公开(公告)号：US10510736B2

公开(公告)日：2019-12-17

申请号：US16219896

申请日：2018-12-13

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L23/31 ,  H01L25/16 ,  H01L33/44 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US10424493B2

公开(公告)日：2019-09-24

申请号：US15445476

申请日：2017-02-28

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson

IPC: H01L33/48 ,  H01L33/62 ,  H01L21/52 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L33/40

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US20170092627A1

公开(公告)日：2017-03-30

申请号：US15299346

申请日：2016-10-20

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L25/075 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/44 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/24 ,  H01L2251/5338 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y02E10/549 ,  Y02P70/521

Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 μm or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.

公开(公告)号：US20170018613A1

公开(公告)日：2017-01-19

申请号：US15282200

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L29/167 ,  H01L25/075 ,  H01L21/67 ,  H01L33/62

CPC classification number: H01L29/167 ,  B32B38/18 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2933/0066 ,  Y10T156/1153 ,  Y10T156/17 ,  Y10T156/1705 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  Y10T156/1911 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Abstract translation: 公开了一种传送微型装置和微型装置阵列的方法。 承载连接到接合层的微型器件的载体衬底被加热到低于接合层的液相线温度的温度，并且转移头被加热到高于接合层的液相线温度的温度。 当微型装置与转印头接触时，来自转印头的热量转移到粘结层中以至少部分地熔化粘结层。 施加到转印头的电压产生从载体衬底拾取微器件的夹持力。

公开(公告)号：US20160257131A1

公开(公告)日：2016-09-08

申请号：US15157247

申请日：2016-05-17

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC: B41J2/39

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：US20160181476A1

公开(公告)日：2016-06-23

申请号：US14803991

申请日：2015-07-20

Applicant: Apple Inc.

Inventor： Kevin K. C. Chang ,  Hsin-Hua Hu ,  Clayton Ka Tsun Chan ,  Chien-Hsing Huang

IPC: H01L33/38 ,  H01L33/48 ,  H01L33/60 ,  H01L25/075 ,  H01L33/06 ,  H01L33/62

CPC classification number: H01L33/38 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/20 ,  H01L33/46 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: LEDs and an electronic device are disclosed. In an embodiment an LED includes a p-n diode and a dielectric mirror spanning along a lateral sidewall of the p-n diode and directly underneath the p-n diode. An opening is formed in the dielectric mirror directly underneath the p-n diode, and a bottom conductive contact is on the dielectric mirror directly underneath the p-n diode and within the opening in the dielectric mirror.

Abstract translation: LED和电子设备被公开。 在一个实施例中，LED包括p-n二极管和跨越p-n二极管的横向侧壁并直接位于p-n二极管下方的电介质镜。 在p-n二极管正下方的电介质镜中形成一个开口，而在p-n二极管正下方和电介质反射镜的开口内的电介质镜上都有一个底部导电接触。

公开(公告)号：US12080696B2

公开(公告)日：2024-09-03

申请号：US18494109

申请日：2023-10-25

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56

CPC classification number: H01L25/167 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US20240234385A1

公开(公告)日：2024-07-11

申请号：US18415536

申请日：2024-01-17

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/92244 ,  H01L2224/95 ,  H01L2924/0002

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

公开(公告)号：US20230387097A1

公开(公告)日：2023-11-30

申请号：US18303929

申请日：2023-04-20

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/62 ,  H01L21/56 ,  H01L21/683

CPC classification number: H01L25/167 ,  H01L24/24 ,  H01L33/62 ,  H01L24/25 ,  H01L21/561 ,  H01L24/82 ,  H01L21/6835 ,  H01L2224/821 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/25171 ,  H01L2224/2518 ,  H01L2924/1426 ,  H01L2924/12041 ,  H01L25/0753

Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.

公开(公告)号：US20230082786A1

公开(公告)日：2023-03-16

申请号：US17933188

申请日：2022-09-19

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.