公开(公告)号：US09974431B2

公开(公告)日：2018-05-22

申请号：US15090905

申请日：2016-04-05

Applicant: OLYMPUS CORPORATION

Inventor： Satoru Adachi

IPC: H04N9/64 ,  H04N3/14 ,  H04N5/335 ,  A61B1/05 ,  H04N5/361 ,  H04N5/376 ,  A61B1/00 ,  H04N5/225 ,  H04N5/357

CPC classification number: A61B1/051 ,  A61B1/00009 ,  H04N5/2256 ,  H04N5/357 ,  H04N5/361 ,  H04N5/376 ,  H04N5/3765 ,  H04N2005/2255

Abstract: An image sensor includes: a reference signal generation unit configured to generate and output a reference signal in accordance with a predetermined voltage; a plurality of pixels disposed in a two-dimensional matrix form and configured to receive light from outside, and to generate and output an imaging signal in accordance with an amount of the received light; a transfer unit configured to transfer the reference signal output from the reference signal generation unit and the imaging signal output from each of the plurality of pixels, during different periods; and an output unit configured to separately hold the reference signal and the imaging signal transferred from the transfer unit, sequentially switch between the reference signal and the imaging signal to output the switched signal.

公开(公告)号：US09294698B2

公开(公告)日：2016-03-22

申请号：US14513674

申请日：2014-10-14

Applicant: Tohoku University ,  OLYMPUS CORPORATION

Inventor： Shigetoshi Sugawa ,  Nana Akahane ,  Satoru Adachi

IPC: H04N5/359 ,  H04N5/357 ,  H04N5/3745 ,  H04N5/374 ,  H04N5/378

CPC classification number: H04N5/359 ,  H04N5/3575 ,  H04N5/374 ,  H04N5/3745 ,  H04N5/37457 ,  H04N5/378

Abstract: A solid-state image pickup apparatus includes: two-dimensionally arrayed unit pixels, each including a PD performing optical-electrical conversion of an incident light; an FD and an output terminal provided for each of pixel groups, each including one or more pixels, the terminal being capable of outputting a noise signal and a signal-noise sum signal separately; first lines to which the terminals are connected in common and which are capable of holding voltages based on signals outputted from the terminals; second lines provided in parallel with the first lines and capable of holding a voltage; inter-transfer-line capacitive elements connecting the second lines and the first lines; a reset switch resetting each of the second lines to a reset voltage; a readout switch provided for each of the second lines; and a third line to which the second lines are connected in parallel via the readout switches, respectively.

Abstract translation: 固态图像拾取装置包括：二维排列的单位像素，每个都包括执行入射光的光电转换的PD; FD和输出端子，每个像素组包括一个或多个像素，所述端子能够分别输出噪声信号和信号噪声和信号; 端子共同连接的第一线，并且能够基于从端子输出的信号保持电压; 第二线与第一线平行设置并能够保持电压; 连接第二线和第一线的转移间电容元件; 复位开关将每个第二行复位为复位电压; 为每个第二线提供读出开关; 以及分别通过读出开关将第二线路并联连接的第三线路。

公开(公告)号：US20220173145A1

公开(公告)日：2022-06-02

申请号：US17674250

申请日：2022-02-17

Applicant: OLYMPUS CORPORATION

Inventor： Satoru Adachi

IPC: H01L27/146 ,  H04N9/04 ,  H04N5/3745 ,  H04N5/225

Abstract: An image sensor includes: a plurality of pixels; a color filter including a plurality of filter units, each filter unit including at least one of a blue filter and a red filter, a green filter, and two or more of special filters; and an imaging controller configured to in a normal observation mode, sequentially output electrical signals generated by the plurality of pixels, and in a special observation mode, sequentially output an additive signal in which electrical signals generated by the plurality of pixels on which at least the two or more of special filters are arranged are added for each of the filter units.

