公开(公告)号：US20060128176A1

公开(公告)日：2006-06-15

申请号：US11349285

申请日：2006-02-06

Applicant: Morgan Johnson

Inventor： Morgan Johnson

IPC: H01R12/00

CPC classification number: H05K3/4015 ,  H05K3/027 ,  H05K3/341 ,  H05K2203/0191 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10T428/12493 ,  Y10T428/12507 ,  Y10T428/12514

Abstract: Application of a conductive material with a compliant underlayer onto selected pads of a substrate, includes forming at least one padstack, by patterning a sheet including a stack of material layers. Padstacks may include a first conductive top layer, one or more underlying layers, and a bottom attachment layer, such as a solder layer. At least one flexible, or compliant, layer is disposed in the sheet between the top and attachment layers. The compliant layer may be a conductive elastomer. The top layer of the padstacks are adhered to a soluble tape, and this composite structure is moved into place over the circuit board by means of a pick and place operation. The placement of the padstacks is followed by a solder reflow to adhere the padstacks to the contact pads of the substrate, and by a wash cycle with a solvent to remove the soluble tape.

Abstract translation: 将具有柔顺底层的导电材料施加到衬底的选定焊盘上，包括通过图案化包括一叠材料层的片材来形成至少一个衬垫堆叠。 垫片可以包括第一导电顶层，一个或多个下层和底部附着层，例如焊料层。 在顶部和附着层之间的片材中设置至少一个柔性或柔顺层。 柔性层可以是导电弹性体。 衬垫的顶层粘附到可溶性胶带上，并且通过拾取和放置操作将该复合结构移动到电路板上的适当位置。 焊盘的放置之后是焊料回流，以将焊盘粘附到衬底的接触焊盘，并且通过用溶剂洗涤循环以除去可溶性带。

公开(公告)号：US20060121648A1

公开(公告)日：2006-06-08

申请号：US11339102

申请日：2006-01-23

Applicant: Morgan Johnson

Inventor： Morgan Johnson

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L23/5382 ,  H01L21/76838 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A conductor carrier provides, separately manufactured, conductive pathways, on a wafer level, which may be coupled to a wafer of fully fabricated integrated circuits. Such conductor carriers include an insulating body having two major surfaces with conductors disposed on each of those surfaces, and conductors disposed within the insulating body so as to provide signal continuity between various conductors on each of the two surfaces. An assembly can be formed by permanently or removably attaching the conductor carrier to the wafer. Conductor carriers may include an evacuation pathway suitable for removing air, or other gases, from between the conductor and the wafer so as to create a pressure differential that urges the conductor carrier into contact with the wafer. Conductor carriers may include a groove which is suitable for receiving a sealing ring; and may include a street map which is suitable for providing guidance to a wafer sawing operation.