公开(公告)号：US11658122B2

公开(公告)日：2023-05-23

申请号：US16356442

申请日：2019-03-18

Applicant: Intel Corporation

Inventor： Robert Sankman ,  Robert May

IPC: H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/5381 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5386 ,  H01L25/0655 ,  H01L25/50

Abstract: Embodiments disclosed herein include electronic packages for PoINT architectures. Particularly, embodiments include electronic packages that include reinforcement substrates to minimize warpage. In an embodiment, an electronic package comprises, a reinforcement substrate, a plurality of through substrate vias through the reinforcement substrate, a dielectric substrate over the reinforcement substrate, a cavity into the dielectric substrate, and a component in the cavity.

公开(公告)号：US20220413233A1

公开(公告)日：2022-12-29

申请号：US17357788

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Hiroki Tanaka ,  Kristof Darmawikarta ,  Brandon Marin ,  Robert May ,  Sri Ranga Sai Boyapati

IPC: G02B6/42

Abstract: An optical package comprising an optical die that is electrically coupled to a package substrate, and an optical interconnect adjacent the optical die. The optical interconnect comprises a first polarizing filter adjacent to a first lens, a second polarizing filter adjacent to a second lens; and a film comprising a magnetic material between the first polarizing filter and the second polarizing filter. The second polarizing filter is rotated with respect to the first polarizing filter and the magnetic material is to rotate a polarization vector of light incoming to the optical interconnect. An optical fiber interface port is immediately adjacent to the first lens. The second lens is immediately adjacent to an optical interface of the optical die.