-
公开(公告)号：US10905888B2
公开(公告)日：2021-02-02
申请号：US16362043
申请日：2019-03-22
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Brian P. Hohl , Marc Gregory Martino
Abstract: A filter feedthrough for an AIMD includes ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A first conductive pathway is hermetically sealed to and disposed through the insulator. A feedthrough capacitor is disposed on the device side and includes at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate within a capacitor dielectric. A capacitor active metallization is electrically connected to the active electrode plate and is in non-electrically conductive relation with the ground electrode plate. A capacitor ground metallization is electrically connected to the ground electrode plate and is in non-electrically conductive relation with the active electrode plate. An anisotropic conductive layer is disposed on the device side. The anisotropic conductive layer electrically connects the capacitor active metallization to the first conductive pathway.
-
公开(公告)号：US20200222691A1
公开(公告)日：2020-07-16
申请号：US16827171
申请日：2020-03-23
Applicant: Greatbatch Ltd
Inventor： Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Keith W. Seitz , Marc Gregory Martino
Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.
-
23.发明授权公开(公告)号：US10589107B2
公开(公告)日：2020-03-17
申请号：US16291356
申请日：2019-03-04
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Marc Gregory Martino
Abstract: A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization. An active electrical path extends from the first leadwire to the second leadwire to an MLCC chip capacitor mounted on the circuit board and to the circuit board active circuit trace, and a ground electrical path extends from the MLCC chip capacitor to the circuit board ground metallization and then to the ferrule.
-
24.发明申请公开(公告)号：US20190290921A1
公开(公告)日：2019-09-26
申请号：US16362043
申请日：2019-03-22
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Brian P. Hohl , Marc Gregory Martino
Abstract: A filter feedthrough for an AIMD includes ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A first conductive pathway is hermetically sealed to and disposed through the insulator. A feedthrough capacitor is disposed on the device side and includes at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate within a capacitor dielectric. A capacitor active metallization is electrically connected to the active electrode plate and is in non-electrically conductive relation with the ground electrode plate. A capacitor ground metallization is electrically connected to the ground electrode plate and is in non-electrically conductive relation with the active electrode plate. An anisotropic conductive layer is disposed on the device side. The anisotropic conductive layer electrically connects the capacitor active metallization to the first conductive pathway.
-
-
-
Search Results
24
records
(took 0.014 seconds)
