公开(公告)号：US20130083540A1

公开(公告)日：2013-04-04

申请号：US13630824

申请日：2012-09-28

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chi-Huan LO ,  Ching-Wen YU ,  Sheng-Yu HUANG

IPC: F21V7/22 ,  C09J7/02

CPC classification number: H01L33/60 ,  C08K3/013 ,  C08K3/22 ,  C08K3/26 ,  C09J7/20 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2205/102 ,  C09J2205/106 ,  F21V7/22 ,  F21Y2115/10 ,  Y10T428/25 ,  Y10T428/264 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/2896

Abstract: Present embodiments provide for a polymer film with a reflective ratio equal to or above about 80%, comprising a white polyimide layer and a white adhesive layer disposed on a surface of the white polyimide layer The white adhesive layer including an adhesive agent and a white filler distributed in the adhesive agent. Present embodiments also provide for a lighting assembly that comprises a substrate, a lighting component disposed on the substrate, and a reflective surface formed by the polymer film.

Abstract translation: 本实施例提供具有等于或大于约80％的反射率的聚合物膜，包括白色聚酰亚胺层和设置在白色聚酰亚胺层的表面上的白色粘合剂层。白色粘合剂层包括粘合剂和白色填料 分布在粘合剂中。 本实施例还提供一种照明组件，其包括基板，设置在基板上的照明部件和由聚合物膜形成的反射表面。

公开(公告)号：US20240076451A1

公开(公告)日：2024-03-07

申请号：US18457370

申请日：2023-08-29

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： YUNG-CHU CHUANG ,  YI-HSUEH HO ,  TING-XUAN DENG

IPC: C08G73/10 ,  C08K3/04 ,  C08K5/18 ,  C08K7/26

CPC classification number: C08G73/1067 ,  C08G73/1032 ,  C08K3/04 ,  C08K5/18 ,  C08K7/26 ,  C08J2379/08

Abstract: Provide a black matte polyimide film, including polyimide in an amount from 87 to 97 wt % of the black matte polyimide film, in which aromatic dianhydride and aromatic diamine are polymerized to form a polyimide precursor, and the polyimide precursor is chemically cyclized to form the polyimide, wherein the aromatic dianhydride at least includes 3,3′,4,4′-biphenyltetracarboxylic dianhydride in an amount being no less than 20 mol % of the aromatic dianhydride, and the aromatic diamine at least includes p-phenylenediamine in an amount from 5 to 40 mol % of the aromatic diamine; carbon black in an amount from 2 to 8 wt % of the black matte polyimide film; and silicon dioxide powder having a particle size between 1 and 10 μm and a density less than 1 g/cm3 and being in an amount from 1 to 5 wt % of the polyimide film.

公开(公告)号：US11732160B2

公开(公告)日：2023-08-22

申请号：US17106211

申请日：2020-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chun-Chi Hsu ,  Chun-Ting Lai ,  Chih-Wei Lin

IPC: C09J7/38 ,  C09J7/25 ,  H01L33/00

CPC classification number: C09J7/38 ,  C09J7/25 ,  C09J7/383 ,  C09J7/385 ,  H01L33/0095 ,  C09J2203/326 ,  C09J2301/1242 ,  C09J2301/312 ,  C09J2433/00 ,  C09J2479/086

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

公开(公告)号：US20230203309A1

公开(公告)日：2023-06-29

申请号：US17979005

申请日：2022-11-02

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： CHUN-HUA LI ,  YI-HSUEH HO

IPC: C08L79/08

CPC classification number: C08L79/08

Abstract: Provides an alkali-resistant black matte polyimide film, including polyimide in an amount from 75 to 93 wt % of the alkali-resistant black matte polyimide film, in which dianhydride and diamine are polymerized to form a polyimide precursor, and the polyimide precursor is chemically cyclized to form the polyimide, wherein the dianhydride includes pyromellitic dianhydride (PMDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and the diamine includes p-Phenylenediamine (PDA) and 4,4′-oxydianiline (ODA), and wherein the BPDA is an amount from 2 to 35 wt % of the dianhydride, and the PDA is in an amount from 10 to 70 wt % of the diamine; carbon black in an amount from 2 to 8 wt % of the alkali-resistant black matte polyimide film; and polyimide micropowder having a particle size between 2 and 10 μm and being in an amount from 5 to 10 wt % of the alkali-resistant black matte polyimide film.

