Patent search ap:("STATS ChipPAC Page Ltd.") AND inv:"HeeJo Chi"

21.

发明申请
Semiconductor Device and Method of Forming Conductive Posts and Heat Sink Over Semiconductor Die Using Leadframe 有权
Title translation: 使用引线框形成半导体管芯的导电柱和散热片的半导体器件和方法

公开(公告)号：US20130105970A1

公开(公告)日：2013-05-02

申请号：US13683946

申请日：2012-11-21

Applicant: STATS ChipPAC, Ltd.

Inventor： HeeJo Chi , NamJu Cho , HanGil Shin

IPC: H01L23/498 , H01L23/34 , H01L21/56

CPC classification number: H01L23/49816 , H01L21/4832 , H01L21/56 , H01L21/561 , H01L23/3128 , H01L23/34 , H01L23/367 , H01L23/4334 , H01L23/49524 , H01L23/49827 , H01L23/5389 , H01L24/16 , H01L24/18 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/04105 , H01L2224/05001 , H01L2224/05008 , H01L2224/05026 , H01L2224/05548 , H01L2224/05569 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/24227 , H01L2224/29099 , H01L2224/29186 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2224/82 , H01L2224/81 , H01L2224/83 , H01L2924/05432 , H01L2924/00014 , H01L2924/0542 , H01L2924/0503 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05111 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155

Abstract: A semiconductor device has a prefabricated multi-die leadframe with a base and integrated raised die paddle and a plurality of bodies extending from the base. A thermal interface layer is formed over a back surface of a semiconductor die or top surface of the raised die paddle. The semiconductor die is mounted over the raised die paddle between the bodies of the leadframe with the TIM disposed between the die and raised die paddle. An encapsulant is deposited over the leadframe and semiconductor die. Vias can be formed in the encapsulant. An interconnect structure is formed over the leadframe, semiconductor die, and encapsulant, including into the vias. The base is removed to separate the bodies from the raised die paddle. The raised die paddle provides heat dissipation for the semiconductor die. The bodies are electrically connected to the interconnect structure. The bodies operate as conductive posts for electrical interconnect.

Abstract translation: 半导体器件具有预制的多管芯引线框架，其具有基底和集成凸起的裸片焊盘以及从基部延伸的多个主体。热界面层形成在半导体管芯的背表面或凸起的管芯焊盘的顶表面上。半导体管芯安装在引线框架的主体之间的凸起的模板上，并且TIM设置在模具和凸起的模板之间。封装剂沉积在引线框架和半导体管芯上。可以在密封剂中形成通孔。在引线框架，半导体管芯和密封剂之上形成互连结构，包括到通孔中。移除基座以将体与凸起模片分离。凸起的芯片为半导体管芯提供散热。主体电连接到互连结构。主体用作电气互连的导电柱。

22.

发明申请
Semiconductor Device and Method of Forming Prefabricated Multi-Die Leadframe for Electrical Interconnect of Stacked Semiconductor Die 有权
Title translation: 半导体器件和堆叠半导体芯片电互连的预制多芯片引线框的形成方法

公开(公告)号：US20130087898A1

公开(公告)日：2013-04-11

申请号：US13691464

申请日：2012-11-30

Applicant: STATS ChipPAC, Ltd.

Inventor： HeeJo Chi , YeongIm Park , HyungMin Lee

IPC: H01L21/768 , H01L23/495

CPC classification number: H01L21/76802 , H01L21/4832 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/295 , H01L23/3107 , H01L23/3128 , H01L23/49517 , H01L23/49527 , H01L23/49537 , H01L23/49541 , H01L23/49575 , H01L23/49816 , H01L23/5389 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0657 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386 , H01L2224/02379 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05548 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/13024 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16245 , H01L2224/21 , H01L2224/2105 , H01L2224/215 , H01L2224/22 , H01L2224/221 , H01L2224/29144 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48175 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/8385 , H01L2224/95001 , H01L2224/97 , H01L2225/06517 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H05K1/185 , H05K3/4682 , H01L2224/82 , H01L2924/01014 , H01L2924/0665 , H01L2924/0105 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/81805 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

Abstract: A prefabricated multi-die leadframe having a plurality of contact pads is mounted over a temporary carrier. A first semiconductor die is mounted over the carrier between the contact pads of the leadframe. A second semiconductor die is mounted over the contact pads of the leadframe and over the first die. An encapsulant is deposited over the leadframe and first and second die. The carrier is removed. A first interconnect structure is formed over the leadframe and the first die and a first surface of the encapsulant. A channel is cut through the encapsulant and leadframe to separate the contact pads. A plurality of conductive vias can be formed through the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive vias.

