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公开(公告)号：US20180130849A1
公开(公告)日：2018-05-10
申请号：US15865825
申请日：2018-01-09
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee , William David French , Keith Ryan Green
CPC classification number: H01L27/22 , H01L43/04 , H01L43/065 , H01L43/14
Abstract: Disclosed examples provide wafer-level integration of magnetoresistive sensors and Hall-effect sensors in a single integrated circuit, in which one or more vertical and/or horizontal Hall sensors are formed on or in a substrate along with transistors and other circuitry, and a magnetoresistive sensor circuit is formed in the IC metallization structure.
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公开(公告)号：US20180096784A1
公开(公告)日：2018-04-05
申请号：US15832884
申请日：2017-12-06
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee , Sudtida Lavangkul , Erika Lynn Mazotti , William David French
IPC: H01F27/34 , G01R33/00 , H01F27/24 , H01L43/12 , H01L23/522 , H01L23/528 , G01R33/04 , H01F27/28
CPC classification number: H01F27/346 , G01R33/0029 , G01R33/04 , H01F27/24 , H01F27/28 , H01L23/5226 , H01L23/528 , H01L27/22 , H01L43/02 , H01L43/12
Abstract: An integrated fluxgate device, which includes a magnetic core, an excitation coil, and a sense coil. The magnetic core has a longitudinal edge and a terminal edge. The excitation coil coils around the longitudinal edge of the magnetic core, and the excitation coil has a first number of excitation coil members within a proximity of the terminal edge. The sense coil coils around the longitudinal edge of the magnetic core, and the sense coil has a second number of sense coil members within the proximity of the terminal edge. For reducing fluxgate noise, the second number of sense coil members may be less than the first number of excitation coil members within the proximity of the terminal edge.
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公开(公告)号：US20230129179A1
公开(公告)日：2023-04-27
申请号：US17508706
申请日：2021-10-22
Applicant: Texas Instruments Incorporated
Inventor： Keith Ryan Green , Erika Lynn Mazotti , William David French , Ricky Alan Jackson
Abstract: A microelectronic device has a Hall sensor that includes a Hall plate in a semiconductor material. The Hall sensor includes contact regions in the semiconductor material, contacting the Hall plate. The Hall sensor includes an isolation structure with a dielectric material contacting the semiconductor material, on at least two opposite sides of each of the contact regions. The isolation structure is laterally separated from the contact regions by gaps. The Hall sensor further includes a conductive spacer over the gaps, the conductive spacer being separated from the semiconductor material by an insulating layer.
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公开(公告)号：US10914796B2
公开(公告)日：2021-02-09
申请号：US15016507
申请日：2016-02-05
Applicant: Texas Instruments Incorporated
Inventor： Anuraag Mohan , William David French , Ubol Udompanyavit
Abstract: An electromagnetic sensing device with a package substrate, a first die mounted on the package substrate, and a second die mounted on the package substrate. The first die includes a first integrated circuit and a first magnetic core formed above the first integrated circuit. The first magnetic core has a first sensing axis parallel to a planar surface of the package substrate. The second die includes a second integrated circuit and a second magnetic core formed above the second integrated circuit. The second magnetic core has a second sensing axis orthogonal to the planar surface of the package substrate.
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公开(公告)号：US10302457B2
公开(公告)日：2019-05-28
申请号：US15407990
申请日：2017-01-17
Applicant: Texas Instruments Incorporated
Inventor： William David French , Dok Won Lee
IPC: G01D5/14
Abstract: An integrated AMR angular sensor includes a first sensor resistor and a second sensor resistor. The first sensor resistor and the second sensor resistor each has a plurality of magnetoresistive segments containing magnetoresistive material that are electrically coupled in series. The magnetoresistive segments of each sensor resistor are parallel/anti-parallel to each other. The magnetoresistive segments of the second sensor resistor are perpendicular to the magnetoresistive segments of the first sensor resistor. The first magnetoresistive segments are divided into a first group and a second group, which are disposed in a balanced distribution relative to a sensor central point of the integrated AMR angular sensor. Similarly, the second magnetoresistive segments are divided into a first group and a second group, which are disposed in a balanced distribution relative to the sensor central point.
