公开(公告)号：US20200042761A1

公开(公告)日：2020-02-06

申请号：US16104604

申请日：2018-08-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Yingwei Liu ,  Wenqian Luo ,  Qingzhao Liu ,  Muxin Di

IPC: G06K9/00 ,  H01L27/12 ,  H01L31/105 ,  H01L31/18 ,  H01L31/0216

Abstract: A fingerprint identification sensor, a method of fabricating the same, and a fingerprint identification apparatus are provided. The fingerprint identification sensor includes: a substrate; a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.