Abstract translation: 具有多个接触垫的预制多芯片引线框安装在临时载体上。第一半导体管芯安装在引线框的接触焊盘之间的载体上。第二半导体管芯安装在引线框架的接触焊盘上并且在第一管芯上方。密封剂沉积在引线框架和第一和第二裸片上。载体被移除。第一互连结构形成在引线框架和第一管芯以及密封剂的第一表面上。通过密封剂和引线框架切割通道以分离接触垫。可以通过密封剂形成多个导电通孔。第二互连结构形成在密封剂的与密封剂的第一表面相对的第二表面上。第二互连结构电连接到导电通孔。

23.

发明授权
Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die 有权

公开(公告)号：US09966335B2

公开(公告)日：2018-05-08

申请号：US14596080

申请日：2015-01-13

Applicant: STATS ChipPAC, Ltd.

Inventor： NamJu Cho , HeeJo Chi , HanGil Shin

IPC: H01L23/50 , H01L21/56 , H01L21/683 , H01L23/13 , H01L23/498 , H01L25/065 , H01L23/12 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/00 , H05K3/00

CPC classification number: H01L23/50 , H01L21/56 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/12 , H01L23/13 , H01L23/28 , H01L23/295 , H01L23/3107 , H01L23/3128 , H01L23/498 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06131 , H01L2224/06135 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/21 , H01L2224/2105 , H01L2224/215 , H01L2224/22 , H01L2224/221 , H01L2224/29144 , H01L2224/2919 , H01L2224/32013 , H01L2224/32059 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48101 , H01L2224/48105 , H01L2224/48145 , H01L2224/48157 , H01L2224/48175 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/49 , H01L2224/73215 , H01L2224/73227 , H01L2224/73265 , H01L2224/73267 , H01L2224/85005 , H01L2224/85447 , H01L2224/92163 , H01L2224/92164 , H01L2224/95001 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06568 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/146 , H01L2924/15311 , H01L2924/171 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H05K3/0052 , H01L2924/01014 , H01L2924/0665 , H01L2924/0105 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/81805 , H01L2224/85

Abstract: A semiconductor device has an interposer frame mounted over a carrier. A semiconductor die has an active surface and bumps formed over the active surface. The semiconductor die can be mounted within a die opening of the interposer frame or over the interposer frame. Stacked semiconductor die can also be mounted within the die opening of the interposer frame or over the interposer frame. Bond wires or bumps are formed between the semiconductor die and interposer frame. An encapsulant is deposited over the interposer frame and semiconductor die. An interconnect structure is formed over the encapsulant and bumps of the first semiconductor die. An electronic component, such as a discrete passive device, semiconductor die, or stacked semiconductor die, is mounted over the semiconductor die and interposer frame. The electronic component has an I/O count less than an I/O count of the semiconductor die.

24.

发明授权
Methods of forming conductive jumper traces 有权
Title translation: 形成导电跳线迹线的方法

公开(公告)号：US09508635B2

公开(公告)日：2016-11-29

申请号：US13929775

申请日：2013-06-27

Applicant: STATS ChipPAC, Ltd.

Inventor： HanGil Shin , HeeJo Chi , NamJu Cho

IPC: H01L21/00 , H01L23/498 , H01L21/48 , H05K3/46 , H01L23/00 , H01L21/56 , H05K1/09 , H05K3/12

CPC classification number: H01L23/49838 , H01L21/4867 , H01L21/561 , H01L23/49894 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/2919 , H01L2224/32225 , H01L2224/48229 , H01L2224/4917 , H01L2224/49173 , H01L2224/49176 , H01L2224/49179 , H01L2224/73265 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/13091 , H01L2924/181 , H05K1/092 , H05K3/125 , H05K3/1283 , H05K3/4685 , H05K2201/026 , H05K2201/0323 , H05K2203/095 , H05K2203/1194 , H01L2924/00 , H01L2224/45099 , H01L2924/00015 , H01L2924/0665 , H01L2924/00012

Abstract: Methods of forming conductive jumper traces for semiconductor devices and packages. Substrate is provided having first, second and third trace lines formed thereon, where the first trace line is between the second and third trace lines. The first trace line can be isolated with a covering layer. A conductive layer can be formed between the second and third trace lines and over the first trace line by a depositing process followed by a heating process to alter the chemical properties of the conductive layer. The resulting conductive layer is able to conform to the covering layer and serve to provide electrical connection between the second and third trace lines.

Abstract translation: 形成用于半导体器件和封装的导电跳线迹线的方法。衬底具有形成在其上的第一，第二和第三迹线，其中第一迹线位于第二和第三迹线之间。第一条痕迹线可以用覆盖层隔离。可以通过沉积工艺在第二和第三迹线之间和第一迹线上形成导电层，随后进行加热处理以改变导电层的化学性质。所得到的导电层能够符合覆盖层并且用于在第二和第三迹线之间提供电连接。

25.

