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    UNMANNED AERIAL VEHICLE AND METHOD FOR OPERATING SAME, AND AUTOMATED GUIDED VEHICLE FOR CONTROLLING MOVEMENT OF UNMANNED AERIAL VEHICLE
    25.
    发明申请
    UNMANNED AERIAL VEHICLE AND METHOD FOR OPERATING SAME, AND AUTOMATED GUIDED VEHICLE FOR CONTROLLING MOVEMENT OF UNMANNED AERIAL VEHICLE 审中-公开

    公开(公告)号：US20200257295A1

    公开(公告)日：2020-08-13

    申请号：US16760168

    申请日：2018-12-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junho PARK ,  Sunggu KWON ,  Jihoon KIM ,  Kyungshik ROH ,  Minsu LEE

    IPC: G05D1/02 ,  B64D47/08 ,  B64C39/02

    Abstract: Various embodiments of the present invention relate to an unmanned aerial vehicle (UAV) and method for operating the same, and an automated guided vehicle (AGV) for controlling movements of the unmanned aerial vehicle. The unmanned aerial vehicle according to various embodiments of the present invention may comprise: a wireless communication circuit; at least one sensor; a processor operatively connected to the wireless communication circuit and the at least one sensor; and a memory operatively connected to the processor, wherein the memory stores instructions that, when executed, cause the processor to: receive a movement command for a movement with respect to the current location of the unmanned aerial vehicle, from an automated guided vehicle located within a predetermined distance from the unmanned aerial vehicle, by using the wireless communication circuit; acquire location-independent sensing information by using the at least one sensor, while the unmanned aerial vehicle moves according to the movement command; and transmit the location-independent sensing information to the automated guided vehicle so as to allow the automated guided vehicle to determine the location of the unmanned aerial vehicle by using the location-independent sensing information.

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
    28.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20250140723A1

    公开(公告)日：2025-05-01

    申请号：US18671443

    申请日：2024-05-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jihoon KIM ,  Jinkyeong SEOL ,  Raeyoung KANG ,  Minki KIM ,  Hyeonkyu HA

    IPC: H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H10B80/00

    Abstract: A semiconductor package includes a plurality of semiconductor chips bonded to each other through direct bonding, the plurality of semiconductor chips including a first semiconductor chip and a second semiconductor chip. The first semiconductor chip including: a front insulating layer bonded to a back insulating layer of the second semiconductor chip; a front pad surrounded by the front insulating layer; a device layer on a back surface of the front insulating layer and including an interconnection structure electrically connected to the front pad; a conductive pattern between the interconnection structure and the front pad; and a support insulating layer between the device layer and the front insulating layer and surrounding the conductive pattern, wherein a gap is between a first side surface of the support insulating layer and a second side surface of the conductive pattern that faces the first side surface.

    SEMICONDUCTOR MEMORY DEVICE
    29.
    发明公开
    SEMICONDUCTOR MEMORY DEVICE 审中-公开

    公开(公告)号：US20240292598A1

    公开(公告)日：2024-08-29

    申请号：US18530748

    申请日：2023-12-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Suncheul KIM ,  Taeyeon KWON ,  Younjae CHO ,  Jihoon KIM ,  Hongsung MOON

    IPC: H10B12/00

    CPC classification number: H10B12/34 ,  H10B12/053 ,  H10B12/315

    Abstract: A semiconductor memory device may include active regions defined on a substrate by a device isolation layer, each of the active regions including a first impurity region and a second impurity region, word lines on the active regions and extended in a first direction, capping insulating patterns covering top surfaces of the word lines, respectively, bit lines on the word lines and extended in a second direction crossing the first direction, contact plugs between the bit lines and connected to the second impurity region, and data storages on the contact plugs, respectively. Each of the word lines may include a first metal nitride layer and a second metal nitride layer on the first metal nitride layer. A resistivity of the second metal nitride layer may be smaller than a resistivity of the first metal nitride layer.

    ELECTRONIC DEVICE FOR DISPLAYING IMAGE AND OPERATION METHOD THEREOF
    30.
    发明公开
    ELECTRONIC DEVICE FOR DISPLAYING IMAGE AND OPERATION METHOD THEREOF 审中-公开

    公开(公告)号：US20240169626A1

    公开(公告)日：2024-05-23

    申请号：US18424060

    申请日：2024-01-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yongjun CHOI ,  Joungok HYOUNG ,  Minwoo KIM ,  Jihoon KIM

    IPC: G06T11/60 ,  G04G9/00

    CPC classification number: G06T11/60 ,  G04G9/007

    Abstract: An electronic device is provided. The electronic device includes a display, at least one sensor module, a time module which receives time information, a first processor which generates and outputs a first image in a first mode, a second processor which generates and outputs a second image in a second mode driven at lower power than the first mode, and a sensor hub which transmits sensor data, acquired through the sensor module, to the first processor and/or the second processor in the second mode, the second processor being configured to, in the second mode where the first processor is in sleep state, receive a third image associated with the second image through the first processor, combine the third image with the sensor data received from the sensor module and the time information received through the time module to generate the second image, and display the second image on the display.

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