Abstract:
In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal/pad. The first and second electrically conductive terminals/pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.
Abstract:
In general, the present disclosure is directed to a transmitter optical subassembly (TOSA) module for use in an optical transceiver or transmitter that includes a magnetically-shielded optical isolator to minimize or otherwise reduce magnetization of TOSA components. An embodiment of the present disclosure includes a TOSA housing with magnetic shielding at least partially surrounding an optical isolator, with the magnetic shielding reflecting associated magnetic energy away from components, such as a metal TOSA housing or components disposed therein, that could become magnetized and adversely impact the magnetic flux density of the magnetic field associated with the optical isolator.
Abstract:
The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.
Abstract:
This present disclosure is generally directed to an optical isolator array with a magnetic base that allows for mounting and alignment of N number of optical isolators modules within an optical subassembly module. In an embodiment, the magnetic base provides at least one mounting surface for coupling to N number of optical isolators, with N being equal to an optical channel count for the optical subassembly (e.g., 4-channels, 8-channels, and so on). The magnetic base includes an overall width that allows for a desired number of optical isolators to get mounted thereon. Each optical isolator can be uniformly disposed along the same axis on the magnetic base and at a distance D from adjacent optical isolators. An adhesive such as ultraviolet-curing (UV-curing) optical adhesives may be used to secure each optical isolator at a predefined position and increase overall structural integrity.
Abstract:
The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.
Abstract:
A mirror device for use in an optical subassembly is disclosed that includes at least one surface with a visible indicator to allow a technician to differentiate a highly-reflective surface from relatively less reflective (e.g., un-coated) surfaces. The mirror device may be formed using known approaches, such as through the deposition of a metallic material on to a surface of the mirror device followed by one or more optional coating layers. Before, or after, forming the highly-reflective surface, a visual indicator may be introduced on to a surface of the mirror device that is opposite the highly-reflective surface. The visual indicator may comprise, for example, random scratches/scoring etched from a wire brush or tool, paint, epoxy, ink, or any other indicator that allows a technician to visually differentiate the portion of the mirror device having the visual indicator from the highly-reflective portion.
Abstract:
A photodiode package is disclosed that includes a TO-Can style body with an exposed sensor cavity that eliminates the necessity of an encapsulant dispensing process. The TO-Can body of the photodiode package includes an integrated coupling member to allow for coupling to a ROSA housing without an intermediate member. The photodiode package includes a base portion with a cylindrical wall portion that extends therefrom to form an optical coupling cavity. A surface of the base portion provides at least one mounting surface within the optical coupling cavity for coupling to a photodiode chip. The cylindrical wall may function as an integrated coupling member and may be used to directly couple the photodiode package, e.g., without an intermediate cap/ring, into a socket of a ROSA housing. The base portion and cylindrical wall may be formed from a single piece of material, or from multiple pieces depending on a desired configuration.
Abstract:
A multi-channel optical transmitter or transceiver includes an optical multiplexer with input and output ports on a single side. The optical multiplexer receives optical signals at different channel wavelengths on a plurality of mux input ports on one side and combines the optical signals into a multiplexed optical signal, which is output on an optical output port on the same side. The optical multiplexer may be located at a distal end of a transceiver or transmitter housing. In one embodiment, the optical multiplexer is a reversed planar lightwave circuit (PLC) splitter including splitter output ports that are used as the mux input ports and a splitter input port that is used as the mux output port. The mux input ports may be optically coupled to respective transmitter optical subassembly (TOSA) modules with optical fibers.
Abstract:
A multi-channel receiver optical subassembly (ROSA) including at least one sidewall receptacle configured to receive and electrically isolate an adjacent multi-channel transmitter optical subassembly (TOSA) is disclosed. The multi-channel ROSA includes a housing with at least first and second sidewalls, with the first sidewall being opposite the second sidewall and including at least one sidewall opening configured to fixedly attach to photodiode assemblies. The second sidewall includes at least one sidewall receptacle configured to receive at least a portion of an optical component package, such as a transistor outline (TO) can laser package, of an adjacent multi-channel TOSA, and provide electrical isolation between the ROSA housing and the TOSA within an optical transceiver. The sidewall receptacle can include non-conductive material in regions that directly or otherwise come into close proximity with the optical component package of the adjacent TOSA.