发明申请
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package 审中-公开

公开(公告)号：US20160233168A1

公开(公告)日：2016-08-11

申请号：US15130452

申请日：2016-04-15

Applicant: STATS ChipPAC, Ltd.

Inventor： HeeJo Chi , HanGil Shin , NamJu Cho

IPC: H01L23/538

CPC classification number: H01L24/19 , H01L21/4853 , H01L21/486 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/768 , H01L23/49816 , H01L23/49827 , H01L23/528 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/73 , H01L24/94 , H01L24/96 , H01L24/97 , H01L2221/6834 , H01L2221/68345 , H01L2221/68359 , H01L2221/68386 , H01L2224/0401 , H01L2224/04105 , H01L2224/06181 , H01L2224/08146 , H01L2224/08235 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/19 , H01L2224/24227 , H01L2224/25171 , H01L2224/82039 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2924/10252 , H01L2924/10253 , H01L2924/10272 , H01L2924/10322 , H01L2924/10324 , H01L2924/10329 , H01L2924/1033 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/153 , H01L2924/181 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3511 , H01L2924/00 , H01L2224/03 , H01L2224/82 , H01L2224/08

Abstract: A semiconductor device has a plurality of semiconductor die. A substrate is provided with bumps disposed over the substrate. A first prefabricated insulating film is disposed between the semiconductor die and substrate. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The bumps include a copper core encapsulated within copper plating. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The substrate includes a conductive layer formed in the substrate and coupled to the bumps. The semiconductor die is disposed between the bumps of the substrate. The bumps and the semiconductor die are embedded within the first prefabricated insulating film. A portion of the first prefabricated insulating film is removed to expose the bumps. The bumps electrically connect the substrate to the interconnect structure.

26.

发明申请
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form 审中-公开
Title translation: 半导体器件和将半导体晶片结合到重构晶片形式的衬底的方法

公开(公告)号：US20160163675A1

公开(公告)日：2016-06-09

申请号：US15012346

申请日：2016-02-01

Applicant: STATS ChipPAC, Ltd.

Inventor： KyungMoon Kim , KooHong Lee , JaeHak Yee , YoungChul Kim , Lan Hoang , Pandi C. Marimuthu , Steve Anderson , HunTeak Lee , HeeJo Chi

IPC: H01L23/00 , H01L21/78 , H01L23/31 , H01L21/56

CPC classification number: H01L24/97 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/78 , H01L23/3128 , H01L23/3142 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11002 , H01L2224/1134 , H01L2224/13023 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/73204 , H01L2224/7598 , H01L2224/81005 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/83102 , H01L2224/83192 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2224/81 , H01L2924/00 , H01L2224/11 , H01L2924/00014 , H01L2924/0665 , H01L2924/00012

Abstract: A semiconductor device has a plurality of semiconductor die disposed over a carrier. An electrical interconnect, such as a stud bump, is formed over the semiconductor die. The stud bumps are trimmed to a uniform height. A substrate includes a bump over the substrate. The electrical interconnect of the semiconductor die is bonded to the bumps of the substrate while the semiconductor die is disposed over the carrier. An underfill material is deposited between the semiconductor die and substrate. Alternatively, an encapsulant is deposited over the semiconductor die and substrate using a chase mold. The bonding of stud bumps of the semiconductor die to bumps of the substrate is performed using gang reflow or thermocompression while the semiconductor die are in reconstituted wafer form and attached to the carrier to provide a high throughput of the flipchip type interconnect to the substrate.

Abstract translation: 半导体器件具有设置在载体上的多个半导体管芯。在半导体管芯上方形成诸如柱形凸块的电互连。螺柱凸块被修剪成均匀的高度。衬底包括在衬底上的凸块。将半导体管芯的电气互连结合到衬底的凸块上，同时将半导体管芯设置在载体上。在半导体管芯和衬底之间沉积底部填充材料。或者，使用追逐模具在半导体管芯和衬底上沉积密封剂。半导体管芯的凸起凸块与衬底的凸起的接合是使用回流焊或热压而进行的，同时半导体管芯是重新构成的晶片形式并且附着到载体上，以提供与衬底的倒装芯片型互连的高通量。

27.

发明申请
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package 有权
Title translation: 半导体器件和形成3D双面嵌入式嵌入式半导体封装的方法

公开(公告)号：US20150270237A1

公开(公告)日：2015-09-24

申请号：US14220336

申请日：2014-03-20

Applicant: STATS ChipPAC, Ltd.

