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21.
公开(公告)号:US11387037B2
公开(公告)日:2022-07-12
申请号:US16016726
申请日:2018-06-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Noboru Kato , Satoshi Ishino , Mitsuyoshi Nishide , Shinichiro Banba , Masahiro Ozawa
IPC: H01F27/28 , H01F27/29 , H01F41/04 , H01F17/04 , H01F27/24 , H01F41/02 , H01F41/10 , H02M3/155 , H02M3/00 , H05K1/18
Abstract: A surface mount coil component includes an element body with a first surface, a second surface that opposes the first surface, and a third surface connecting the first surface and the second surface, the element body being defined by a compact including magnetic particles; a first conductor pattern provided at the first surface of the element body; a second conductor pattern provided at the second surface of the element body; input/output terminals provided at the third surface of the element body; and metal pins embedded in the element body, ends of each metal pin being connected to the first and second conductor patterns. The first conductor pattern, the second conductor pattern, and the metal pins define a coil conductor. The input/output terminals are defined by a pair of metal pins exposed at the third surface.
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公开(公告)号:US11164695B2
公开(公告)日:2021-11-02
申请号:US15809208
申请日:2017-11-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yoshihito Otsubo , Shinichiro Banba , Mitsuyoshi Nishide , Norio Sakai , Haruhiko Mori
Abstract: A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.
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公开(公告)号:US10424430B2
公开(公告)日:2019-09-24
申请号:US15267729
申请日:2016-09-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Mitsuyoshi Nishide , Yoshihito Otsubo
Abstract: A module includes an insulating layer, a ring-shaped magnetic core built in the insulating layer, a coil electrode disposed in the insulating layer so as to spirally wind around the magnetic core, and heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer. Building the magnetic core into the insulating layer as described above eliminates the need to provide the principal face of the insulating layer with a large mounting area for mounting a coil formed by the magnetic core and the coil electrode. This allows the area of the principal face of the insulating layer to be reduced to achieve miniaturization of the module. The presence of the heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer improves dissipation of the heat generated from the coil.
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公开(公告)号:US10418168B2
公开(公告)日:2019-09-17
申请号:US15998734
申请日:2018-08-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yoshihito Otsubo , Mitsuyoshi Nishide , Norio Sakai
IPC: H05K1/00 , H01F27/29 , H01F41/04 , H01F27/24 , H01F27/28 , H05K1/18 , H05K3/30 , H01F17/00 , H05K1/16
Abstract: A small-sized inductor with desired characteristics is provided. An inductor 1a includes a resin layer 3 and an inductor electrode 6, which includes an inner winding portion 6a and an outer winding portion 6b. The inner winding portion 6a and the outer winding portion 6b forming the inductor electrode 6 include the metal pins 7a to 7d and the wiring boards 8a to 8d. Here, the inner winding portion 6a and the outer winding portion 6b include the metal pins 7a to 7d and the wiring boards 8a to 8d, which have lower specific resistance than conductive paste or plating. This structure thus can reduce the resistance of the entirety of the inductor electrode 6, and improve the characteristics of the inductor 1a. The inductor 1a can reduce its size by including the inductor electrode 6 wound to have a multiplex winding structure.
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公开(公告)号:US10410782B2
公开(公告)日:2019-09-10
申请号:US15276888
申请日:2016-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yoshihito Otsubo , Norio Sakai , Mitsuyoshi Nishide , Shinichiro Banba
Abstract: A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured.
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公开(公告)号:US20170213638A1
公开(公告)日:2017-07-27
申请号:US15481914
申请日:2017-04-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yoshihito Otsubo , Shinichiro Banba , Mitsuyoshi Nishide , Norio Sakai
CPC classification number: H01F27/29 , H01F17/0033 , H01F27/2804 , H01F27/292
Abstract: An inductor component including an inductor electrode includes an insulating layer and an outer electrode for external connection formed on the upper surface of the insulating layer. The inductor electrode includes a metal pin for input/output that has an upper end surface connected to the outer electrode and that is embedded in the insulating layer. The outer electrode includes a base electrode formed on the upper surface of the insulating layer and composed of a conductive paste, and a surface electrode formed on the base electrode by plating. The surface electrode is formed such that the area of a cross section thereof perpendicular to the thickness direction on an outer layer side away from the base electrode is larger than the area of a cross section thereof perpendicular to the thickness direction on an inner layer side close to the base electrode.
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