公开(公告)号：US10542226B2

公开(公告)日：2020-01-21

申请号：US16152629

申请日：2018-10-05

Applicant: OLYMPUS CORPORATION

Inventor： Takanori Tanaka ,  Masashi Saito ,  Takatoshi Igarashi ,  Satoru Adachi ,  Katsumi Hosogai ,  Nana Akahane

IPC: H04N5/345 ,  H04N5/369 ,  H04N5/378 ,  A61B1/00 ,  A61B1/045 ,  A61B1/05 ,  H01L27/146 ,  H04N5/376

Abstract: An imaging element includes: a pixel chip where a pixel unit and a vertical selecting unit are arranged, the pixel unit including plural pixels that are arranged in a two-dimensional matrix, the pixels being configured to generate and output imaging signals; a transmission chip where at least a power source unit and a transmission unit are arranged; plural capacitative chips, each capacitative chip having capacitance functioning as a bypass condenser for a power source in the power source unit; and plural connecting portions configured to electrically connect the pixel chip, the transmission chip, and the capacitative chip respectively to another chip. The transmission chip is layered and connected at a back surface side of the pixel chip. The capacitative chips are layered and connected at a back surface side of the transmission chip. The connecting portions are arranged so as to overlap one another.

公开(公告)号：US10456022B2

公开(公告)日：2019-10-29

申请号：US15939740

申请日：2018-03-29

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Makoto Ono ,  Masashi Saito ,  Satoru Adachi ,  Nana Akahane ,  Takanori Tanaka ,  Katsumi Hosogai

IPC: A61B1/05 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01L27/14 ,  H01L27/146 ,  H04N5/378 ,  A61B1/00 ,  A61B1/045 ,  A61B1/06 ,  H01L21/66 ,  H04N5/345 ,  H04N5/376 ,  H04N7/10 ,  H04N5/225 ,  H04N5/232 ,  H04N5/369

Abstract: An imaging device includes: a first chip including a light receiving unit, and a read circuit; a second chip including a timing control circuit, an A/D conversion circuit, and a cable transmission circuit; and a connection unit configured to connect the first and the second chips. The read circuit includes a column read circuit and a horizontal selection circuit, and a vertical selection circuit. The connection unit of the first chip is provided in a first area along a side of the rectangular light receiving unit, and in a second area adjacent to the column read circuit, the horizontal selection circuit, and the vertical selection circuit. The connection unit of the second chip is provided in a third area around the timing control circuit, the A/D conversion circuit, and the cable transmission circuit and in a fourth area adjacent to the timing control circuit and the A/D conversion circuit.

公开(公告)号：US10441149B2

公开(公告)日：2019-10-15

申请号：US15940008

申请日：2018-03-29

Applicant: OLYMPUS CORPORATION

Inventor： Satoru Adachi

IPC: A61B1/06 ,  H04N7/18 ,  A61B1/045 ,  A61B1/05 ,  H04N5/353 ,  H04N9/04 ,  H04N9/07 ,  H04N5/232 ,  H04N5/355 ,  H04N5/357 ,  A61B1/00 ,  A61B1/07 ,  H04N5/225

Abstract: An imaging device includes: plural pixels; a color filter including a blue filter having spectral characteristics where a maximum value of its transmission spectrum is in the blue wavelength band and transmittance of the wavelength band of a narrow band light is higher than the transmission spectrum in the red and green wavelength bands, a red and green filters having spectral characteristics where minimum values of their transmission spectra are near the maximum value of the transmission spectrum of the blue wavelength band, and having spectral characteristics where their transmission spectra gradually increase toward a short wavelength side from 440 nm; and a control unit configured to execute control of making an accumulation time of a pixel of the plural pixels shorter than accumulation times of pixels having other filters arranged thereon, the pixel having highest spectral sensitivity to the narrow band light.

公开(公告)号：US10153311B2

公开(公告)日：2018-12-11

申请号：US15668807

申请日：2017-08-04

Applicant: OLYMPUS CORPORATION

Inventor： Satoru Adachi ,  Nana Akahane ,  Noriyuki Fujimori

IPC: H01L27/14 ,  H01L27/146 ,  A61B1/04 ,  G02B23/24 ,  G02B23/26 ,  H04N5/369 ,  A61B1/05 ,  H01L29/94 ,  H04N5/363 ,  H04N5/378

Abstract: An image sensor includes: a pixel chip provided with a plurality of pixels, a plurality of first transfer lines, and a plurality of capacitors; a circuit chip provided with a plurality of column reading circuits, a plurality of column scanning circuits, a second transfer line, and a constant current source; and a connection portion stacked and provided between the pixel chip and the circuit chip and configured to connect a capacitor, which is arranged in the pixel chip and has a trench structure, and a first transistor arranged in the circuit chip to each other via an electrode. The capacitor is configured to form a transfer capacity removing a noise included in an imaging signal and connect the pixel chip and the circuit chip to each other via the electrode and the connection portion.