公开(公告)号：US11301082B2

公开(公告)日：2022-04-12

申请号：US17242511

申请日：2021-04-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu Liu ,  Qi Yao ,  Feng Zhang ,  Zhao Cui ,  Libo Wang ,  Dongfei Hou ,  Xiaoxin Song ,  Zhijun Lv ,  Liwen Dong ,  Detian Meng ,  Jalil Ryu ,  Yang Yue ,  Haitao Huang

IPC: G06F3/041 ,  G06F3/045 ,  G06F3/044 ,  G06K9/00

Abstract: The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.

公开(公告)号：US11175541B2

公开(公告)日：2021-11-16

申请号：US17264826

申请日：2020-05-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yang Yue ,  Hongrun Wang ,  Qi Yao ,  Tong Yang ,  Xiang Li ,  Yong Yu ,  Haitao Huang ,  Chuanxiang Xu ,  Feng Liao

IPC: G02F1/1339 ,  G02F1/1337

Abstract: A display substrate and a preparation method therefor, a display panel and a display device. The display substrate includes a plurality of pixel regions arranged in an array. The display substrate includes: a base; pixel electrodes provided on the base and located in the pixel regions; separation columns provided on the base and located between two adjacent pixel regions in the row direction, side surfaces of the separation columns having hydrophobic characteristics; and an alignment film provided on the pixel electrodes and located in the pixel regions, where edges of two opposite sides of the alignment film in the row direction are in contact with a side surface of the separation columns, and a surface of the alignment film on a side facing away from the base has a shape of gradually protruding from both sides toward the middle in the row direction.

公开(公告)号：US20210225956A1

公开(公告)日：2021-07-22

申请号：US16755777

申请日：2019-10-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yong Yu ,  Yang Yue ,  Jiangnan Lu ,  Shi Shu ,  Chuanxiang Xu ,  Haitao Huang ,  Xiang Li ,  Min Huang

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52 ,  H01L51/50 ,  C09K11/06

Abstract: The present disclosure is related to an array substrate. The array substrate may include a substrate; and a plurality of sub-pixels emitting different colors of light on the substrate. Each of the plurality of sub-pixels may include a green electroluminescence component, and each of the plurality of the sub-pixels other than green sub-pixels further may include a color conversion layer on a light-exiting side of the green electroluminescence component.

公开(公告)号：US10923508B2

公开(公告)日：2021-02-16

申请号：US16398488

申请日：2019-04-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Wusheng Li ,  Dongsheng Li ,  Huili Wu ,  Shipei Li ,  Dongsheng Yin ,  Fang He ,  Yang Yue

IPC: H01L27/12 ,  H01L23/48 ,  H01L23/522 ,  H01L33/38 ,  H01L23/482 ,  H01L23/532

Abstract: The disclosure relates to an array substrate and a manufacturing method therefor, a display panel, and a display device. The array substrate comprises a base substrate, and a lead-out line and an inorganic insulating layer which are located on one side of the base substrate; the base substrate is provided with a plurality of connection vias penetrating the base substrate and filled with a first conductive material; the inorganic insulating layer is provided with a first via and a second via, the first via penetrating to the first conductive material, and the second via penetrating to the lead-out line; a second conductive layer is disposed on the side, away from the base substrate, of the first via, the second via and the inorganic insulating layer, such that the first conductive material and the lead-out line are electrically connected through the second conductive layer.