公开(公告)号：US11367944B2

公开(公告)日：2022-06-21

申请号：US16861800

申请日：2020-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegyu Kim ,  Kyungbae Ko ,  Un Kim ,  Sanguk Kim ,  Donghwan Kim ,  Yongsub Lee

IPC: H01Q1/24 ,  H05K5/00 ,  H05K5/02 ,  H05K7/14 ,  H05K1/02 ,  H01Q1/50 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q5/20

Abstract: An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.

公开(公告)号：US11115509B2

公开(公告)日：2021-09-07

申请号：US17073766

申请日：2020-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Kim ,  Jinkyu Bang ,  Jinu Kim ,  Donghwan Kim ,  Taegyu Kim ,  Kiyoung Chang

IPC: H04B1/38 ,  H04M1/02 ,  H01Q9/30 ,  H01Q5/385 ,  H01Q1/24

Abstract: An electronic device is provided. The electronic device includes a housing and a connection part. The housing includes a first housing portion that includes a first side face, and a second housing portion that includes a second side face. The connection part connects the first housing portion and the second housing portion. A first conductive member extends along at least a portion of the first side face, a first non-conductive member is disposed on the first side face, a second conductive member extends along at least a portion of the second side face, a second non-conductive member is disposed on the second side face, and when the second housing portion faces the first housing portion, the first non-conductive member and the second non-conductive member are substantially aligned.

公开(公告)号：US20210111325A1

公开(公告)日：2021-04-15

申请号：US17024833

申请日：2020-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myunghee KIM ,  Donghwan Kim ,  Sungwook Kim ,  Yong Namkung ,  Jenghun Suh ,  Jaephil Shim

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00 ,  H01L33/00 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44 ,  H01L33/58

Abstract: A display module and a manufacturing method thereof are provided. The manufacturing method may include forming an epitaxial film comprising a light emitting layer, a first type semiconductor layer, and a second type semiconductor layer, attaching the epitaxial film to an intermediate substrate comprising a conductive material, patterning the epitaxial film to form a light emitting diode (LED) and coupling the LED to a driving circuit layer through the conductive material.

公开(公告)号：US20210013184A1

公开(公告)日：2021-01-14

申请号：US16891242

申请日：2020-06-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ohjae KWON ,  Jinmo Kang ,  Donghwan Kim ,  Yong Namkung ,  Seondeok Hwang

IPC: H01L25/075 ,  H01L25/16

Abstract: A micro light emitting diode (LED) transfer method includes: preparing a transfer substrate including a plurality of micro LEDs, the plurality of micro LEDs having electrodes disposed in a first direction and a second direction different from the first direction on the transfer substrate; sequentially transferring a first set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to first regions of a target substrate; and sequentially transferring a second set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to second regions of the target substrate, and in the sequential transferring of the second set of micro LEDs, the second set of micro LEDs transferred to the second regions are disposed in the same electrode direction as an electrode direction of the first set of micro LEDs transferred to the first regions.

公开(公告)号：US10701194B2

公开(公告)日：2020-06-30

申请号：US16667415

申请日：2019-10-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Kim ,  Jinkyu Bang ,  Jinu Kim ,  Donghwan Kim ,  Taegyu Kim ,  Kiyoung Chang

IPC: H04B1/38 ,  H04M1/02 ,  H01Q1/24 ,  H01Q5/385 ,  H01Q9/30

Abstract: An electronic device is provided. The electronic device includes a housing and a connection part. The housing includes a first housing portion that includes a first side face, and a second housing portion that includes a second side face. The connection part connects the first housing portion and the second housing portion. A first conductive member extends along at least a portion of the first side face, a first non-conductive member is disposed on the first side face, a second conductive member extends along at least a portion of the second side face, a second non-conductive member is disposed on the second side face, and when the second housing portion faces the first housing portion, the first non-conductive member and the second non-conductive member are substantially aligned.

公开(公告)号：US20190007533A1

公开(公告)日：2019-01-03

申请号：US16126534

申请日：2018-09-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung KIM ,  Jinkyu Bang ,  Jinu Kim ,  Donghwan Kim ,  Taegyu Kim ,  Kiyoung Chang

IPC: H04M1/02 ,  H01Q1/24 ,  H01Q9/30 ,  H01Q5/385

Abstract: An electronic device is provided. The electronic device includes a housing and a connection part. The housing includes a first housing portion that includes a first side face, and a second housing portion that includes a second side face. The connection part connects the first housing portion and the second housing portion. A first conductive member extends along at least a portion of the first side face, a first non-conductive member is disposed on the first side face, a second conductive member extends along at least a portion of the second side face, a second non-conductive member is disposed on the second side face, and when the second housing portion faces the first housing portion, the first non-conductive member and the second non-conductive member are substantially aligned.

公开(公告)号：US09831928B2

公开(公告)日：2017-11-28

申请号：US15351142

申请日：2016-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Kim ,  Jae-Ho Lim ,  Hosaeng Kim ,  Jesun Moon ,  Sungyeul Hong ,  Kyung-Jong Lee ,  Jinkyu Bang ,  Hanbin Lee ,  Kyung-Bae Ko ,  Donghwan Kim ,  Taegyu Kim ,  Jae-Bong Chun

IPC: H04B7/0404 ,  H04B1/40 ,  H04M1/02

CPC classification number: H04B7/0404 ,  H01Q1/2266 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/42 ,  H01Q13/10 ,  H04B1/40 ,  H04M1/0216 ,  H04M1/0235 ,  H04M1/026 ,  H04M1/0266 ,  H04M1/0268 ,  H04M2250/16

Abstract: An electronic device is provided. The electronic device includes a first housing a second housing, a first display disposed on the first housing and a second display disposed on the second housing, a connecting member configured to couple the first housing to the second housing such that the first housing and the second housing are foldable relative to each other, and the second surface and the fourth surface face each other when the first housing and the second housing are folded toward each other, a first conductive element disposed within the first housing and between the second surface and the first display, and an intermediate conductive plate disposed within the second housing and between the fourth surface and the second display, the intermediate conductive plate having an opening that faces the first conductive element when the first housing and the second housing are in a folded configuration.

公开(公告)号：US20150179655A1

公开(公告)日：2015-06-25

申请号：US14563695

申请日：2014-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Toshiro Nakanishi ,  Donghwan Kim ,  Suhwan Kim ,  Yubin Kim ,  Jin Soak Kim ,  Gabjin Nam ,  Sungkweon Baek ,  Taehyun An ,  Eunae Chung

IPC: H01L27/11 ,  H01L51/00 ,  H01L51/05 ,  H01L27/28

CPC classification number: H01L27/1104 ,  H01L27/281 ,  H01L27/283 ,  H01L51/0048 ,  H01L51/057 ,  H01L51/0575

Abstract: A static random access memory (SRAM) cell can include a first pull-up transistor, a first pull-down transistor, a second pull-up transistor, a second pull-down transistor, a first access transistor, and a second access transistor, all being coupled together in a 6 transistor SRAM cell, wherein each of the transistors is configured as a vertical channel transistor.

Abstract translation: 静态随机存取存储器（SRAM）单元可以包括第一上拉晶体管，第一下拉晶体管，第二上拉晶体管，第二下拉晶体管，第一存取晶体管和第二存取晶体管， 全部在6晶体管SRAM单元中耦合在一起，其中每个晶体管被配置为垂直沟道晶体管。