公开(公告)号：US20180226392A1

公开(公告)日：2018-08-09

申请号：US15793653

申请日：2017-10-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Moon LEE ,  Sung Jin PARK ,  Hyeok Jung KWON ,  Ha Yoon SONG ,  Sung Ryong MA

IPC: H01L27/02 ,  H01L23/60 ,  H01F17/00 ,  H03H7/42 ,  H01F27/28 ,  H02H9/04

CPC classification number: H01L27/0248 ,  H01F17/0013 ,  H01F27/28 ,  H01F27/362 ,  H01F2017/0066 ,  H01F2017/0093 ,  H01L23/60 ,  H02H9/04 ,  H03H7/427

Abstract: A common mode filter includes a filter portion and an electrostatic protection portion disposed on the filter portion. The electrostatic protection portion includes first and second discharge electrodes spaced apart from each other, a discharge layer disposed between the first and second discharge electrodes, and a first insulating layer cover an upper surface of the discharge layer and including flat first insulating particles and spherical second insulating particles.

公开(公告)号：US20160218691A1

公开(公告)日：2016-07-28

申请号：US14931828

申请日：2015-11-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Wook PARK ,  Kwang Mo KIM ,  Sang Moon LEE

IPC: H03H7/01 ,  H01F41/04 ,  H01F27/28

CPC classification number: H01F41/041 ,  H01F27/022 ,  H01F27/255 ,  H01F27/2804 ,  H01F2027/2809 ,  H03H1/0007 ,  H03H7/00 ,  H03H7/427 ,  H03H2001/0092

Abstract: A common mode filter includes a substrate; an insulating layer disposed on the substrate and including coil patterns, the insulating layer having a cavity disposed in a central portion therein; and a magnetic particle-resin composite layer including a core part filling the cavity and a cover part covering the insulating layer. The core part contains fine magnetic particles having an average particle diameter of 30 μm or less, and the cover part contains the fine magnetic particles having the average particle diameter of 30 μm or less and coarse magnetic particles having an average particle diameter greater than that of the fine magnetic particles.

Abstract translation: 共模滤波器包括基板; 绝缘层，设置在所述基板上并且包括线圈图案，所述绝缘层具有设置在其中的中心部分中的空腔; 以及包含填充空腔的芯部和覆盖绝缘层的覆盖部的磁性粒子 - 树脂复合层。 核心部分包含平均粒径为30μm以下的微细磁性粒子，盖部包含平均粒径为30μm以下的微细粒子，平均粒径大于 精细的磁性颗粒。

公开(公告)号：US20130112651A1

公开(公告)日：2013-05-09

申请号：US13670991

申请日：2012-11-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Moon LEE ,  Sung Kwon WI ,  Jeong Bok KWAK ,  Young Seuck YOO ,  Yong Suk KIM

IPC: H01F41/04

CPC classification number: H01F41/04 ,  H01F41/046

Abstract: The present invention discloses a method for manufacturing coil parts including a ferrite substrate, a conductor line formed on the ferrite substrate, and an external electrode for external electrical connection of the conductor line, including: coating a magnetic layer to cover the external electrode; planarizing a surface of the magnetic layer by mechanical polishing so that a portion of the magnetic layer remains on the external electrode; and exposing the external electrode by removing the remaining magnetic layer by chemical polishing.According to the present invention, it is possible to reduce planarization process time and cost by simplifying a process of planarizing the magnetic layer and improve productivity and reliability of products by preventing stress and damage to the external electrode occurred in the planarization process.

Abstract translation: 本发明公开了一种线圈部件的制造方法，其特征在于，包括：铁氧体基板，形成在所述铁氧体基板上的导体线和所述导线的外部电连接用的外部电极，包括：涂覆磁性层以覆盖所述外部电极; 通过机械抛光使磁性层的表面平坦化，使得一部分磁性层保留在外部电极上; 并通过化学抛光除去剩余的磁性层来暴露外部电极。 根据本发明，通过简化平面化磁性层的处理并且通过防止在平坦化处理中发生的外部电极的应力和损坏来提高产品的生产率和可靠性，可以减少平坦化处理时间和成本。

公开(公告)号：US20190148076A1

公开(公告)日：2019-05-16

申请号：US16248081

申请日：2019-01-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Jin CHUN ,  Hye Jin JEONG ,  Chung Yeol LEE ,  Sang Moon LEE ,  Hye Young CHOI ,  Myung Jun PARK ,  Young Sook LEE

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01G4/008 ,  H01G4/012

Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.

