公开(公告)号：US20090039140A1

公开(公告)日：2009-02-12

申请号：US11834438

申请日：2007-08-06

Applicant: Raschid Jose Bezama ,  Russell Alan Budd ,  Evan George Colgan ,  Peter Alfred Gruber ,  Valerie Oberson

Inventor： Raschid Jose Bezama ,  Russell Alan Budd ,  Evan George Colgan ,  Peter Alfred Gruber ,  Valerie Oberson

IPC: B23K37/00 ,  B22C9/00

CPC classification number: B23K3/0638 ,  B23K2101/40 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338 ,  H05K2203/1178

Abstract: A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities.

Abstract translation: 用于将焊料转移到晶片的焊接模具包括：衬底，用于保持焊料的多个焊料腔，以及在所述多个焊料腔之间形成的多个通气通道。

公开(公告)号：US06332569B1

公开(公告)日：2001-12-25

申请号：US09578319

申请日：2000-05-24

Applicant: Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

Inventor： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC: B23K3102

CPC classification number: H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/002 ,  H05K3/3468 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H01L2224/05599

Abstract: A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the “flip chip” technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Abstract translation: 提供精确的体积，精确对准的载体，用于注射成型，用于在“倒装芯片”技术中制造集成电路凸块触点。 通过将注册的开口蚀刻穿透并切割成透明载体来制造半球形腔。 半球形腔体具有相关的体积和可见的周边形状，当注射成型操作已经填充空腔时，允许简单的光学质量控制，并且简单的光学配准用于熔合到集成电路上的焊盘。

公开(公告)号：US6149122A

公开(公告)日：2000-11-21

申请号：US169854

申请日：1998-10-09

Applicant: Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

Inventor： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC: H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34 ,  B29C33/00

CPC classification number: H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

Abstract: A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

Abstract translation: 一种用于在电子结构上形成焊料凸块的方法，包括以下步骤：首先提供由具有大于待形成的焊料凸块的厚度的模具材料的片材制成的模具，所述模具材料具有足够的光学透明度，以便 允许检查随后填充到模具材料中形成的模腔中的焊料材料，以及与模具将被配合到的基板基本相似的热膨胀系数，在该模具中形成多个模腔 模具材料片材，用焊料材料填充多个模腔，将模具冷却到足以固化多个模腔中的焊料材料的温度，将模具与电子结构紧密地定位，使得空腔面向 结构，并将模具和结构加热到足够高的温度，使得焊料材料tr 在电子结构上。

公开(公告)号：US6127735A

公开(公告)日：2000-10-03

申请号：US710992

申请日：1996-09-25

Applicant: Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Bruce Lee Humphrey ,  Michael Liehr ,  William Thomas Motsiff ,  Carlos Juan Sambucetti

Inventor： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Bruce Lee Humphrey ,  Michael Liehr ,  William Thomas Motsiff ,  Carlos Juan Sambucetti

IPC: B23K35/26 ,  H01L21/60 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/81 ,  H05K3/3436 ,  H05K3/3468 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2201/0379 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K3/3463 ,  H05K3/3478 ,  Y02P70/613

Abstract: A method of forming interconnects on an electronic device that can be bonded to another electronic device at a low processing temperature can be carried out by depositing a first interconnect material on the electronic device forming protrusions and then depositing a second interconnect material to at least partially cover the protrusions, wherein the second interconnect material has a lower flow temperature than the first interconnect material. The method is carried out by flowing a molten solder into a mold having microcavities to fill the cavities and then allowed to solidify. The mold is then aligned with a silicon wafer containing chips deposited with high melting temperatures solder bumps such that each microcavity of the mold is aligned with each high melting temperature solder bump on the chip. The aligned mold/wafer assembly is then passed through a reflow furnace to effect the transfer of the low melting temperature solder in the mold cavities onto the tip of the high melting temperature solder bumps on the wafer. A dual metallurgical composition bump is thereby formed by the two different solder alloys.

Abstract translation: 可以在能够以低处理温度结合到另一电子设备的电子设备上形成互连的方法可以通过在形成突起的电子设备上沉积第一互连材料，然后沉积第二互连材料至少部分覆盖 所述突起，其中所述第二互连材料具有比所述第一互连材料低的流动温度。 该方法通过将熔融焊料流入具有微腔的模具中以填充空腔，然后使其固化来进行。 然后将模具与包含沉积有高熔点温度焊料凸块的芯片的硅晶片对准，使得模具的每个微腔与芯片上的每个高熔点温度焊料凸块对准。 然后将对准的模具/晶片组件通过回流炉，以将模腔中的低熔点焊料转移到晶片上的高熔点温度焊料凸块的尖端上。 由此由两种不同的焊料合金形成双金属组合物凸块。