公开(公告)号：US11906667B2

公开(公告)日：2024-02-20

申请号：US17890243

申请日：2022-08-17

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G01S7/481 ,  G01S17/931 ,  G01S17/34 ,  G02B6/02

CPC classification number: G01S7/4818 ,  G01S17/34 ,  G01S17/931 ,  G02B6/021

Abstract: A LIDAR device for a vehicle includes an integrated chip. The integrated chip includes a substrate layer, a cladding layer, a waveguide, a scattering array, and a reflector layer. The cladding layer is disposed on the substrate layer to form an interface with the substrate layer. The waveguide is disposed within the cladding layer and configured to route an infrared optical field. The scattering array is disposed within the cladding layer between the waveguide and the interface and perturbs the infrared optical field and scatters the infrared optical field into a first beam propagating toward a surface of the cladding layer and into a second beam propagating towards the interface. The reflector layer is disposed within the cladding layer between the waveguide and the surface of the cladding layer to reflect the first beam towards the interface.

公开(公告)号：US11906661B2

公开(公告)日：2024-02-20

申请号：US17853674

申请日：2022-06-29

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G01S7/48 ,  G01S7/481 ,  G01S17/931

CPC classification number: G01S7/4813 ,  G01S17/931

Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

公开(公告)号：US11513289B1

公开(公告)日：2022-11-29

申请号：US17535024

申请日：2021-11-24

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G02B6/12 ,  G02B6/136 ,  G01S7/481

Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.