公开(公告)号：US20080001229A1

公开(公告)日：2008-01-03

申请号：US11757448

申请日：2007-06-04

Applicant: Atsushi WATANABE ,  Yasuhisa ISHIKAWA

Inventor： Atsushi WATANABE ,  Yasuhisa ISHIKAWA

IPC: H01L23/60

CPC classification number: H01L29/861 ,  H01L27/0251 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device is disclosed. The semiconductor device includes an internal circuit having a high breakdown voltage transistor, and a first electrostatic protection circuit in which electrostatic protection elements are connected in series. The sum of the breakdown voltage values of the electrostatic protection elements in the first electrostatic protection circuit is almost equal to the breakdown voltage value of the high breakdown voltage transistor. The first electrostatic protection circuit is connected between an input/output terminal and a ground terminal of the semiconductor device to which terminals the internal circuit is connected.

Abstract translation: 公开了一种半导体器件。 半导体器件包括具有高击穿电压晶体管的内部电路和静电保护元件串联连接的第一静电保护电路。 第一静电保护电路中的静电保护元件的击穿电压值的总和几乎等于高击穿电压晶体管的击穿电压值。 第一静电保护电路连接在与内部电路连接的端子的半导体器件的输入/输出端子和接地端子之间。

公开(公告)号：US20070246131A1

公开(公告)日：2007-10-25

申请号：US11693115

申请日：2007-03-29

Applicant: Atsushi WATANABE

Inventor： Atsushi WATANABE

IPC: C22C45/00 ,  C21D1/667

CPC classification number: B22F9/002 ,  B22F9/082 ,  B22F2009/0828 ,  B22F2009/086 ,  B22F2009/088

Abstract: A metal powder manufacturing device for manufacturing a metal powder includes a feed for supplying a molten metal, a fluid spout unit, and a course modification unit. The fluid spout unit further includes a channel and an orifice. The channel is provided below the feed, allowing passing of the molten metal supplied from the feed. The orifice is opened at a bottom end of the channel, spouting a fluid into the channel. The above course modification unit is provided below the fluid spout unit, and forcibly changes the traveling direction of a dispersion liquid. This dispersion liquid is composed of multiple fine droplets dispersed into the fluid. The above droplets are a resultant of a breakup caused by a contact between the molten metal and the fluid ejected from the orifice. Here, the dispersion liquid is transported so that the droplets is cooled and solidified in the dispersion liquid in order to manufacture the metal powder.

Abstract translation: 用于制造金属粉末的金属粉末制造装置包括用于供应熔融金属的进料，流体喷口单元和流程修改单元。 流体喷口单元还包括通道和孔口。 通道设置在进料下方，允许从进料供给的熔融金属通过。 孔口在通道的底端开口，将流体喷射到通道中。 上述过程修改单元设置在流体喷口单元的下方，并强制地改变分散液的行进方向。 该分散液由分散在流体中的多个细小液滴组成。 上述液滴是由熔融金属和从孔口喷出的流体之间的接触引起的分解的结果。 这里，分散液被输送，使液滴在分散液中冷却固化，制造金属粉末。