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Patent Agency Ranking
公开(公告)号：US10276787B2
公开(公告)日：2019-04-30
申请号：US15041575
申请日：2016-02-11
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee , William David French , Ricky Alan Jackson , Fuchao Wang
Abstract: An integrated device includes a substrate having a semiconductor surface layer including functional circuitry, a lower metal stack on the semiconductor surface layer, an interlevel dielectric (ILD) layer on the lower metal stack, a top metal layer providing AMR contact pads and bond pads coupled to the AMR contact pads in the ILD layer. An AMR device is above the lower metal stack lateral to the functional circuitry including a patterned AMR stack including a seed layer, an AMR material layer, and a capping layer, wherein the seed layer is coupled to the AMR contact pads by a coupling structure. A protective overcoat (PO layer) is over the AMR stack. There are openings in the PO layer exposing the bond pads.
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公开(公告)号：US10211255B2
公开(公告)日：2019-02-19
申请号：US15865825
申请日：2018-01-09
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee , William David French , Keith Ryan Green
Abstract: Disclosed examples provide wafer-level integration of magnetoresistive sensors and Hall-effect sensors in a single integrated circuit, in which one or more vertical and/or horizontal Hall sensors are formed on or in a substrate along with transistors and other circuitry, and a magnetoresistive sensor circuit is formed in the IC metallization structure.
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公开(公告)号：US10184991B2
公开(公告)日：2019-01-22
申请号：US15152002
申请日：2016-05-11
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee , William David French , Ricky Alan Jackson , Ann Margaret Gabrys
Abstract: A fluxgate device that includes a first magnetic core and a second magnetic core. The first magnetic core has a first magnetized direction that deviates from a first sense direction by more than 0 degree and less than 90 degrees. The second magnetic core is arranged orthogonally to the first magnetic core. The second magnetic core has a second magnetized direction that deviates from a second sense direction by more than 0 degree and less than 90 degrees.
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29.发明申请公开(公告)号：US20170343622A1
公开(公告)日：2017-11-30
申请号：US15169639
申请日：2016-05-31
Applicant: Texas Instruments Incorporated
Inventor： Erika Lynn Mazotti , Dok Won Lee , William David French , Byron J R Shulver , Thomas Dyer Bonifield , Ricky Alan Jackson , Neil Gibson
CPC classification number: G01R33/04 , G01R33/0052
Abstract: An integrated fluxgate device has a magnetic core on a control circuit. The magnetic core has a volume and internal structure sufficient to have low magnetic noise and low non-linearity. A stress control structure is disposed proximate to the magnetic core. An excitation winding, a sense winding and a compensation winding are disposed around the magnetic core. An excitation circuit disposed in the control circuit is coupled to the excitation winding, configured to provide current at high frequency to the excitation winding sufficient to generate a saturating magnetic field in the magnetic core during each cycle at the high frequency. An isolation structure is disposed between the magnetic core and the windings, sufficient to enable operation of the excitation winding and the sense winding at the high frequency at low power.
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公开(公告)号：US20170229639A1
公开(公告)日：2017-08-10
申请号：US15016507
申请日：2016-02-05
Applicant: Texas Instruments Incorporated
Inventor： Anuraag Mohan , William David French , Ubol Udompanyavit
Abstract: An electromagnetic sensing device with a package substrate, a first die mounted on the package substrate, and a second die mounted on the package substrate. The first die includes a first integrated circuit and a first magnetic core formed above the first integrated circuit. The first magnetic core has a first sensing axis parallel to a planar surface of the package substrate. The second die includes a second integrated circuit and a second magnetic core formed above the second integrated circuit. The second magnetic core has a second sensing axis orthogonal to the planar surface of the package substrate.
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