公开(公告)号：US10159151B1

公开(公告)日：2018-12-18

申请号：US15622078

申请日：2017-06-14

Applicant: Unimicron Technology Corp.

Inventor： Wen-Fang Liu ,  Shao-Chien Lee ,  Chen-Wei Tseng ,  Zong-Hua Li ,  Chien-Tsai Li

IPC: H05K1/18 ,  H05K1/11

Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.

公开(公告)号：US10056356B1

公开(公告)日：2018-08-21

申请号：US15585166

申请日：2017-05-03

Applicant: Unimicron Technology Corp.

Inventor： Wen-Fang Liu ,  Shao-Chien Lee ,  Chen-Wei Tseng ,  Zong-Hua Li

IPC: H01L25/075 ,  H01L23/498

CPC classification number: H01L25/0753 ,  H01L23/49811 ,  H01L33/62

Abstract: A chip package circuit board module includes a circuit board and an original chip. The circuit board includes a first pad and a second pad disposed besides the first pad and separated from the first pad. The original chip is connected to the first pad and the second pad. A width of the original chip is W1, a total width of the first pad is P1, and a total width of the second pad is P2. The total width P1 of the first pad is larger than twice of the width W1 of the original chip, and the total width P2 of the second pad is larger than twice of the width W1 of the original chip.