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公开(公告)号：US09554457B2
公开(公告)日：2017-01-24
申请号：US14231406
申请日：2014-03-31
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan
IPC: H01L29/18 , H05K1/02 , F21K99/00 , H05K1/03 , H05K1/11 , H05K1/18 , H01L25/075 , H01L33/62 , H01L33/64
CPC classification number: H05K1/0271 , F21K9/00 , H01L25/0753 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2924/19107 , H05K1/0313 , H05K1/112 , H05K1/181 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
Abstract: Substrates and packages for LED-based light devices can significantly improve thermal performance and provide separate electrical and thermal paths through the substrate. One substrate includes multiple electrically insulating base layers. On a top one of these layers are disposed top-side electrical contacts, including light device pads to accommodate a plurality of light devices. External electrical contacts are disposed on an exterior surface of the substrate. Electrical paths connect the top-side electrical contacts to the external electrical contacts. At least portions of some of the electrical paths are disposed between the electrically insulating base layers. The electrical paths can be arranged such that different subsets of the light device pads are addressable independently of each other. A heat dissipation plate can be formed on the bottom surface of a bottom one of the base layers.
Abstract translation: 用于基于LED的光器件的衬底和封装可以显着改善热性能，并提供通过衬底的单独的电和热路径。 一个衬底包括多个电绝缘基底层。 在这些层中的顶层上设置有顶侧电触点，包括用于容纳多个光器件的光器件焊盘。 外部电触点设置在基板的外表面上。 电气路径将顶侧电触点连接到外部电触点。 一些电路的至少一部分设置在电绝缘基层之间。 电气路径可以被布置成使得光器件焊盘的不同子集彼此独立地寻址。 散热板可以形成在底层底层的底面上。
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公开(公告)号：US20160149088A1
公开(公告)日：2016-05-26
申请号：US14952648
申请日：2015-11-25
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan , Kachun Lee
IPC: H01L33/48 , H01L33/62 , H05B33/08 , H01L25/075
CPC classification number: H05B33/0857 , H01L25/0753 , H01L33/62 , H01L2924/0002 , H01L2924/15174 , H05B33/0869 , H01L2924/00
Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.
Abstract translation: 一种用于LED发射器的衬底包括其中形成有凹陷区的主体。 接合焊盘设置在凹陷区域内，包括用于LED的LED焊盘和用于一个或多个半导体芯片的支撑芯片焊盘，其提供支持电路（例如，驱动器和/或控制器电路）以支持LED的操作。 外部电触点可以设置在凹陷区域的外部。 至少部分地设置在基板主体内的电路径将外部电触点连接到支撑芯片焊盘的第一子集，并将支撑芯片焊盘的第二子集连接到多个LED焊盘，使得一个 可以操作连接到控制器焊盘的多个支撑芯片以将不同的工作电流传送到不同的LED。
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公开(公告)号：US09345095B2
公开(公告)日：2016-05-17
申请号：US13781162
申请日：2013-02-28
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan , Kachun Lee , David Tahmassebi
CPC classification number: H05B33/0857 , H05B33/0815 , H05B33/086 , H05B33/10 , Y10T29/49004
Abstract: A light-emitting diode (LED) emitter module includes a substrate having a plurality of base layers of an electrically insulating material, a plurality of electrical contacts disposed on a top one of the base layer, and a plurality of electrical paths coupled to the electrical contacts, wherein at least a portion of the plurality of electrical paths is disposed between the base layers. The emitter module also includes two or more groups of light-emitting diodes (LEDs), each group having one or more LEDs, and each of the LEDs is coupled to an electrical contact. The electrical paths are configured for feeding separate electrical currents to the groups of LEDs. The emitter module also includes a memory device containing information associating a plurality of output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying an electric current for each of the two or more groups of LEDs.
Abstract translation: 发光二极管（LED）发射器模块包括具有电绝缘材料的多个基底层的基底，设置在基底层顶部的多个电触点，以及耦合到电气 触点，其中所述多个电路径的至少一部分设置在所述基底层之间。 发射器模块还包括两组或更多组发光二极管（LED），每组具有一个或多个LED，并且每个LED耦合到电触点。 电路被配置为将不同的电流馈送到LED组。 发射器模块还包括存储装置，其包含将多个输出光色与相应的多个电流组合相关联的信息，每个组合指定两组或更多组LED中的每一组的电流。
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公开(公告)号：US20160069520A1
公开(公告)日：2016-03-10
申请号：US14940025
申请日：2015-11-12
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan
CPC classification number: F21V19/003 , F21K9/90 , F21V5/007 , F21V5/04 , F21V9/30 , F21V21/14 , F21V23/005 , F21V29/70 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/48 , H01L33/58 , H01L33/647 , H01L2924/0002 , H05K1/0204 , H05K1/0278 , H05K1/0283 , H05K1/0306 , H05K1/144 , H05K1/189 , H05K3/0061 , H05K3/0097 , H05K3/4626 , H05K3/4688 , H05K2201/042 , H05K2201/0909 , H05K2201/09127 , H05K2201/09263 , H05K2201/10106 , H05K2201/10121 , H05K2203/0143 , H05K2203/171 , H01L2924/00
Abstract: A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.
