公开(公告)号：US20160229690A1

公开(公告)日：2016-08-11

申请号：US15132965

申请日：2016-04-19

Applicant: ROHM CO., LTD.

Inventor： Yuichi NAKAO ,  Yasuhiro FUWA

IPC: B81B7/00

CPC classification number: B81B7/0074 ,  B81B2201/0235 ,  B81B2203/0315 ,  H01L23/13 ,  H01L23/147 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49579 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/157 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate that is made of a semiconductor material and has a main surface formed with a recess. The semiconductor device also includes a wiring layer formed on the substrate, an electronic element housed in the recess, and a sealing resin covering at least a part of the electronic element.

Abstract translation: 半导体器件包括由半导体材料制成并具有形成有凹部的主表面的衬底。 半导体器件还包括形成在基板上的布线层，容纳在凹部中的电子元件以及覆盖电子元件的至少一部分的密封树脂。