公开(公告)号：US20200067009A1

公开(公告)日：2020-02-27

申请号：US16232041

申请日：2018-12-25

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US20190123252A1

公开(公告)日：2019-04-25

申请号：US16153823

申请日：2018-10-07

Applicant: Lextar Electronics Corporation

Inventor： Lung-Kuan LAI ,  Pei-Song CAI ,  Jian-Chin LIANG ,  Hao-Chung CHAN ,  Hong-Zhi LIU

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/56 ,  H01L25/075

Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

公开(公告)号：US20240204159A1

公开(公告)日：2024-06-20

申请号：US18590915

申请日：2024-02-28

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jian-Chin LIANG ,  Shih-Lun LAI ,  Jo-Hsiang CHEN

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/165 ,  H01L25/167 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.

公开(公告)号：US20230261165A1

公开(公告)日：2023-08-17

申请号：US18303578

申请日：2023-04-20

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/58 ,  H01L33/0095 ,  H01L2933/0066 ,  H01L2933/0058

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

公开(公告)号：US20230131636A1

公开(公告)日：2023-04-27

申请号：US17970487

申请日：2022-10-20

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Guo-Yi SHIU ,  Chih-Hao LIN ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L25/16 ,  H01L33/54 ,  H01L33/62 ,  H01L33/60

Abstract: Embodiments provide a micro light-emitting diode package structure and a method for forming the same. The micro light-emitting diode package structure includes a redistribution layer, a control device, micro light-emitting diodes, and a flexible material layer. The control device and the micro light-emitting diodes are disposed on and electrically connected to the redistribution layer. The flexible material layer covers the control device and the micro light-emitting diodes, wherein the micro light-emitting diodes are in contact with the flexible material layer.

公开(公告)号：US20230070973A1

公开(公告)日：2023-03-09

申请号：US17939799

申请日：2022-09-07

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Wei-Yuan MA ,  Hui-Ru WU ,  Min-Che TSAI ,  Shiou-Yi KUO ,  Jian-Chin LIANG

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/00

Abstract: A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.

公开(公告)号：US20220190225A1

公开(公告)日：2022-06-16

申请号：US17653462

申请日：2022-03-03

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

Abstract: A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US20220137280A1

公开(公告)日：2022-05-05

申请号：US17448351

申请日：2021-09-21

Applicant: Lextar Electronics Corporation

Inventor： Lung-Kuan LAI ,  Jian-Chin LIANG

IPC: F21V8/00

Abstract: The present disclosure proposes a light-emitting device and a backlight module thereof. The light-emitting elements includes a substrate, a plurality of light-emitting elements, a light guide layer, a plurality of first light adjustment patterns, and a plurality of second light adjustment patterns. The light-emitting elements are disposed on the substrate. The light guide layer covers the substrate and the light-emitting elements. The first light adjustment patterns are disposed over or embedded within the light guide layer, and each of the first light adjustment patterns is located above each of the light-emitting elements, respectively. The second light adjustment patterns are disposed on or embedded in the light guide layer, and the second light adjustment patterns surround the corresponding first light adjustment patterns, respectively. The first light adjustment patterns and second light adjustment patterns have a refractive index smaller than that of the light guide layer.

公开(公告)号：US20220093578A1

公开(公告)日：2022-03-24

申请号：US17313023

申请日：2021-05-06

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jian-Chin LIANG ,  Chien-Nan YEH ,  Shih-Lun LAI ,  Jo-Hsiang CHEN

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/60

Abstract: Disclosed is a light-emitting array structure having a substrate, a plurality of light-emitting pixel units, a plurality of first and second signal wires, and an encapsulating layer. The light-emitting pixel units are arranged in array on the substrate. Each light-emitting pixel unit includes a driving chip, a first flat layer, a first redistribution layer, a second flat layer, a second redistribution layer, and a light-emitting diode. Each first signal wire is electrically connected to a corresponding one of the first redistribution layers and extends in a first direction. The second signal wires extend in a level different from the first signal wires. Each second signal wire is electrically connected to a corresponding one of the second redistribution layers and extends in a second direction different from the first direction. The encapsulating layer covers the light-emitting pixel units, the first and second signal wires, and the substrate.

公开(公告)号：US20210043129A1

公开(公告)日：2021-02-11

申请号：US16672510

申请日：2019-11-03

Applicant: Lextar Electronics Corporation

Inventor： Chien-Nan YEH ,  Jian-Chin LIANG

IPC: G09G3/30 ,  G09G3/20

Abstract: The present disclosure relates to a pixel circuit including a light emitting unit, a processing circuit and a driving circuit. The processing circuit is configured to receive a frame display signal, and is configured to calculate the frame display signal to generate a driving duty cycle corresponding to a driving period according to a driving current value. The driving circuit is electrically connected to the processing circuit and the light emitting unit, and is configured to drive the light emitting unit during the driving period according to the driving duty cycle, the driving current value and a driving frequency.