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    BUTTON INTEGRATION FOR AN ELECTRONIC DEVICE
    32.
    发明申请
    BUTTON INTEGRATION FOR AN ELECTRONIC DEVICE 有权
    用于电子设备的按钮集成

    公开(公告)号：US20160071660A1

    公开(公告)日：2016-03-10

    申请号：US14550814

    申请日：2014-11-21

    Applicant: Apple Inc.

    Inventor： Ashutosh Y. Shukla ,  Tyler B. Cater ,  Sawyer I. Cohen ,  Edward S. Huo ,  David A. Pakula ,  Benjamin Shane Bustle ,  Dhaval N. Shah ,  Yaocheng Zhang ,  Vivek Katiyar

    IPC: H01H9/04 ,  H01H9/16

    CPC classification number: H04B1/3888 ,  H01H13/06 ,  H01H2205/016 ,  H01H2207/032 ,  H01H2213/00 ,  H01H2213/002 ,  H01H2213/016 ,  H01H2223/002 ,  H04B2001/3894 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/236

    Abstract: This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.

    Abstract translation: 本申请涉及与便携式电子设备一起使用的各种按钮相关实施例。 在一些实施例中，卡扣夹可以与按钮支架集成，以节省空间，其中两个单独的支架将占据便携式电子装置中太多的空间。 在其他实施例中，触觉开关可以通过在触觉开关组件顶部焊接聚合物层来防水。 以这种方式，可以防止水与触觉开关组件的湿气敏感部件接触。 将聚合物层连接到触觉开关的焊接可以包括围绕触觉开关组件的被捕获的气体的至少一个间隙，以在由各种操作和/或组装操作引起的热偏移期间进入和离开。

    HEAD MOUNTABLE DISPLAY
    33.
    发明申请
    HEAD MOUNTABLE DISPLAY 有权

    公开(公告)号：US20250037623A1

    公开(公告)日：2025-01-30

    申请号：US18914187

    申请日：2024-10-13

    Applicant: Apple Inc.

    Inventor： Edward S. Huo

    IPC: G09G3/00 ,  G06F3/01 ,  H04N23/56 ,  H04N23/90

    Abstract: A head mountable device includes a front cover defining an external forward facing surface and a nasal bridge, a first rearward facing display, a second rearward facing display, a first forward facing camera, a second forward facing camera, and a controller electrically coupled to the first forward facing camera, the second forward facing camera, the first rearward facing display, and the second rearward facing display. The nasal bridge is disposed between the first forward facing camera and the second forward facing camera and the controller is configured to cause mixed reality video pass-through from the first forward facing camera to the first rearward facing display including a first image and from the second forward facing camera to the second rearward facing display including a second image.

    Head mountable display
    35.
    发明授权
    Head mountable display 有权

    公开(公告)号：US12148332B1

    公开(公告)日：2024-11-19

    申请号：US18478796

    申请日：2023-09-29

    Applicant: Apple Inc.

    Inventor： Edward S. Huo

    IPC: G02B7/28 ,  G02B27/01 ,  G06F3/01 ,  G06T7/246 ,  G06T7/73 ,  G09G3/00 ,  H04N5/225 ,  H04N23/56 ,  H04N23/90

    Abstract: A head mountable device includes a front cover defining an external forward facing surface and a nasal bridge, a first rearward facing display, a second rearward facing display, a first forward facing camera, a second forward facing camera, and a controller electrically coupled to the first forward facing camera, the second forward facing camera, the first rearward facing display, and the second rearward facing display. The nasal bridge is disposed between the first forward facing camera and the second forward facing camera and the controller is configured to cause mixed reality video pass-through from the first forward facing camera to the first rearward facing display including a first image and from the second forward facing camera to the second rearward facing display including a second image.

    Systems With Supplemental Illumination
    37.
    发明公开
    Systems With Supplemental Illumination 审中-公开

    公开(公告)号：US20230324690A1

    公开(公告)日：2023-10-12

    申请号：US18179899

    申请日：2023-03-07

    Applicant: Apple Inc.

    Inventor： Ritu Shah ,  Edward S. Huo ,  Jason L. Slupeiks ,  Ryan J. Dunn ,  Tom Sengelaub ,  Tong Chen

    IPC: G02B27/01 ,  G02B27/00

    CPC classification number: G02B27/0172 ,  G02B27/0093 ,  G02B2027/0138 ,  G02B2027/014

    Abstract: A head-mounted device may have a head-mounted support structure. Displays may present images to eye boxes at the rear of the head-mounted support structure. Cameras and other sensors may be supported by the head-mounted support structure. Tracking cameras may be used to track the movement of a user's hands or other external objects. In dim ambient lighting conditions, a supplemental illumination system may be activated to provide supplemental illumination for the tracking cameras. A single beam of supplemental illumination may be emitted over a given coverage area or a smaller beam of supplemental illumination may be steered across the given coverage area. Light-emitting devices such as infrared light-emitting diodes and infrared lasers may be used to form infrared light sources for the supplemental illumination system.

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    40.
    发明申请
    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES 有权

    公开(公告)号：US20210191458A1

    公开(公告)日：2021-06-24

    申请号：US17192722

    申请日：2021-03-04

    Applicant: Apple Inc.

    Inventor： Lucy Elizabeth Browning ,  Benjamin J. Pope ,  Paul U. Leutheuser ,  Scott A. Myers ,  Richard Hung Minh Dinh ,  Edward S. Huo

    IPC: G06F1/16 ,  H03K17/96 ,  H03K17/975 ,  G06F3/01 ,  G06F3/16 ,  G06K9/00

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

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