公开(公告)号：US20200350288A1

公开(公告)日：2020-11-05

申请号：US16680657

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho PARK ,  Kyungsuk Oh ,  Hyunki Kim ,  Yongkwan Lee ,  Sangsoo Kim ,  Seungkon Mok ,  Junyoung Oh ,  Changyoung Yoo

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16

Abstract: A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

公开(公告)号：US20190130156A1

公开(公告)日：2019-05-02

申请号：US16173704

申请日：2018-10-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inho YUN ,  Yongjin LEE ,  Hyunseok SHIN ,  Jongho PARK ,  Seungeun LEE

IPC: G06K9/00 ,  G16H10/60

Abstract: An electronic device includes a light emitting unit, including a first light emitting element and a second light emitting element; and a plurality of light receiving units disposed in a structure that encloses the light emitting unit, wherein the first light emitting element and the second light emitting element are disposed in a separated state based on a radiation area related to the light emitting unit in a designated distance range. Various embodiments are available.

公开(公告)号：US20250087593A1

公开(公告)日：2025-03-13

申请号：US18581596

申请日：2024-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juil CHOI ,  Jusuk KANG ,  Jongho PARK ,  Jaeyoung LEE ,  Hyunju LEE ,  Wonho CHOI

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/48

Abstract: A semiconductor package including a first semiconductor chip including a substrate having a front surface and a rear surface opposite to each other, front pads on the front surface, through-electrodes electrically connected to the front pads, passing through the substrate, and protruding onto the rear surface, and rear pads on the through-electrodes, a first dielectric layer covering at least a portion of the first semiconductor chip, the first dielectric layer surrounding, on the rear surface of the substrate, a portion of a side surface of each of the through-electrodes and a side surface of each of the rear pads, on the rear surface of the substrate, at least one first alignment structure within the first dielectric layer around the first semiconductor chip, and a second semiconductor chip on the first dielectric layer may be provided.

公开(公告)号：US20230282533A1

公开(公告)日：2023-09-07

申请号：US18315558

申请日：2023-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung OH ,  Hyunggil BAEK ,  Seunghwan KIM ,  Jungjoo KIM ,  Jongho PARK ,  Yongkwan LEE

IPC: H01L23/16 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/16 ,  H01L25/0657 ,  H01L23/49811 ,  H01L23/3128 ,  H01L23/5389

Abstract: A semiconductor package is provided. The semiconductor package includes: a first package substrate; a first semiconductor chip on the first package substrate; an interposer substrate including a lower surface facing the first package substrate, an upper surface opposite to the lower surface, and an upper conductive pad in the upper surface of the interposer substrate; a first dam structure on the upper surface of the interposer substrate and extending along an edge of the upper conductive pad; a first molding layer in contact with the lower and upper surfaces of the interposer substrate and with an outer wall of the first dam structure; and a conductive connector in contact with an inner wall of the at least one first dam structure and with the upper conductive pad.

公开(公告)号：US20220093519A1

公开(公告)日：2022-03-24

申请号：US17306290

申请日：2021-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho PARK ,  Seunghwan KIM ,  Junyoung OH ,  Yonghyun KIM ,  Yongkwan LEE ,  Junga LEE

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31

Abstract: A semiconductor package includes a first package substrate; a first semiconductor chip on the first package substrate; a first conductive connector on the first package substrate; and an interposer including a central portion on the first semiconductor chip and an outer portion having the first conductive connector attached thereto. The central portion of the interposer includes a bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate. A thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer.

公开(公告)号：US20220085897A1

公开(公告)日：2022-03-17

申请号：US17297948

申请日：2019-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsoo KIM ,  Myungjin KANG ,  Hyungjoon YU ,  Jongho PARK ,  Seonghyeon LEE

IPC: H04B17/21 ,  H04B17/318

Abstract: According to various embodiments, an electronic device may comprise: a communication circuit which comprises a first antenna component and a second antenna component to determine a first value through the first antenna component and determine a second value through the second antenna component; a processor; and at least one memory, wherein the at least one memory has instructions stored therein which cause, when executed, the processor to: determine whether a first module disposed in the vicinity of the first antenna component has started operating; compensatively adjust a first value obtained during the operation of the first module, by using a first value obtained before the operation of the first module or a second value obtained during the operation of the first module, in response to the determination as to whether the first module has started operating; and operate the communication circuit according to a first value obtained by the compensation, wherein the first value obtained during the operation of the first module may contain a first noise value resulting from the operation of the first module. Various other embodiments are also possible.

公开(公告)号：US20220085835A1

公开(公告)日：2022-03-17

申请号：US17532971

申请日：2021-11-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho PARK ,  Yongbin YOON ,  Hyunsoo KIM ,  Youngjun PARK ,  Hyangbok LEE ,  Hyungjoon YU ,  Youngkwon LEE

IPC: H04B1/04 ,  H04B17/10

Abstract: Various embodiments of an electronic device for matching an antenna impedance may include an antenna, a wireless communication module, an impedance matching module, and at least one processor, wherein the at least one processor is configured to: select a first index corresponding to an impedance of the antenna among a plurality of sampled indexes through a first measurement in which a tuning code of the impedance matching module is configured as a reference code; identify a use environment corresponding to the first index; select a second index corresponding to the impedance of the antenna among the plurality of sampled indexes through a second measurement in which the tuning code of the impedance matching module is configured as the reference code and as a ground code corresponding to the use environment; and adjust the impedance of the antenna based on a tuning code corresponding to the second index.

公开(公告)号：US20200268263A1

公开(公告)日：2020-08-27

申请号：US16797574

申请日：2020-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hansung LEE ,  Chansoo PARK ,  Hyunsu HONG ,  Sander LAND ,  Jongho PARK ,  Hyejung SEO ,  Yongjin LEE

IPC: A61B5/0295 ,  A61B5/1455 ,  A61B5/024

Abstract: An electronic device includes a housing, a touchscreen display viewable through a first part of the housing, a photoplethysmogram (PPG) sensor exposed through a second part of the housing, a processor disposed in the housing and operatively connected to the touchscreen display and the PPG sensor, and a memory disposed in the housing and operatively connected to the processor, wherein the memory stores instructions that, when executed, are configured to cause the processor to receive first data from the PPG sensor, generate second data by band-pass filtering the first data, generate oxygen saturation data based on at least some of the second data, select a first portion related to a first period of time from the second data, and display, on the touchscreen display, a graphical user interface including information related to the oxygen saturation data except for data corresponding to the first portion from the graphical user interface.

公开(公告)号：US20190198498A1

公开(公告)日：2019-06-27

申请号：US16116295

申请日：2018-08-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho PARK ,  Wandon KIM ,  Jeonghyuk YIM ,  Sangjin HYUN

IPC: H01L27/092 ,  H01L29/49 ,  H01L21/8238

Abstract: A semiconductor device includes first, second, and third transistors on a substrate and having different threshold voltages from each other, each of the first, second, and third transistors including: a gate insulating layer, a first work function metal layer, and a second work function metal layer. The first work function metal layer of the first transistor may include a first sub-work function layer, the first work function metal layer of the second transistor may include a second sub-work function layer, the first work function metal layer of the third transistor may include a third sub-work function layer, and the first, second, and third sub-work function layers may have different work functions from each other.