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公开(公告)号：US20140360766A1
公开(公告)日：2014-12-11
申请号：US14231406
申请日：2014-03-31
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan
CPC classification number: H05K1/0271 , F21K9/00 , H01L25/0753 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2924/19107 , H05K1/0313 , H05K1/112 , H05K1/181 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
Abstract: Substrates and packages for LED-based light devices can significantly improve thermal performance and provide separate electrical and thermal paths through the substrate. One substrate includes multiple electrically insulating base layers. On a top one of these layers are disposed top-side electrical contacts, including light device pads to accommodate a plurality of light devices. External electrical contacts are disposed on an exterior surface of the substrate. Electrical paths connect the top-side electrical contacts to the external electrical contacts. At least portions of some of the electrical paths are disposed between the electrically insulating base layers. The electrical paths can be arranged such that different subsets of the light device pads are addressable independently of each other. A heat dissipation plate can be formed on the bottom surface of a bottom one of the base layers.
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Patent Agency Ranking
公开(公告)号：US11032884B2
公开(公告)日：2021-06-08
申请号：US16193606
申请日：2018-11-16
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan , Kachun Lee , David Tahmassebi
Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in a memory device.
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公开(公告)号：US10575374B2
公开(公告)日：2020-02-25
申请号：US15916652
申请日：2018-03-09
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan
Abstract: An emitter for an LED-based lighting device can incorporate “flip-chip” LEDs, in which all electrical contacts are disposed on the bottom surface of the chip. The emitter base can be a multilayer high-temperature cofired ceramic (HTCC) substrate, with metal traces formed between the layers and vias through the layers to join traces in different layers, thereby providing electrical connectivity to each LED. The paths can be arranged such that current can be supplied independently to different subsets of the LEDs. The top layer of the emitter base is fabricated with exposed vias at the top surface. Metal pads are then printed onto the exposed vias on the top surface, and flip-chip LEDs are bonded to the metal pads, e.g., using solder.
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公开(公告)号：US09560713B2
公开(公告)日：2017-01-31
申请号：US14244787
申请日：2014-04-03
Applicant: LedEngin, Inc.
Inventor： Kachun Lee , Xiantao Yan , Zequn Mei
CPC classification number: H05B33/086 , H05B33/0815 , H05B33/0818 , H05B33/0827 , H05B33/0842 , H05B33/0845 , H05B33/0857 , H05B37/02 , Y02B20/346
Abstract: LED-based light source modules can incorporate color tunability and brightness control, allowing a user to select a desired color temperature and/or brightness and to change either or both dynamically. An emitter can include multiple independently addressable groups of LEDs, each emitting light of a different color. By controlling the relative operating current provided to each group, a desired color temperature can be achieved, and by controlling the absolute operating currents, the brightness of the output light can be controlled. Pulse width modulation (PWM) can be used to control the relative and absolute operating currents. Smooth, gradual transitions between brightness and/or color temperature settings in response to changes can be provided.
Abstract translation: 基于LED的光源模块可以包含颜色可调性和亮度控制，允许用户选择所需的色温和/或亮度，并且动态地改变其中一种或两种。 发射器可以包括多个可独立寻址的LED组，每组发射不同颜色的光。 通过控制提供给每个组的相对工作电流，可以实现期望的色温，并且通过控制绝对工作电流，可以控制输出光的亮度。 脉冲宽度调制（PWM）可用于控制相对和绝对工作电流。 可以提供响应于变化的亮度和/或色温设置之间的平滑，逐渐的过渡。
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公开(公告)号：US20160249431A1
公开(公告)日：2016-08-25
申请号：US15144747
申请日：2016-05-02
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan , Kachun Lee , David Tahmassebi
CPC classification number: H05B33/0857 , H05B33/0815 , H05B33/086 , H05B33/10 , Y10T29/49004
Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in the memory device.
Abstract translation: 一种制造发光二极管（LED）发射器模块的方法包括提供衬底并提供设置在衬底上的两组或更多组LED管芯。 每个组具有一个或多个LED管芯，并且每个LED管芯被耦合到电接触件，并且电气路径被配置为将分离的电流馈送到LED管芯组。 该方法还包括确定将多个输出光色与相应的多个电流组合相关联的信息，每个组合指定多个电流值，每个电流值与两个或更多个组中的一个组的LED管芯相关联 的LED模具。 该方法还包括将信息存储在存储器件中，并且提供用于访问存储器件中的信息的电路。
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公开(公告)号：US09234801B2
公开(公告)日：2016-01-12
申请号：US14214479
申请日：2014-03-14
Applicant: LedEngin Inc
Inventor： Zequn Mei , Danny Gonzales , Xiantao Yan , William E. Armstrong
CPC classification number: G01J3/463
Abstract: A method is provided for forming multiple-LED (light-emitting-diode) light emitters from a plurality of LEDs, wherein the number of LEDs in each emitter is an integer M. The method includes providing a plurality of LEDs, each of the LEDs characterized by a first parameter and a second parameter, which are related to color coordinates CIEx and CIEy in a chromaticity diagram. The method also includes determining first and second parameter X0 and Y0 for a target color. The method further includes, for all possible combinations of M LEDs out of the plurality of LEDs, determining a first group parameter and a second group parameter based on the first and second parameters for all of the M LEDs, and selecting a group of M LEDs whose first group parameter and second group parameter are closest to X0 and Y0 as a candidate for forming a light emitter of M LEDs.
Abstract translation: 提供一种用于从多个LED形成多个LED（发光二极管）发光体的方法，其中每个发射器中的LED的数量为整数M.该方法包括提供多个LED，每个LED 其特征在于与色度图中的颜色坐标CIEx和CIEy相关的第一参数和第二参数。 该方法还包括确定目标颜色的第一和第二参数X0和Y0。 该方法还包括：针对多个LED中的M个LED的所有可能组合，基于用于所有M个LED的第一和第二参数来确定第一组参数和第二组参数，并且选择一组M个LED 其第一组参数和第二组参数最接近X0和Y0作为用于形成M个LED的发光体的候选。
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