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公开(公告)号：US12176620B2
公开(公告)日：2024-12-24
申请号：US17496326
申请日：2021-10-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Juneseok Lee , Jinsu Heo , Youngsub Kim , Jungho Park , Kwanghyun Baek , Youngju Lee , Kyoungho Jeong , Dohyuk Ha
Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
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公开(公告)号：US12095876B2
公开(公告)日：2024-09-17
申请号：US18300066
申请日：2023-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jungho Park , Yul Kim , Sejeong Kwon , Soohyung Kim , Wonsuk Yang , Kyunghwan Lee , Junhyuk Lee
CPC classification number: H04L67/535 , G06F16/35 , H04L41/16 , H04L43/04 , H04L67/02
Abstract: An electronic apparatus is provided. The electronic apparatus includes a communication interface, a memory storing log data with respect to external devices connected to the electronic apparatus, and a processor configured to identify a plurality of external devices having a history of being connected to the same internet protocol (IP) based on the log data, acquire, based on the log data, a first feature vector with respect to a relationship between the plurality of external devices and a second feature vector with respect to each of the plurality of external devices, acquire a graph of the relationship between the plurality of external devices based on the first feature vector and the second feature vector, and define at least one group configured by the plurality of external devices based on the graph.
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公开(公告)号：US11942586B2
公开(公告)日：2024-03-26
申请号：US17693704
申请日：2022-03-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dahye Kim , Seokhyun Lee , Jungho Park
IPC: H01L33/62 , H01L23/29 , H01L23/31 , H01L23/485 , H01L23/525 , H01L25/075 , H01L25/16 , H01L27/15 , H01L33/48 , H01L33/56 , H01L25/00
CPC classification number: H01L33/62 , H01L33/486 , H01L33/56
Abstract: A display module package includes a semiconductor chip, a wiring member disposed on the semiconductor chip, including an insulating layer and a wiring layer, and contacting at least a portion of the semiconductor chip, a light emitting device array disposed on the wiring member and including a plurality of light emitting devices disposed on one surface, wherein the wiring member is between the semiconductor chip and the light emitting device, and a molding member disposed on the wiring member, sealing part of the light emitting device array, and having an opening for exposing the plurality of light emitting devices.
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公开(公告)号：US20210066560A1
公开(公告)日：2021-03-04
申请号：US16860255
申请日：2020-04-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dahye Kim , Seokhyun Lee , Jungho Park
Abstract: A display module package includes a semiconductor chip, a wiring member disposed on the semiconductor chip, including an insulating layer and a wiring layer, and contacting at least a portion of the semiconductor chip, a light emitting device array disposed on the wiring member and including a plurality of light emitting devices disposed on one surface, wherein the wiring member is between the semiconductor chip and the light emitting device, and a molding member disposed on the wiring member, sealing part of the light emitting device array, and having an opening for exposing the plurality of light emitting devices.
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