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公开(公告)号：US20200036873A1
公开(公告)日：2020-01-30
申请号：US16288427
申请日：2019-02-28
Applicant: GoPro, Inc.
Inventor： Himay Shukla , Kielan Crow , Pascal Gohl
Abstract: In one aspect of the present disclosure, a module is disclosed for use with a digital image capturing device (DICD) including an integrated sensor-lens assembly (ISLA). The module includes a cradle configured for connection to a housing of the DICD, and at least one dampener that is configured for positioning between the module and the housing of the DICD to reduce vibrations transmitted to the ISLA.
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