公开(公告)号：US20110098803A1

公开(公告)日：2011-04-28

申请号：US12872166

申请日：2010-08-31

Applicant: David C. Gale ,  Bin Huang ,  Vincent J. Gueriguian ,  Syed Faiyaz Ahmed Hossainy

Inventor： David C. Gale ,  Bin Huang ,  Vincent J. Gueriguian ,  Syed Faiyaz Ahmed Hossainy

IPC: A61F2/82

CPC classification number: A61L31/148 ,  A61L31/06 ,  C08L67/04

Abstract: Stents fabricated from hydrolytically degradable polymers with accelerated degradation rates and methods of fabricating stents with accelerated degradation rates are disclosed.

Abstract translation: 公开了由具有加速降解速率的水解可降解聚合物制备的支架和具有加速降解速率的制造支架的方法。

公开(公告)号：US20110028072A1

公开(公告)日：2011-02-03

申请号：US12902082

申请日：2010-10-11

Applicant: Bin Huang ,  David C. Gale ,  Daniel Castro ,  Timothy A. Limon

Inventor： Bin Huang ,  David C. Gale ,  Daniel Castro ,  Timothy A. Limon

IPC: B24B1/00

CPC classification number: A61F2/82 ,  A61F2/91 ,  A61L2400/18 ,  C08J7/02

Abstract: Methods of treating the polymeric surfaces of a stent with a fluid including a solvent for the surface polymer are disclosed.

Abstract translation: 公开了一种用包括用于表面聚合物的溶剂的流体处理支架的聚合物表面的方法。

公开(公告)号：US07875233B2

公开(公告)日：2011-01-25

申请号：US11184130

申请日：2005-07-18

Applicant: Bin Huang ,  David C. Gale

Inventor： Bin Huang ,  David C. Gale

IPC: B29C49/64 ,  B29C49/08 ,  B29C49/20

CPC classification number: A61F2/915 ,  A61F2/91 ,  A61F2002/91533 ,  A61F2230/0013 ,  A61L31/14 ,  B23K2103/42 ,  B23K2103/50

Abstract: Methods of manufacturing a radially expandable stent, including radial expansion and axial elongation of a polymer tube, are disclosed.

Abstract translation: 公开了制造径向膨胀支架的方法，包括聚合物管的径向膨胀和轴向伸长。

公开(公告)号：US20110009948A1

公开(公告)日：2011-01-13

申请号：US12878937

申请日：2010-09-09

Applicant: Bin Huang ,  David C. Gale ,  Srinivasan Sridharan ,  Joseph R. Callol ,  Klaus Kleine ,  Syed F. A. Hossainy ,  Timothy A. Limon ,  Anthony J. Abbate

Inventor： Bin Huang ,  David C. Gale ,  Srinivasan Sridharan ,  Joseph R. Callol ,  Klaus Kleine ,  Syed F. A. Hossainy ,  Timothy A. Limon ,  Anthony J. Abbate

IPC: A61F2/82 ,  B05D1/02

CPC classification number: A61F2/915 ,  A61F2/04 ,  A61F2/06 ,  A61F2/90 ,  A61F2/91 ,  A61F2002/072 ,  A61F2002/91508 ,  A61F2002/91575 ,  A61F2210/0004 ,  A61F2210/0009 ,  A61F2210/0076 ,  A61F2220/005 ,  A61F2230/0013 ,  A61F2250/0098 ,  A61L31/129 ,  B23K26/402 ,  B23K26/50 ,  B23K2103/42 ,  B23K2103/50 ,  B29C43/02 ,  B29C45/0001 ,  B29C45/0005 ,  B29C45/0055 ,  B29C47/0004 ,  B29C47/0023 ,  B29C47/0026 ,  B29C47/0066 ,  B29C47/06 ,  B29C47/1045 ,  B29C53/566 ,  B29C53/583 ,  B29C59/02 ,  B29C59/021 ,  B29C2043/028 ,  B29K2101/00 ,  B29K2105/12 ,  B29K2267/043 ,  B29K2995/0056 ,  B29K2995/006 ,  B29L2023/003 ,  B29L2031/7546 ,  D03D3/02

Abstract: Polymeric composite stents reinforced with fibers for implantation into a bodily lumen are disclosed.

Abstract translation: 公开了用纤维增强的用于植入体腔的聚合复合支架。

公开(公告)号：US07868377B2

公开(公告)日：2011-01-11

申请号：US11927616

申请日：2007-10-29

Applicant: Shin-Bin Huang ,  Ching-Nan Hsiao ,  Chung-Lin Huang

Inventor： Shin-Bin Huang ,  Ching-Nan Hsiao ,  Chung-Lin Huang

IPC: H01L29/94

CPC classification number: H01L27/115 ,  H01L27/11521 ,  H01L27/11524

Abstract: A flash memory is provided. The flash memory features of having the select gate transistors to include two different channel structures, which are a recessed channel structure and a horizontal channel. Because of the design of the recessed channel structure, the space between the gate conductor lines, which are for interconnecting the select gates of the select gate transistors arranged on the same column, can be shortened. Therefore, the integration of the flash memory can be increased; and the process window of the STI process can be increased as well. In addition, at least one depletion-mode select gate transistor is at one side of the memory cell string. The select gate transistor of the depletion-mode is always turned on.

