公开(公告)号：US12294333B2

公开(公告)日：2025-05-06

申请号：US18427294

申请日：2024-01-30

Applicant: SEIKO EPSON CORPORATION

Inventor： Ryuta Nishizawa ,  Junichi Takeuchi

IPC: H03B5/04 ,  H03B5/12 ,  H03B5/32 ,  H03H9/05 ,  H03H9/19

Abstract: A vibrator device includes: a base having an integrated circuit disposed at a second surface; a vibration element; and a lid having an end surface of a side wall bonded to a first surface of the base at a bonding portion. The integrated circuit includes a first circuit and a second circuit, the first circuit includes a plurality of first circuit elements disposed in a first region ARA, and the second circuit includes a second circuit element disposed in a second region ARB. At this time, the following relations are established. { 1 - L ⁢ 1 ⁢ A / WX } ≤ 0.95 ⁢ { 1 - L ⁢ 2 ⁢ A / WX } ≤ 0.95 ⁢ { 1 - L ⁢ 3 ⁢ A / WY } ≤ 0.95 ⁢ { 1 - L ⁢ 4 ⁢ A / WY } ≤ 0.95 ⁢ { 1 - L ⁢ 1 ⁢ B / WX } ≤ 0.8 ⁢ { 1 - L ⁢ 2 ⁢ B / WX } ≤ 0.8 ⁢ { 1 - L ⁢ 3 ⁢ B / WY } ≤ 0.8 ⁢ { 1 - L ⁢ 4 ⁢ B / WY } ≤ 0.8

公开(公告)号：US12009801B2

公开(公告)日：2024-06-11

申请号：US17456237

申请日：2021-11-23

Applicant: Seiko Epson Corporation

Inventor： Junichi Takeuchi ,  Tomoyuki Kamakura ,  Ryuta Nishizawa ,  Yukihiro Hashi

IPC: H03H9/09 ,  H03H9/05 ,  H03H9/125

CPC classification number: H03H9/09 ,  H03H9/0514 ,  H03H9/125

Abstract: A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.

公开(公告)号：US11292341B2

公开(公告)日：2022-04-05

申请号：US16857310

申请日：2020-04-24

Applicant: Seiko Epson Corporation

Inventor： Junichi Takeuchi ,  Akira Mizuguchi ,  Akihiko Ebina ,  Takashi Yamazaki

IPC: B60K35/00 ,  G10K9/12

Abstract: A vibration device includes a base substrate made of silicon and having a first surface and a second surface facing away from the first surface, a lid bonded to the base substrate, a vibrator disposed at the first surface of the base substrate and accommodated in a space between the base substrate and the lid, and a thermistor element disposed at the base substrate.

公开(公告)号：US11245357B2

公开(公告)日：2022-02-08

申请号：US17081268

申请日：2020-10-27

Applicant: SEIKO EPSON CORPORATION

Inventor： Junichi Takeuchi

IPC: H03B5/04 ,  H01L23/34 ,  H03B5/36 ,  H03H9/10 ,  H03H9/02 ,  H03H9/05 ,  H03H9/08

Abstract: A vibration device has a substrate including a first surface and a second surface located on an opposite side to the first surface, a heater provided on the first surface side of the substrate, a temperature sensor provided on the first surface side of the substrate, a vibration element disposed on the first surface side of the substrate, a lid including a third surface joined on the first surface side and a fourth surface located on an opposite side to the third surface, and a circuit provided on one of the first surface, the second surface and the fourth surface, and including a temperature control circuit configured to control the heater based on an output of the temperature sensor.

公开(公告)号：US09631992B2

公开(公告)日：2017-04-25

申请号：US14639231

申请日：2015-03-05

Applicant: Seiko Epson Corporation

Inventor： Junichi Takeuchi ,  Takuya Kinugawa

IPC: G01L9/00

CPC classification number: G01L9/0054 ,  G01L9/0052 ,  G01L9/0055

Abstract: A physical quantity sensor includes a plurality of diaphragm portions which are bent and deformed due to pressure reception, and a plurality of piezoresistive elements which are disposed in the diaphragm portions at different locations from each other and are electrically connected to each other in series. The plurality of piezoresistive elements constitute a bridge circuit.