公开(公告)号：US11655348B2

公开(公告)日：2023-05-23

申请号：US17355204

申请日：2021-06-23

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Jia-Hao Wu ,  Chia-Ying Chou ,  Chun-Yi Cheng

IPC: C08J5/18 ,  C08J7/04 ,  C08J3/11 ,  C08G73/10 ,  C08J3/24 ,  C08L33/24

CPC classification number: C08J5/18 ,  C08G73/1003 ,  C08J3/11 ,  C08J3/247 ,  C08J7/0427 ,  C08L33/24 ,  C08J2333/24

Abstract: A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.

公开(公告)号：US11597880B2

公开(公告)日：2023-03-07

申请号：US17752880

申请日：2022-05-25

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yi-Hsueh Ho ,  Meng-Ying Tsai

IPC: C09K19/52 ,  G02F1/00 ,  H05K1/03 ,  C08J5/18 ,  C09K19/38

Abstract: A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.

公开(公告)号：US20220389177A1

公开(公告)日：2022-12-08

申请号：US17752880

申请日：2022-05-25

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： YI-HSUEH HO ,  MENG-YING TSAI

IPC: C08J5/18 ,  C09K19/38 ,  C09K19/52 ,  H05K1/03

Abstract: A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.

公开(公告)号：US20180127561A1

公开(公告)日：2018-05-10

申请号：US15372026

申请日：2016-12-07

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Jia-Hao Wu ,  Yu-Chen Lai

IPC: C08J9/28 ,  C08J9/00

CPC classification number: C01B32/205 ,  C08J9/0066 ,  C08J9/26 ,  C08J2201/044 ,  C08J2379/08

Abstract: A polyimide film suitable for use in the fabrication of a graphite layer includes a polyimide derived from reaction of diamine monomers with dianhydride monomers, and a foaming agent incorporated in the polyimide. Moreover, a process of fabricating a graphite film includes providing a polyamic acid solution formed by reaction of diamine monomers with dianhydride monomers, incorporating a foaming agent into the polyamic acid solution, forming a polyimide film from the polyamic acid solution, applying a first thermal treatment so that the polyimide film is carbonized to form a carbon film, and applying a second thermal treatment so that the carbon film is converted to a graphite film.

公开(公告)号：US20180042116A1

公开(公告)日：2018-02-08

申请号：US15365664

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K3/00 ,  C03C17/34 ,  H01L23/498 ,  H05K1/03 ,  H01L21/683

CPC classification number: H05K3/007 ,  C03C17/30 ,  C03C17/32 ,  C03C17/3405 ,  C03C2218/11 ,  C03C2218/32 ,  C03C2218/355 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/20 ,  C09D179/08 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68386 ,  H05K1/0393 ,  H05K3/4682 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0264 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible substrate assembly includes forming a first polyimide layer on a rigid support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution, an adhesion promoting agent and a release agent for achieving different adhesion strength at two opposite sides of the first polyimide layer, and forming a flexible second polyimide layer on the first polyimide layer, the second polyimide layer being adhered in contact with the first polyimide layer, and a peeling strength between the first and second polyimide layers being less than a peeling strength between the first polyimide layer and the support base so that the second polyimide layer is peelable from the first polyimide layer while the first polyimide layer remains adhered in contact with the support base.

公开(公告)号：US20170107400A1

公开(公告)日：2017-04-20

申请号：US15293112

申请日：2016-10-13

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang

IPC: C09D179/08 ,  C08L79/08 ,  C08G73/10 ,  C09J179/08

CPC classification number: C09D179/08 ,  C08G73/1003 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/16 ,  C09J179/08

Abstract: A polyimide film structure includes a polyimide layer having a first and a second surface opposite to each other, and a base layer peelably adhered to the first surface of the polyimide layer. The base layer includes a polyimide, and a filler made of a siloxane polymer present at a weight ratio between about 5 wt % and about 40 wt % based on the total weight of the base layer. Moreover, the present application also describes a method of fabricating the polyimide film structure, and its assembly on a substrate.