公开(公告)号：US20170154729A1

公开(公告)日：2017-06-01

申请号：US15298619

申请日：2016-10-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Moon LEE ,  Myung Jun PARK ,  Hye Jin JEONG ,  Chung Yeol LEE ,  Young Sook LEE ,  Jae Yeol CHOI ,  Hye Young CHOI ,  Byoung Jin CHUN

IPC: H01G4/012 ,  H01G4/008 ,  H01G4/248 ,  H01G4/30

CPC classification number: H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H01G13/006

Abstract: A capacitor includes a capacitor body having upper and lower surfaces and end surfaces connecting the upper and lower surfaces; and an external electrode disposed on a surface of the capacitor body and having a first electrode layer, a second electrode layer, and a third electrode layer. The second electrode layer includes metal and resin and is interposed between the first electrode layer and the third electrode layer, and a portion of the second electrode layer covering the end surface of the capacitor body has a thickness less than that of a portion of the first electrode layer covering the end surface of the capacitor body.

公开(公告)号：US20140145814A1

公开(公告)日：2014-05-29

申请号：US14086152

申请日：2013-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Moon LEE ,  Jun Hee BAE ,  Sung Kwon WI ,  Yong Suk KIM

IPC: H01F27/28

CPC classification number: H01F17/0013 ,  H01F2017/0066

Abstract: Disclosed herein is a thin film type chip device including a coil pattern formed on the substrate; a cavity defining pattern defining a cavity through which a part of the coil pattern is exposed; a filling layer filled in the cavity; and a magnetic layer including a surface layer covering a surface of the filling layer.

Abstract translation: 这里公开了一种薄膜型芯片装置，其包括形成在基板上的线圈图案; 限定图案的空腔限定图案，所述线圈图案的一部分通过所述腔暴露; 填充在空腔中的填充层; 以及包括覆盖填充层的表面的表面层的磁性层。

公开(公告)号：US20140145797A1

公开(公告)日：2014-05-29

申请号：US13842789

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jun Hee BAE ,  Sang Moon LEE ,  Sung Kwon WI ,  Yong Suk KIM

IPC: H03H7/01

CPC classification number: H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0093 ,  H03H1/0007 ,  H03H2001/0057 ,  H03H2001/0092 ,  Y10T29/49016

Abstract: Disclosed herein are a common mode noise chip filter and a method for manufacturing the same, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer complex layer formed on the result substrate having the coil patterns formed therein, wherein the ferrite-polymer complex layer has a multilayer structure, so that the ferrite-polymer complex layer filling an inner space of the substrate having inner coil patterns is formed to have the multilayer structure but not a single-layer structure, thereby lowering internal stress, and thus improving reliability of the common mode noise chip filter as a product.

Abstract translation: 这里公开了共模噪声芯片滤波器及其制造方法，该共模噪声芯片滤波器包括：铁氧体基板; 在铁素体基板上形成的线圈图案; 以及形成在其上形成有线圈图案的结果基板上的铁氧体 - 聚合物复合层，其中铁氧体 - 聚合物复合层具有多层结构，使得铁氧体 - 聚合物复合层填充具有内部线圈图案的基板的内部空间 形成为具有多层结构而不是单层结构，从而降低内应力，从而提高作为产品的共模噪声芯片滤波器的可靠性。

公开(公告)号：US20140132366A1

公开(公告)日：2014-05-15

申请号：US14078317

申请日：2013-11-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Suk KIM ,  Sung Kwon WI ,  Hyeog Soo SHIN ,  Sang Moon LEE ,  Young Seuck YOO ,  Sung Jin PARK

IPC: H03H7/01

CPC classification number: H03H7/0138 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0093 ,  H03H1/0007

Abstract: Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.

Abstract translation: 本发明公开了一种过滤芯片元件，包括铁氧体衬底，形成在铁氧体衬底上的内部线圈图案; 以及填充在形成在铁氧体基板上的内部线圈图案之间的铁氧体复合层，其中，所述铁氧体复合层包括发泡树脂，从而提高作为电磁屏蔽部件中的噪声防止用过滤芯片元件的重要特性的磁导率和Q值 。

公开(公告)号：US20130234819A1

公开(公告)日：2013-09-12

申请号：US13766449

申请日：2013-02-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Seuck YOO ,  Sung Kwon WI ,  Jong Yun LEE ,  Sang Moon LEE ,  Won Chul SIM ,  Jeong Bok KWAK ,  Kang Heon HUR ,  Yong Suk KIM

IPC: H01F17/00

CPC classification number: H01F17/0013 ,  H01F2017/0066

Abstract: The present invention relates to a common mode filter and a method of manufacturing the same and provides a thin film type common mode filter including: a first magnetic substrate; a first laminate disposed on the first magnetic substrate and including a primary coil pattern electrode; a core magnetic layer disposed on the first laminate; a second laminate disposed on the core magnetic layer and including a secondary coil pattern electrode; and a second magnetic substrate disposed on the second laminate.

Abstract translation: 共模滤波器及其制造方法技术领域本发明涉及共模滤波器及其制造方法，提供一种薄膜型共模滤波器，包括：第一磁性基板; 第一层压体，设置在第一磁性基板上并且包括初级线圈图案电极; 设置在所述第一层压体上的芯磁性层; 设置在芯磁性层上并包括次级线圈图形电极的第二层压体; 以及设置在所述第二层压体上的第二磁性基板。