ,  Yuta SUZUKI

IPC: B24B37/20 ,  B24B37/005

Abstract: A polishing apparatus 100 includes a first electric motor 14 that rotationally drives a polishing table 12, and a second electric motor 22 that rotationally drives a top ring 20 that holds a semiconductor wafer 18. The polishing apparatus 100 includes: a current detection portion 24; an accumulation portion 110 that accumulates, for a prescribed interval, current values of three phases that are detected by the current detection portion 24; a difference portion 112 that determines a difference between a detected current value in an interval that is different to the prescribed interval and the accumulated current value; and an endpoint detection portion 29 that detects a polishing endpoint that indicates the end of polishing of the surface of the semiconductor wafer 18, based on a change in the difference that the difference portion 112 outputs.

公开(公告)号：US20150099424A1

公开(公告)日：2015-04-09

申请号：US14506562

申请日：2014-10-03

Applicant: EBARA CORPORATION

Inventor： Taro TAKAHASHI ,  Yasumitsu KAWABATA

IPC: B24B49/18 ,  H01L21/304

CPC classification number: B24B49/18 ,  B24B37/013

Abstract: A polishing method includes: rotating a polishing table that supports a polishing pad; polishing a conductive film by pressing a substrate having the conductive film against the polishing pad; obtaining a film thickness signal with use of an eddy current film-thickness sensor disposed in the polishing table; determining a thickness of the polishing pad based on the film thickness signal; determining a polishing rate of the conductive film corresponding to the determined thickness of the polishing pad; calculating an expected amount of polishing of the conductive film to be polished at the determined polishing rate for a predetermined polishing time; calculating a temporary end-point film thickness by adding the expected amount of polishing to a target thickness; and terminating polishing of the conductive film when the predetermined polishing time has elapsed from a point of time when the thickness of the conductive film has reached the temporary end-point film thickness.

Abstract translation: 抛光方法包括：旋转支撑抛光垫的抛光台; 通过将具有导电膜的基板压靠在抛光垫上来研磨导电膜; 使用设置在所述研磨台中的涡流膜厚度传感器获得膜厚信号; 基于所述膜厚度信号确定所述抛光垫的厚度; 确定与所确定的抛光垫的厚度相对应的导电膜的抛光速率; 以预定的抛光时间以确定的抛光速率计算待抛光的导电膜的预期抛光量; 通过将预期抛光量加到目标厚度上来计算临时终点膜厚度; 并且在从导电膜的厚度达到临时终点膜厚度的时刻开始经过规定的研磨时间后，终止对导电膜的研磨。