Inventor： HeeJo Chi , HanGil Shin , NamJu Cho

IPC: H01L23/00 , H01L21/768 , H01L25/065 , H01L23/528 , H01L25/00

CPC classification number: H01L24/19 , H01L21/4853 , H01L21/486 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/768 , H01L23/49816 , H01L23/49827 , H01L23/528 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/73 , H01L24/94 , H01L24/96 , H01L24/97 , H01L2221/6834 , H01L2221/68345 , H01L2221/68359 , H01L2221/68386 , H01L2224/0401 , H01L2224/04105 , H01L2224/06181 , H01L2224/08146 , H01L2224/08235 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/19 , H01L2224/24227 , H01L2224/25171 , H01L2224/82039 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2924/10252 , H01L2924/10253 , H01L2924/10272 , H01L2924/10322 , H01L2924/10324 , H01L2924/10329 , H01L2924/1033 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/153 , H01L2924/181 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3511 , H01L2924/00 , H01L2224/03 , H01L2224/82 , H01L2224/08

Abstract: A semiconductor device has a plurality of semiconductor die. A substrate is provided with bumps disposed over the substrate. A first prefabricated insulating film is disposed between the semiconductor die and substrate. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The bumps include a copper core encapsulated within copper plating. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The substrate includes a conductive layer formed in the substrate and coupled to the bumps. The semiconductor die is disposed between the bumps of the substrate. The bumps and the semiconductor die are embedded within the first prefabricated insulating film. A portion of the first prefabricated insulating film is removed to expose the bumps. The bumps electrically connect the substrate to the interconnect structure.

Abstract translation: 半导体器件具有多个半导体管芯。衬底设置有设置在衬底上的凸起。第一预制绝缘膜设置在半导体管芯和衬底之间。在半导体管芯和第一预制绝缘膜上形成互连结构。凸块包括封装在镀铜中的铜芯。第一预制绝缘膜包括玻璃布，玻璃纤维或玻璃填料。衬底包括形成在衬底中并耦合到凸块的导电层。半导体管芯设置在衬底的凸块之间。凸块和半导体管芯嵌入在第一预制绝缘膜内。去除第一预制绝缘膜的一部分以暴露凸块。凸块将基板电连接到互连结构。

28.

发明授权
Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe 有权
Title translation: 使用引线框形成半导体管芯上的导电柱和散热片的半导体器件和方法

公开(公告)号：US09064859B2

公开(公告)日：2015-06-23

申请号：US13683946

申请日：2012-11-21

Applicant: STATS ChipPAC, Ltd.

Inventor： HeeJo Chi , NamJu Cho , HanGil Shin

IPC: H01L23/28 , H01L21/58 , H01L23/498 , H01L21/48 , H01L21/56 , H01L23/433 , H01L23/495 , H01L23/538 , H01L23/34 , H01L23/31 , H01L23/367 , H01L23/00 , H01L25/10

CPC classification number: H01L23/49816 , H01L21/4832 , H01L21/56 , H01L21/561 , H01L23/3128 , H01L23/34 , H01L23/367 , H01L23/4334 , H01L23/49524 , H01L23/49827 , H01L23/5389 , H01L24/16 , H01L24/18 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/04105 , H01L2224/05001 , H01L2224/05008 , H01L2224/05026 , H01L2224/05548 , H01L2224/05569 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/24227 , H01L2224/29099 , H01L2224/29186 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2224/82 , H01L2224/81 , H01L2224/83 , H01L2924/05432 , H01L2924/00014 , H01L2924/0542 , H01L2924/0503 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05111 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155

Abstract: A semiconductor device has a prefabricated multi-die leadframe with a base and integrated raised die paddle and a plurality of bodies extending from the base. A thermal interface layer is formed over a back surface of a semiconductor die or top surface of the raised die paddle. The semiconductor die is mounted over the raised die paddle between the bodies of the leadframe with the TIM disposed between the die and raised die paddle. An encapsulant is deposited over the leadframe and semiconductor die. Vias can be formed in the encapsulant. An interconnect structure is formed over the leadframe, semiconductor die, and encapsulant, including into the vias. The base is removed to separate the bodies from the raised die paddle. The raised die paddle provides heat dissipation for the semiconductor die. The bodies are electrically connected to the interconnect structure. The bodies operate as conductive posts for electrical interconnect.

Abstract translation: 半导体器件具有预制的多管芯引线框架，其具有基底和集成凸起的裸片焊盘以及从基部延伸的多个主体。热界面层形成在半导体管芯的背表面或凸起的管芯焊盘的顶表面上。半导体管芯安装在引线框架的主体之间的凸起的模板上，并且TIM设置在模具和凸起的模板之间。封装剂沉积在引线框架和半导体管芯上。可以在密封剂中形成通孔。在引线框架，半导体管芯和密封剂之上形成互连结构，包括到通孔中。移除基座以将体与凸起模片分离。凸起的芯片为半导体管芯提供散热。主体电连接到互连结构。主体用作电气互连的导电柱。