ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230116309A1

    公开(公告)日:2023-04-13

    申请号:US18060140

    申请日:2022-11-30

    Abstract: Provided are an electronic device and a method of manufacturing the same. The electronic device includes a ferroelectric crystallization layer between a substrate and a gate electrode and a crystallization prevention layer between the substrate and the ferroelectric crystallization layer. The ferroelectric crystallization layer is at least partially crystallized and includes a dielectric material having ferroelectricity or anti-ferroelectricity. Also, the crystallization prevention layer prevents crystallization in the ferroelectric crystallization layer from being spread toward the substrate.

    ELECTRONIC DEVICE INCLUDING FERROELECTRIC THIN FILM STRUCTURE

    公开(公告)号:US20230068904A1

    公开(公告)日:2023-03-02

    申请号:US17876979

    申请日:2022-07-29

    Abstract: An electronic device includes: a substrate including a source, a drain, and a channel between the source and the drain; a gate electrode arranged above the substrate and facing the channel, the gate electrode being apart from the channel in a first direction; and a ferroelectric thin film structure between the channel and the gate electrode, the ferroelectric thin film structure including a first ferroelectric layer, a crystallization barrier layer including a dielectric material, and a second ferroelectric layer, which are sequentially arranged from the channel in the first direction. The average of sizes of crystal grains of the first ferroelectric layer may be less than or equal to the average of sizes of crystal grains of the second ferroelectric layer, and owing to small crystal grains, dispersion of performance may be improved.

    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME

    公开(公告)号:US20220140104A1

    公开(公告)日:2022-05-05

    申请号:US17515969

    申请日:2021-11-01

    Abstract: Provided is a ferroelectric semiconductor device including a ferroelectric layer and two or more electrode layers. The semiconductor device may include a first electrode layer and a second electrode layer which have thermal expansion coefficients less than the thermal expansion coefficient of the ferroelectric layer. The difference between the thermal expansion coefficients of the second electrode layer and the ferroelectric layer may be greater than the difference between the thermal expansion coefficients of the first electrode layer and the ferroelectric. The second electrode layer may have a thickness greater than the thickness of the first electrode layer.

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