Abstract translation: 提供闪存。 具有选择栅极晶体管的闪存特征包括两个不同的沟道结构，它们是凹陷沟道结构和水平沟道。 由于凹陷沟道结构的设计，可以缩短用于互连布置在同一列上的选择栅晶体管的选通栅极的栅极导体线之间的空间。 因此，可以增加闪存的集成; 并且可以增加STI过程的处理窗口。 此外，至少一个耗尽型选择栅极晶体管位于存储单元串的一侧。 耗尽模式的选择栅晶体管总是导通。

公开(公告)号：US07862830B2

公开(公告)日：2011-01-04

申请号：US11827912

申请日：2007-07-12

Applicant: David C. Gale ,  Syed Faiyaz Ahmed Hossainy ,  Bin Huang

Inventor： David C. Gale ,  Syed Faiyaz Ahmed Hossainy ,  Bin Huang

IPC: A61F2/82 ,  A61F2/06 ,  C08G63/08

CPC classification number: C08L67/04 ,  A61L31/10 ,  C08L101/00 ,  C08L2203/02 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2666/18 ,  C08L2666/02

Abstract: The present invention relates to a composition of a first single enantiomer homopolymer and a separate stereocomplex formed of a second single enantiomer homopolymer and it mirror image enantiomer, wherein the first and second single enantiomer homopolymers can be the same or different.

Abstract translation: 本发明涉及第一单一对映异构体均聚物和由第二单一对映异构体均聚物及其镜像对映异构体形成的单独立体络合物的组合物，其中第一和第二单一对映异构体均聚物可以相同或不同。

公开(公告)号：US07819980B2

公开(公告)日：2010-10-26

申请号：US11204691

申请日：2005-08-16

Applicant: Chen-Yuan Hsia ,  Chang-Cheng Hung ,  Chi-Lun Lu ,  Shih-Ming Chang ,  Wen-Chuan Wang ,  Yen-Bin Huang ,  Ching-Yu Chang ,  Chin-Hsiang Lin

Inventor： Chen-Yuan Hsia ,  Chang-Cheng Hung ,  Chi-Lun Lu ,  Shih-Ming Chang ,  Wen-Chuan Wang ,  Yen-Bin Huang ,  Ching-Yu Chang ,  Chin-Hsiang Lin

IPC: C25F1/00 ,  C25F3/30 ,  C25F5/00

CPC classification number: B08B6/00 ,  B08B5/00 ,  H01L21/02057 ,  H01L21/67017 ,  H01L21/67051

Abstract: A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.

Abstract translation: 一种用于半导体晶片制造的系统，包括用于处理晶片的腔室处理路径，以及可操作以通过静电和电磁方法从晶片去除颗粒的装置，其中该装置安装在室过程路径中。

公开(公告)号：US07794495B2

公开(公告)日：2010-09-14

申请号：US11488928

申请日：2006-07-17

Applicant: David C. Gale ,  Bin Huang ,  Vincent J. Gueriguian ,  Syed Faiyaz Ahmed Hossainy

Inventor： David C. Gale ,  Bin Huang ,  Vincent J. Gueriguian ,  Syed Faiyaz Ahmed Hossainy

IPC: A61F2/06 ,  C08G63/08

CPC classification number: A61L31/148 ,  A61L31/06 ,  C08L67/04

Abstract: Stents fabricated from hydrolytically degradable polymers with accelerated degradation rates and methods of fabricating stents with accelerated degradation rates are disclosed.

Abstract translation: 公开了由具有加速降解速率的水解可降解聚合物制备的支架和具有加速降解速率的制造支架的方法。

公开(公告)号：US07793898B2

公开(公告)日：2010-09-14

申请号：US12215876

申请日：2008-06-30

Applicant: Shao-Ren Dong ,  Bin Huang ,  Chih-Huang Lien

Inventor： Shao-Ren Dong ,  Bin Huang ,  Chih-Huang Lien

IPC: F16M11/00

CPC classification number: F16M11/24 ,  F16M11/105 ,  F16M11/18 ,  F16M11/2014 ,  Y10S248/917

Abstract: An exemplary display device includes a display panel and a rotating apparatus. The rotating apparatus includes a first spindle assembly, a conveyor connecting to the first spindle assembly, and a second spindle assembly. The first spindle assembly includes a first spindle configured to synchronously rotate with rotation of the display panel. The second spindle assembly includes a second spindle meshed with the first spindle, and is configured to be able to rotate and simultaneously rise or fall along the connecting assembly.

Abstract translation: 示例性显示装置包括显示面板和旋转装置。 旋转装置包括第一主轴组件，连接到第一主轴组件的传送器和第二主轴组件。 第一主轴组件包括构造成与显示面板的旋转同步旋转的第一主轴。 第二主轴组件包括与第一主轴啮合的第二主轴，并且构造成能够沿着连接组件旋转并同时上升或下降。

公开(公告)号：US07781885B2

公开(公告)日：2010-08-24

申请号：US12114623

申请日：2008-05-02

Applicant: Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

Inventor： Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

IPC: H01L23/10 ,  H01L21/00

CPC classification number: H01S5/02469 ,  H01L33/648 ,  H01L2224/48091 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02288 ,  H01L2924/00014

Abstract: An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

Abstract translation: 用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。 基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。 每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。