中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

43 records (took 0.028 seconds)

    ARTICLES COMPRISING HETEROGENEOUS AND THERMALLY STABLE GRAIN-REFINED ALLOYS
    31.
    发明公开
    ARTICLES COMPRISING HETEROGENEOUS AND THERMALLY STABLE GRAIN-REFINED ALLOYS 审中-公开

    公开(公告)号：US20240026559A1

    公开(公告)日：2024-01-25

    申请号：US17868409

    申请日：2022-07-19

    Applicant: Integran Technologies Inc.

    Inventor： Klaus Tomantschger

    IPC: C25D5/10 ,  C25D5/00 ,  C25D15/00 ,  C25D5/16

    CPC classification number: C25D5/10 ,  C25D5/617 ,  C25D15/00 ,  C25D5/16

    Abstract: Articles including anisotropic electrodeposited layers of fine-grained alloys of Co, Cu, Fe, Ni and/or Zn with minor additions of B, O, P and S that provide high strength, ductility and heat-resistance, are disclosed as well as a process for making the articles. Non-metallic additions of ≤2% are required to significantly increase the maximum temperature at which softening and grain-growth occurs. Electrodeposition conditions in a single plating cell are adjusted and/or modulated to vary at least one property in the deposit direction and/or along the length and/or width of the workpiece once, constantly or repeatedly, to form a graded and/or layered electrodeposit. Variable property metallic material deposits containing, at least in part, a fine-grained microstructure and variable property in the deposit direction and optionally multi-dimensionally, provide superior overall mechanical properties and temperature stability. Various methods and electroplating apparatuses and approaches to practice the invention are also provided.

    Articles comprising durable icephobic coatings
    34.
    发明授权
    Articles comprising durable icephobic coatings 有权

    公开(公告)号：US11319450B2

    公开(公告)日：2022-05-03

    申请号：US16515093

    申请日：2019-07-18

    Applicant: INTEGRAN TECHNOLOGIES INC.

    Inventor： Gino Palumbo ,  Herath Katugaha ,  Jonathan McCrea ,  Klaus Tomantschger ,  Konstantinos Panagiotopoulos

    IPC: C09D5/00 ,  C09D163/00 ,  C09D175/04 ,  B32B15/08

    Abstract: Articles including durable and icephobic polymeric coatings are disclosed. The polymeric coatings include a bonding layer which may contain a substantially fully cured polymeric resin providing excellent adhesion to metallic or polymer substrates. The polymeric coating further includes an outer surface layer which is smooth, hydrophobic and icephobic and, in addition to a substantially fully cured resin, contains silicone comprising additives near the exposed outer surface. The anisotropic polymeric coatings are particularly suited for strong and lightweight parts required in aerospace, automotive and sporting goods applications. A process for making the articles is disclosed as well.

    Apparatus and method for in-situ electrosleeving and in-situ electropolishing internal walls of metallic conduits
    36.
    发明授权
    Apparatus and method for in-situ electrosleeving and in-situ electropolishing internal walls of metallic conduits 有权

    公开(公告)号：US11280016B2

    公开(公告)日：2022-03-22

    申请号：US16824165

    申请日：2020-03-19

    Applicant: INTEGRAN TECHNOLOGIES INC.

    Inventor： Gino Palumbo ,  Leo Monaco ,  Jonathan McCrea ,  Klaus Tomantschger ,  Dave Limoges ,  Michael Mills

    IPC: C25D7/04 ,  C25F3/16 ,  C25F7/00 ,  C25D3/12 ,  C25D3/38

    Abstract: An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).

    APPARATUS AND METHOD FOR IN-SITU ELECTROSLEEVING AND IN-SITU ELECTROPOLISHING INTERNAL WALLS OF METALLIC CONDUITS
    37.
    发明申请
    APPARATUS AND METHOD FOR IN-SITU ELECTROSLEEVING AND IN-SITU ELECTROPOLISHING INTERNAL WALLS OF METALLIC CONDUITS 有权

    公开(公告)号：US20210292930A1

    公开(公告)日：2021-09-23

    申请号：US16824165

    申请日：2020-03-19

    Applicant: INTEGRAN TECHNOLOGIES INC.

    Inventor： GINO PALUMBO ,  LEO MONACO ,  JONATHAN MCCREA ,  KLAUS TOMANTSCHGER ,  DAVE LIMOGES ,  MICHAEL MILLS

    IPC: C25F3/16 ,  C25F7/00 ,  C25D7/04 ,  C25D3/38 ,  C25D3/12

    Abstract: An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).

