公开(公告)号：US20240347652A1

公开(公告)日：2024-10-17

申请号：US18134100

申请日：2023-04-13

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Yusheng Bian ,  Judson R. Holt

IPC: H01L31/0232 ,  H01L31/0224 ,  H01L31/18

CPC classification number: H01L31/02327 ,  H01L31/022408 ,  H01L31/1808

Abstract: Structures including a photodetector and methods of forming a structure including a photodetector. The structure comprises a semiconductor layer comprising a crystalline semiconductor material, a waveguide core including a first sidewall and a second sidewall, and a photodetector including a light-absorbing layer, an anode, and a cathode. The light-absorbing layer includes a first portion and a second portion that are disposed on the semiconductor layer. The first portion of the light-absorbing layer is adjacent to the first sidewall of the waveguide core, and the second portion of the light-absorbing layer is adjacent to the second sidewall of the waveguide core.

公开(公告)号：US20240264374A1

公开(公告)日：2024-08-08

申请号：US18105304

申请日：2023-02-03

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu

IPC: G02B6/122 ,  G02B6/136 ,  H01L23/38 ,  H01L23/48

CPC classification number: G02B6/1228 ,  G02B6/136 ,  H01L23/38 ,  H01L23/481 ,  G02B2006/12121

Abstract: Structures for a cavity-mounted chip and methods of fabricating a structure for a cavity-mounted chip. The structure comprises a substrate including a cavity, a thermoelectric device inside the cavity, and a chip disposed inside the cavity adjacent to the thermoelectric device. The thermoelectric device includes a first plurality of pillars and a second plurality of pillars that alternate with the first plurality of pillars in a series circuit, the first plurality of pillars comprising an n-type semiconductor material, and the second plurality of pillars comprising a p-type semiconductor material.

公开(公告)号：US20240103237A1

公开(公告)日：2024-03-28

申请号：US17933199

申请日：2022-09-19

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Seungman Choi

IPC: G02B6/42

CPC classification number: G02B6/423 ,  G02B6/4206 ,  G02B6/424 ,  G02B6/4274

Abstract: A photonic integrated circuit (PIC) structure includes a substrate, and a cavity defined in the substrate, the cavity including a shoulder at a side of the cavity. A plurality of z-stop supports for an optical device are also included. Each z-stop support of the plurality of z-stop supports is on a support portion of the shoulder. A wire extends over the side of the cavity and between at least two z-stop supports of the plurality of z-stop supports. An optical device is positioned on the plurality of z-stop supports in the cavity and electrically coupled to the wire. Electrical connections between z-stop supports allows larger sized electrical connections to the optical device to mitigate electromigration issues, and increased options for electrical connections.

公开(公告)号：US11587888B2

公开(公告)日：2023-02-21

申请号：US16713709

申请日：2019-12-13

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Asli Sahin ,  Thomas F. Houghton ,  Jennifer A. Oakley ,  Jeremy S. Alderman ,  Karen A. Nummy ,  Zhuojie Wu

IPC: G02B6/42 ,  H01L23/00 ,  G02B6/12

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.

公开(公告)号：US20210356684A1

公开(公告)日：2021-11-18

申请号：US15930876

申请日：2020-05-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Zhuojie Wu ,  Bo Peng

IPC: G02B6/42 ,  G02B6/293 ,  G02B6/43 ,  G01J3/18

Abstract: Structures for a photonics chip, testing methods for a photonics chip, and methods of forming a structure for a photonics chip. A photonics chip includes a first waveguide, a second waveguide, an optical tap coupling the first waveguide to the second waveguide, and a photodetector coupled to the second waveguide. A laser is attached to the photonics chip. The laser is configured to generate laser light directed by the first waveguide to the optical tap.