公开(公告)号：US20140308813A1

公开(公告)日：2014-10-16

申请号：US13862696

申请日：2013-04-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Samuel Hsu ,  Hung Chen ,  Jay Gurusamy ,  Gautam Dandavate

IPC: H01L21/67 ,  H01L21/306

CPC classification number: H01L21/30625 ,  H01J37/3053 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/3151 ,  H01L21/3065

Abstract: Systems, methods and apparatus for polishing a substrate edge without mechanical contact are disclosed. The apparatus includes a rotatable chuck configured to secure a substrate, an ion milling machine configured to project an ion beam on an edge of the substrate and to sputter off matter from the substrate, and an endpoint detection sensor configured to determine if a material removal endpoint of the substrate has been reached. Numerous additional features are disclosed.

Abstract translation: 公开了用于在没有机械接触的情况下抛光衬底边缘的系统，方法和装置。 该设备包括构造成固定基板的可旋转卡盘，被配置为将离子束投影在基板的边缘上并从基板溅射物质的离子铣床，以及端点检测传感器，被配置为确定材料去除端点 的基底已经达到。 公开了许多附加特征。

公开(公告)号：US20250114908A1

公开(公告)日：2025-04-10

申请号：US18483070

申请日：2023-10-09

Applicant: Applied Materials, Inc.

Inventor： Nai-Chieh Huang ,  Akshay Aravindan ,  Shih-Haur Shen ,  Jianshe Tang ,  Jay Gurusamy ,  Chen-Wei Chang ,  Chih-Han Yang ,  Wei Lu

IPC: B24B53/017

Abstract: A system may include a gimbal defining a plurality of pockets, where each pocket may include a first portion and a second portion that extends between the first portion and a base of the pocket. The second portion may have a greater diameter than the first portion. The system may include a plurality of conditioning disks, where each conditioning disk is seated within the first portion of a respective pocket. The system may include a plurality of gaskets, where each gasket is seated within the second portion of a respective pocket. The system may include a plurality o-rings, each o-ring disposed between a peripheral edge of one of the plurality of conditioning disks and a lateral wall of one of the plurality of pockets. The system may include a plurality of shoulder screws for coupling the gimbal with one of the plurality of gaskets and a conditioning disk.

公开(公告)号：US12251787B2

公开(公告)日：2025-03-18

申请号：US17979850

申请日：2022-11-03

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/10 ,  B24B37/20 ,  B24B41/02 ,  B24B47/02 ,  B24B53/017

Abstract: The present disclosure is directed towards polishing modules for performing chemical mechanical polishing of a substrate. The substrate may be a semiconductor substrate. The polishing modules described have a plurality of pads, such as polishing pads, disposed within a single polishing station. The pads are configured to remain stationary during processing, such as during polishing or buff operations. Either an x-y gantry assembly or a head actuation assembly is coupled to a system body of a polishing module and is configured to move a carrier head over the pads. Between process operations the polishing pads may be indexed to expose a new polishing pad to the carrier head.

公开(公告)号：US20240100646A1

公开(公告)日：2024-03-28

申请号：US18535675

申请日：2023-12-11

Applicant: Applied Materials, Inc.

Inventor： Jay Gurusamy ,  Steven M. Zuniga ,  Jeonghoon Oh

IPC: B24B37/013 ,  B24B37/14 ,  B24B37/26 ,  B24B37/27

CPC classification number: B24B37/013 ,  B24B37/14 ,  B24B37/26 ,  B24B37/27

Abstract: A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially outward from the platen to support an outer polishing pad. The annular flange has an inner edge secured to and rotatable with the platen and vertically fixed relative to the top surface of the platen. The annular flange is vertically deflectable such that an outer edge of the annular flange is vertically moveable relative to the inner edge. An actuator applies pressure to an underside of the annular flange in an angularly limited region, and a carrier head holds a substrate in contact with the polishing pad and is movable to selectively position a portion of the substrate over the outer polishing pad.

公开(公告)号：US11931857B2

公开(公告)日：2024-03-19

申请号：US17350579

申请日：2021-06-17

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Jay Gurusamy ,  Andrew J. Nagengast

IPC: B24B37/30 ,  B24B37/04 ,  B24B49/12 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683

CPC classification number: B24B37/30 ,  B24B37/042 ,  B24B49/12 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/67253 ,  H01L21/6838 ,  H01L22/26

Abstract: A carrier head includes a housing, a support assembly having a support plate flexibly connected to the housing so as to be vertically movable, a plurality of fluid-impermeable barriers projecting from a bottom of the support plate to define a plurality of recesses that are open at bottom sides thereof, and pneumatic control lines. A volume between the support plate and the housing includes one or more independently pressurizable first chambers to apply pressure on a top surface of the support plate in one or more first zones. The barriers are positioned and configured such that when a planar substrate is loaded into the carrier head the barriers contact the substrate and divide a volume between the support plate and the substrate into a plurality of second chambers. The pneumatic control lines are coupled to the plurality of recesses to provide a plurality of independently pressurizable second zones.

