公开(公告)号：US20230063886A1

公开(公告)日：2023-03-02

申请号：US17844395

申请日：2022-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun Jo ,  Youngdeuk Kim ,  Jaechoon Kim ,  Taehwan Kim ,  Kyungsuk Oh

IPC: H01L25/065 ,  H01L23/00

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip stacked on the first semiconductor chip, and a plurality of third semiconductor chips sequentially stacked on the second semiconductor chip, in which a horizontal width of each of the first semiconductor chip and the second semiconductor chip is greater than a horizontal width of each of the plurality of third semiconductor chips, and the first semiconductor chip and the second semiconductor chip are connected to each other through direct contact of a bonding pad.