公开(公告)号：US20180168025A1

公开(公告)日：2018-06-14

申请号：US15577694

申请日：2016-05-30

Applicant: IFP Energies nouvelles ,  Mavel S.r.l.

Inventor： Wissam DIB ,  Abdenour ABDELLI ,  Fabien VIDAL-NAQUET ,  Marco FRANCESSETTI ,  Denny CHIONO ,  Davide BETTONI

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K1/0209 ,  H05K1/0298 ,  H05K2201/066 ,  H05K2201/09572 ,  H05K2201/0959

Abstract: The present invention is an electronic device (10) comprising a printed circuit board (12) bearing at least one component comprising at least one of a power component (14) and at least one power conductor (18). The printed circuit board comprises an alternating succession of insulating (22) and conductive (24) layers, wells (30, 30′) bearing an internal electrically and thermally conductive coating (32) which passes through the thickness of the board, and a cooling device (34) for the board. The interior of the wells are filled with a thermally conductive material (44) to produce a thermal bridge between the component and the cooling device (34).