公开(公告)号：US10741736B2

公开(公告)日：2020-08-11

申请号：US15473935

申请日：2017-03-30

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00 ,  H01L33/58 ,  H01L51/52 ,  H01L51/56 ,  H01S5/00 ,  H01S5/02 ,  H01S5/183 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US10566468B2

公开(公告)日：2020-02-18

申请号：US16086868

申请日：2017-03-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Philippe Bouchilloux ,  Jukka Alasirniö ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/02 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0232 ,  H05K1/02 ,  H01L31/024 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L51/52 ,  H01S5/022 ,  H01S5/024 ,  H01L31/18

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

公开(公告)号：US10566467B2

公开(公告)日：2020-02-18

申请号：US15772581

申请日：2016-11-15

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Ghana Sambandam

IPC: H01L31/0203 ,  H01L31/0216 ,  H01L33/54 ,  H01L33/58 ,  H01L31/0232 ,  H01L31/18

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

公开(公告)号：US20190214533A1

公开(公告)日：2019-07-11

申请号：US16275422

申请日：2019-02-14

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L25/16 ,  H01L33/62 ,  H01L33/54 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/58

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

公开(公告)号：US10343899B2

公开(公告)日：2019-07-09

申请号：US14346804

申请日：2012-10-01

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Peter Riel ,  Hartmut Rudmann ,  Markus Rossi

IPC: H01L27/146 ,  B81B7/04 ,  B81C1/00

Abstract: The method for manufacturing an object comprises the steps of (a) providing a wafer comprising a multitude of semi-finished objects; (b) separating said wafer into parts referred to as sub-wafers, at least one of said sub-wafers comprising a plurality of said semi-finished objects; (c) processing at least a portion of said plurality of semi-finished objects by subjecting said at least one sub-wafer to at least one processing step; and preferably also the step of (d) separating said at least one sub-wafer into a plurality of parts.

公开(公告)号：US10283542B2

公开(公告)日：2019-05-07

申请号：US15622813

申请日：2017-06-14

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jens Geiger ,  Peter Roentgen ,  Vincenzo Condorelli

IPC: H01L27/146

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

公开(公告)号：US11575843B2

公开(公告)日：2023-02-07

申请号：US17013287

申请日：2020-09-04

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirnio ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US11145796B2

公开(公告)日：2021-10-12

申请号：US16919556

申请日：2020-07-02

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00 ,  H01L33/58 ,  H01L51/52 ,  H01L51/56 ,  H01S5/02 ,  H01S5/183 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US11018269B2

公开(公告)日：2021-05-25

申请号：US16073418

申请日：2017-02-21

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L33/58 ,  H01L33/54 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L31/0203 ,  G01S7/481 ,  H01L25/16 ,  G01S17/02 ,  H01L23/00 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  G01S17/04

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US10663691B2

公开(公告)日：2020-05-26

申请号：US16294497

申请日：2019-03-06

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Christian Tang-Jespersen ,  Michael Kiy ,  Miguel Bruno Vaello Paños ,  Florin Cutu ,  James Patrick Long ,  Hartmut Rudmann

IPC: G02B7/28 ,  G02B7/32 ,  G02B7/40 ,  G03B13/20 ,  H04N5/232 ,  G01S17/10 ,  G01S17/32 ,  G03B13/36 ,  G01S17/26 ,  H04N5/225

Abstract: The present disclosure describes imaging techniques and devices having improved autofocus capabilities. The imaging techniques can include actively illuminating a scene and determining distances over the entire scene and so that a respective distance to each object or point in the scene can be determined. Thus, distances to all objects in a scene (within a particular range) at any given instant can be stored. A preview of the image can be displayed so as to allow a user to select a region of the scene of interest. In response to the user's selection, the imager's optical assembly can be adjusted automatically, for example, to a position that corresponds to optimal image capture of objects at the particular distance of the selected region of the scene.