公开(公告)号：US20210301130A1

公开(公告)日：2021-09-30

申请号：US17160011

申请日：2021-01-27

Applicant: Shengyi Technology Co., Ltd.

Inventor： Jianying SHI ,  Weifeng YIN ,  Yongjing XU ,  Shanyin YAN

IPC: C08L71/12 ,  C09J171/12 ,  C09J147/00 ,  C08L47/00 ,  C09D171/12 ,  C09D147/00 ,  B32B7/12 ,  B32B15/085 ,  B32B15/14 ,  B32B15/20

Abstract: The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

公开(公告)号：US20170298218A1

公开(公告)日：2017-10-19

申请号：US15318787

申请日：2016-09-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui LI ,  Kehong FANG ,  Yongjing XU

IPC: C08L63/00 ,  C08G59/50 ,  C08G59/62 ,  C08J5/04 ,  C08G59/42 ,  H01B3/40 ,  C08L63/08 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/04 ,  B32B15/06 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B25/02 ,  B32B25/042 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/281 ,  B32B27/285 ,  B32B27/302 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2250/05 ,  B32B2255/02 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/0214 ,  B32B2264/0257 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2264/12 ,  B32B2270/00 ,  B32B2307/204 ,  B32B2307/21 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/4026 ,  B32B2307/724 ,  B32B2307/748 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/40 ,  C08G59/42 ,  C08G59/4238 ,  C08G59/4284 ,  C08G59/5046 ,  C08G59/621 ,  C08G73/0233 ,  C08G73/06 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/08 ,  C08K3/01 ,  C08K5/0025 ,  C08K13/02 ,  C08L35/06 ,  C08L61/34 ,  C08L63/08 ,  C08L79/04 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/05 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0242

Abstract: The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

公开(公告)号：US20170238417A1

公开(公告)日：2017-08-17

申请号：US15316380

申请日：2015-12-07

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Shanyin YAN ,  Yongjing XU ,  Zhongqiang YANG ,  Yongming ZHU

IPC: H05K1/03 ,  C09D171/12 ,  D06M15/53 ,  H05K3/38 ,  D06M23/10 ,  D06M11/46 ,  D06M11/45 ,  D06M11/44 ,  C09D109/00 ,  D06M15/233

CPC classification number: H05K1/0306 ,  C03C25/1095 ,  C03C25/47 ,  C08K3/22 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2241 ,  C09D109/00 ,  C09D171/12 ,  D06M11/44 ,  D06M11/45 ,  D06M11/46 ,  D06M15/233 ,  D06M15/53 ,  D06M23/10 ,  D06M2101/00 ,  H05K1/024 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/381

Abstract: The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.