    ELECTRODEPOSITION METHOD FOR PREPARING POLYCRYSTALLINE COPPER HAVING IMPROVED MECHANICAL AND PHYSICAL PROPERTIES
    39.
    发明申请
    ELECTRODEPOSITION METHOD FOR PREPARING POLYCRYSTALLINE COPPER HAVING IMPROVED MECHANICAL AND PHYSICAL PROPERTIES 审中-公开
    用于制备具有改进的机械和物理性能的多晶铜的电沉积方法

    公开(公告)号：US20160208369A1

    公开(公告)日：2016-07-21

    申请号：US15003259

    申请日：2016-01-21

    Applicant: INTEGRAN TECHNOLOGIES INC.

    Inventor： Gino PALUMBO ,  Iain BROOKS ,  Klaus TOMANTSCHGER ,  Peter LIN ,  Karl AUST ,  Nandakumar NAGARAJAN ,  Francisco GONZALEZ

    IPC: C22F1/08 ,  C21D9/00 ,  C21D1/06 ,  C25D3/38 ,  C25D5/50

    CPC classification number: C22F1/08 ,  C21D1/06 ,  C21D9/0068 ,  C25D3/12 ,  C25D3/38 ,  C25D5/50

    Abstract: Polycrystalline materials are prepared by electrodeposition of a precursor material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fraction of ‘special’ low Σ grain boundaries and a randomized crystallographic texture. The precursor metallic material has sufficient purity and a fine-grained microstructure (e.g., an average grain size of 4 nm to 5 pm). The resulting metallic material is suited to the fabrication of articles requiring high mechanical or physical isotropy and/or resistance to grain boundary-mediated deformation or degradation mechanisms.

    Abstract translation: 多结晶材料通过电沉积前体材料制备，随后进行热处理以诱导材料的晶粒尺寸至少增加三倍，从而产生相对较高的“特殊”低Sgr; 晶界和随机晶体学结构。 前体金属材料具有足够的纯度和细晶粒微结构（例如，平均粒度为4nm至5μm）。 所得到的金属材料适于制造需要高机械或物理各向同性的物品和/或对晶界介导的变形或降解机理的抵抗力。

    POROUS, FLOW-THROUGH CONSUMABLE ANODES FOR USE IN SELECTIVE ELECTROPLATING
    40.
    发明申请
    POROUS, FLOW-THROUGH CONSUMABLE ANODES FOR USE IN SELECTIVE ELECTROPLATING 有权
    多选择电镀中使用的流动消耗阳极

    公开(公告)号：US20160130713A1

    公开(公告)日：2016-05-12

    申请号：US14997636

    申请日：2016-01-18

    Applicant: Integran Technologies Inc.

    Inventor： Klaus Tomantschger ,  Diana Facchini ,  Francisco Gonzalez ,  Jonathan McCrea ,  John Kratochwil ,  Dan Woloshyn ,  Yusuf Bismilla ,  Nandakumar Nagarajan ,  Mioara Neacsu

    IPC: C25D5/06 ,  C25D5/18 ,  C25D17/14 ,  C25D5/08

    CPC classification number: C25D5/06 ,  C25D1/00 ,  C25D5/08 ,  C25D5/18 ,  C25D17/14

    Abstract: A method for electrodepositing a coating/free-standing layer on a workpiece in an electrolytic cell includes moving the workpiece and an anode applicator tool having a consumable anode insert relative to each other; anodically dissolving a metal from the insert and cathodically depositing the metal on the workpiece; providing flow of electrolyte solution through the insert to ensure that greater than 90% of the anodic reaction is represented by dissolution of the metal; recirculating collected electrolyte solution exiting the electrolytic cell through the insert; applying an electric current to the electrolytic cell; maintaining a concentration of the anodically dissolved metal within ±25% of each Ampere-hour per liter of electroplating solution; and creating a cathodic electrodeposit on the workpiece which includes the anodically dissolved metal, the chemical composition of the deposit varying by less than 25% in the deposition direction over a selected thickness of up to 25 microns of the deposit.

    Abstract translation: 一种用于在电解池中将工件上的涂层/独立层电沉积的方法包括相对于彼此移动工件和具有可消耗阳极插入件的阳极施用工具; 将金属从插入物阳极溶解并将金属阴极沉积在工件上; 提供电解质溶液通过插入物的流动，以确保大于90％的阳极反应由金属的溶解表示; 通过插入物再循环离开电解池的收集的电解质溶液; 向电解槽施加电流; 将阳极溶解的金属的浓度保持在每升电镀溶液的每安培小时的±25％内; 并且在包括阳极溶解的金属的工件上产生阴极电沉积物，沉积物的沉积方向上的沉积物的化学成分在沉积方向上选择厚度高达25微米的选定厚度变化小于25％。

Patent Agency Ranking