公开(公告)号：US11890717B2

公开(公告)日：2024-02-06

申请号：US16716213

申请日：2019-12-16

Applicant: Applied Materials, Inc.

Inventor： Jay Gurusamy ,  Steven M. Zuniga ,  Jeonghoon Oh

IPC: B24B37/14 ,  B24B37/26 ,  B24B37/27 ,  B24B37/013

CPC classification number: B24B37/013 ,  B24B37/14 ,  B24B37/26 ,  B24B37/27

Abstract: A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially outward from the platen to support an outer polishing pad. The annular flange has an inner edge secured to and rotatable with the platen and vertically fixed relative to the top surface of the platen. The annular flange is vertically deflectable such that an outer edge of the annular flange is vertically moveable relative to the inner edge. An actuator applies pressure to an underside of the annular flange in an angularly limited region, and a carrier head holds a substrate in contact with the polishing pad and is movable to selectively position a portion of the substrate over the outer polishing pad.

公开(公告)号：US11759911B2

公开(公告)日：2023-09-19

申请号：US17737642

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/32

CPC classification number: B24B37/32

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a carrier body, an outer membrane assembly, an annular segmented chuck, and an inner membrane assembly. The outer membrane assembly is supported from the carrier body and defines a first plurality of independently pressurizable outer chambers. The annular segmented chuck supported below the outer membrane assembly, and includes a plurality of concentric rings that are independently vertically movable by respective pressurizable chambers of the outer membrane assembly. At least two of the rings having passages therethrough to suction-chuck a substrate to the chuck. The inner membrane assembly is supported from the carrier body and is surrounded by an innermost ring of the plurality of concentric rings of the chuck. The inner membrane assembly defines a second plurality of independently pressurizable inner chambers and has a lower surface to contact the substrate.

公开(公告)号：US20230070746A1

公开(公告)日：2023-03-09

申请号：US17985778

申请日：2022-11-11

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Jay Gurusamy ,  Andrew J. Nagengast

IPC: B24B37/32 ,  B24B37/10 ,  B24B41/06

Abstract: A carrier head includes a base assembly, a substrate mounting surface connected to the base assembly, a plurality of segments disposed circumferentially around the substrate mounting surface to provide a collet retaining ring to surround a substrate mounted on the substrate mounting surface, and an outer ring that is vertically movable relative to the plurality of segments. An inner surface of the collet retaining ring is configured to engage a substrate, and the collect retaining ring and outer ring are configured such that vertical motion of the outer ring controls motion of the collet retaining ring between a clamping and unclamping position.

公开(公告)号：US20220281064A1

公开(公告)日：2022-09-08

申请号：US17684284

申请日：2022-03-01

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Andrew J. Nagengast ,  Jay Gurusamy

IPC: B24B37/30

Abstract: A carrier head for holding a substrate in a polishing system includes a housing, an annular body that is vertically movable relative to the housing by an actuator, a first annular membrane secured to extending below the annular body to form at least one lower pressurizable chamber between the first annular membrane and the annular body, and at least one pressure supply line connected to the at least one lower pressurizable chamber. The annular body includes an upper portion and at least one lower post projecting downward from the upper portion, with the at least one lower post located inside the at least one lower pressurizable chamber.

公开(公告)号：US20210402557A1

公开(公告)日：2021-12-30

申请号：US17350579

申请日：2021-06-17

Applicant: Applied Materials, Inc.

Inventor： Steven M. Zuniga ,  Jay Gurusamy ,  Andrew J. Nagengast

IPC: B24B37/30 ,  H01L21/67 ,  H01L21/683 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/66 ,  B24B37/04 ,  G01B11/24

Abstract: A carrier head includes a housing, a support assembly having a support plate flexibly connected to the housing so as to be vertically movable, a plurality of fluid-impermeable barriers projecting from a bottom of the support plate to define a plurality of recesses that are open at bottom sides thereof, and pneumatic control lines. A volume between the support plate and the housing includes one or more independently pressurizable first chambers to apply pressure on a top surface of the support plate in one or more first zones. The barriers are positioned and configured such that when a planar substrate is loaded into the carrier head the barriers contact the substrate and divide a volume between the support plate and the substrate into a plurality of second chambers. The pneumatic control lines are coupled to the plurality of recesses to provide a plurality of independently pressurizable second zones.