公开(公告)号：US11527489B2

公开(公告)日：2022-12-13

申请号：US16024007

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Michael J. Hill ,  Mathew Manusharow ,  Beomseok Choi ,  Digvijay Raorane

IPC: H01L23/16 ,  H01L23/00 ,  H01L23/64 ,  G06F1/28 ,  H01F27/28 ,  H01F38/14 ,  H01L25/18

Abstract: An apparatus includes a substrate, one or more integrated circuit dies on the substrate, and a stiffener affixed to the substrate. One or more sections of the stiffener may includes a magnetic material. The apparatus further includes an inductive circuit element comprising one or more conductive structures wrapped around the magnetic material. In some examples where a first coil is wrapped around a first section of the stiffener, and a second coil is wrapped around a second section of the stiffener, current supplied to the first coil generates at the second coil a current that is further transmitted to the one or more semiconductor dies.

公开(公告)号：US20200006166A1

公开(公告)日：2020-01-02

申请号：US16022152

申请日：2018-06-28

Applicant: Intel Corporation

Inventor： Digvijay Raorane ,  Mathew Manusharow

IPC: H01L23/13 ,  H01L23/64 ,  H01L23/15 ,  H01L23/498

Abstract: Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a package substrate; a stiffener having a surface, wherein the stiffener includes a cavity and a conductive pathway between the cavity and the surface of the stiffener, and wherein the stiffener is coupled to the package substrate such that the surface of the stiffener is between the cavity and the package substrate; and an electrical component, wherein the electrical component is embedded in the cavity and is electrically coupled to the package substrate via the conductive pathway.