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    Wafer-Level Poling of Electro-Optic Phase Modulators
    32.
    发明申请
    Wafer-Level Poling of Electro-Optic Phase Modulators 有权

    公开(公告)号：US20250028195A1

    公开(公告)日：2025-01-23

    申请号：US18778171

    申请日：2024-07-19

    Applicant: Lightwave Logic, Inc.

    Inventor： Jasper Altman Drisko

    IPC: G02F1/065 ,  H05K1/18 ,  H05K3/30

    Abstract: A method of fabricating an integrated electro-optic phase modulator array is described. The method may include providing a first substrate. The first substrate may include an interconnect array. The method may include arranging an array of electro-optic phase modulators on a surface of the first substrate. Each electro-optic phase modulator may include a polymer optical stack, a semiconductor substrate, an electric input, an optical input, and/or an optical output. The interconnect array in each modulator may include an electrical interconnect, an electrical bypass, and/or an optical interconnect. The electrical interconnect may connect to a respective electrical input. The electrical bypass may connect at least a pair of adjacent modulators. The optical interconnect may connect a respective optical input and optical output. Each modulator may be series connected to a respective fuse arranged along the electric interconnect between the respective electric input and a voltage source.

    Hybrid EO polymer modulator with ALD sealant layer
    39.
    发明授权
    Hybrid EO polymer modulator with ALD sealant layer 有权

    公开(公告)号：US11506918B2

    公开(公告)日：2022-11-22

    申请号：US17335375

    申请日：2021-06-01

    Applicant: Lightwave Logic Inc.

    Inventor： Michael Lebby ,  Zhiming Liu ,  Baoquan Chen

    IPC: G02F1/065

    Abstract: An EO polymer modulator with conformal atomic layer deposition sealant layers including an active region of a device material stack with an elongated tapered active section positioned on a passive waveguide core. The device material stack supported on a substrate with the passive waveguide core defining light input and light output side surfaces. A conformal atomic layer deposition sealant layer overlying the device material stack including the light input and light output side surfaces, the conformal atomic layer deposition sealant layer defining windows for the light input and light output side surfaces.

    Protection layers for polymer modulators/waveguides
    40.
    发明授权
    Protection layers for polymer modulators/waveguides 有权

    公开(公告)号：US10989871B2

    公开(公告)日：2021-04-27

    申请号：US16690491

    申请日：2019-11-21

    Applicant: Lightwave Logic Inc.

    Inventor： Richard Becker ,  Michael Lebby ,  Youngwoo Yi

    IPC: G02B6/122 ,  G02B6/132 ,  G02B6/12 ,  G02F1/00 ,  G02B6/13

    Abstract: A polymer waveguide/modulator including a lower cladding layer, a polymer core, an upper cladding layer, a first protection/barrier layer sandwiched between the lower cladding layer and the core, and a second protection/barrier layer sandwiched between the core and the upper cladding layer. The protection/barrier layers designed to protect the cladding layers and the core from solvents and gases and to prevent current leakage between the cladding layers and the core. The first protection/barrier layer is optically transparent and designed with a refractive index less than, greater than, or the same as the refractive index of the core and approximately equal to the refractive index of the lower cladding layer. The second protection/barrier layer is optically transparent and designed with a refractive index less than, greater than, or the same as the refractive index of the core and approximately equal to the refractive index of the upper cladding layer.

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