公开(公告)号：US06885037B1

公开(公告)日：2005-04-26

申请号：US10697610

申请日：2003-10-31

Applicant: Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

Inventor： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

IPC: H01L21/60 ,  H01L23/495 ,  H01L29/22 ,  H01L33/00

CPC classification number: H01L24/97 ,  H01L23/49562 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Stacked metal sections serve as two leads of an IC package. In one embodiment, an IC chip is mounted on one section serving as the terminal for the bottom electrode of the chip, and the top electrode of the chip is wire-bonded to the other section serving as another terminal for the chip. The thin sheet metal permits narrower etched separation between the two metal sections. Stacking of two pre-etched thin sheet metals strengthens the substrate. The package is covered with glue to hold the two sections together. The stacked pre-etched metal sheets can serve as a common substrate for a matrix of IC packages, which can later be cut in two orthogonal directions to yield individual packages.

Abstract translation: 堆叠金属部分作为IC封装的两个引线。 在一个实施例中，将IC芯片安装在用作芯片的底部电极的端子的一个部分上，并且芯片的顶部电极引线接合到用作芯片的另一个端子的另一个部分。 薄金属板允许两个金属部分之间的较窄的蚀刻间隔。 两个预蚀刻的薄金属板的堆叠加强了基板。 包装用胶水覆盖，将两个部分保持在一起。 堆叠的预蚀刻金属片可以用作IC封装的矩阵的公共衬底，其可以随后在两个正交方向上被切割以产生单独的封装。

公开(公告)号：US06794686B2

公开(公告)日：2004-09-21

申请号：US10464111

申请日：2003-06-19

Applicant: Bill Chang ,  Bily Wang

Inventor： Bill Chang ,  Bily Wang

IPC: H01L2906

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L2924/0002 ,  Y10S257/918 ,  H01L2924/00

Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue on an insulating substrate.

Abstract translation: 通过在绝缘基板上使用不超过两层彩色LED覆盖一层或多层补色磷光胶而产生接近白光的无色光。

公开(公告)号：US06534799B1

公开(公告)日：2003-03-18

申请号：US09678373

申请日：2000-10-03

Applicant: Bily Wang ,  Bill Chang

Inventor： Bily Wang ,  Bill Chang

IPC: H01L3300

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H05K3/3442 ,  H01L2924/00014

Abstract: In a surface mount LED chips mounted on an insulating substrate, plated through conduits to interconnect the chips on both sides are placed at the corners of the outer terminals at two horizontal ends. The depressions caused by wire-bonding the chip to the terminals are lined up vertically with the corner conduits to reduce horizontal dimension.

Abstract translation: 在安装在绝缘基板上的表面安装的LED芯片中，通过导管电镀以将两侧的芯片互连以在两个水平端部放置在外部端子的角部。 将芯片接线到端子引起的凹陷与拐角导管垂直排列以减小水平尺寸。

公开(公告)号：US06398983B1

公开(公告)日：2002-06-04

申请号：US09758812

申请日：2001-01-12

Applicant: Bily Wang ,  Bill Chang

Inventor： Bily Wang ,  Bill Chang

IPC: C09K1102

CPC classification number: C09K11/02 ,  C09K11/7792

Abstract: A solid state epoxy powder and a solid state fluorescent powder material are mixed in a fixed ratio for application over the surface of an optical device. When the mixture is heated into liquid form and then cooled down, the mixture forms a fluorescent coating which emits colorless light when optical device is excited.

Abstract translation: 将固态环氧粉末和固态荧光粉末材料以固定比例混合，以施加在光学装置的表面上。 当将混合物加热成液体形式然后冷却时，混合物形成荧光涂层，当光学装置被激发时其发出无色光。

公开(公告)号：US08748209B2

公开(公告)日：2014-06-10

申请号：US13150299

申请日：2011-06-01

Applicant: Bily Wang ,  Hung-Chou Yang ,  Jeng-Ru Chang

Inventor： Bily Wang ,  Hung-Chou Yang ,  Jeng-Ru Chang

IPC: H01L21/00

CPC classification number: H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L24/96 ,  H01L33/62 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/24137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip is received in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed between the conductive pads to insulate the conductive pads. The first conductive layers are formed on the first insulative layer and the package unit, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers.

Abstract translation: 用于在不使用引线接合工艺的情况下实现倒装芯片电连接的半导体芯片封装结构包括封装单元，半导体芯片，第一绝缘层，第一导电层，第二绝缘层和第二导电层。 包装单元具有接收槽。 半导体芯片被容纳在接收槽中并且具有设置在其顶表面上的多个导电焊盘。 第一绝缘层形成在导电焊盘之间以使导电焊盘绝缘。 第一导电层形成在第一绝缘层和封装单元上，并且每个第一导电层的一侧电连接到相应的导电焊盘。 第二绝缘层形成在第一导电层之间，以使第一导电层彼此绝缘。 第二导电层分别形成在第一导电层的另一相对侧上。

公开(公告)号：US08263876B2

公开(公告)日：2012-09-11

申请号：US12649824

申请日：2009-12-30

Applicant: Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

Inventor： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

IPC: H05K1/11

CPC classification number: B26D3/06 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/403 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T83/0524

Abstract: A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.

Abstract translation: 导电基板结构包括基板单元，导电焊盘单元和导电层单元。 基板单元具有顶表面，底表面，两个相对的侧表面和前表面。 导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。 导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层 到两个第二导电焊盘的两个相对的侧面。 两个第一导电层分别与两个第二导电层电连接。

公开(公告)号：US08138508B2

公开(公告)日：2012-03-20

申请号：US12285190

申请日：2008-09-30

Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC: H01L33/00

CPC classification number: F21K9/00

Abstract: An LED chip package structure with different LED spacing includes a substrate unit, a light-emitting unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit, and the LEDs are separated from each other by totally different spacing or partially different spacing. For example, the spacings between each two LED chips are from rarefaction to condensation, from condensation to rarefaction, from center rarefaction to outer condensation, from center condensation to outer rarefaction, alternate rarefaction and condensation, or alternate condensation and rarefaction. The package colloid unit covers the LED chips.

Abstract translation: 具有不同LED间隔的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 发光单元具有电子地布置在基板单元上的多个LED芯片，并且LED通过完全不同的间隔或部分不同的间隔彼此分离。 例如，两个LED芯片之间的间距从稀释到冷凝，从冷凝到稀释，从中心稀释到外部冷凝，从中心冷凝到外部稀释，交替稀释和冷凝，或交替冷凝和稀释。 封装胶体单元覆盖LED芯片。

公开(公告)号：US08031930B2

公开(公告)日：2011-10-04

申请号：US12285184

申请日：2008-09-30

Applicant: Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou

Inventor： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou

IPC: G06K9/00

CPC classification number: G01N21/95 ,  G01N21/8806

Abstract: A testing system for inspecting electronic devices includes a first transparent disk, a first image capturing unit disposed under the first transparent disk, a second disk disposed next to the first transparent disk, a guiding unit disposed on adjacent area between the transparent disk and the second disk, and a plurality of second image capturing units disposed around the second disk. A plurality of electronic devices is continuingly supplied onto the first transparent disk and the first image capturing unit is used for capturing the images of the bottom surfaces of the electronic devices. Then, the electronic devices are guided to the second disk via the guiding unit and the second image capturing units are used for capturing the images of other surfaces of the electronic devices. A testing method for electronic devices is further disclosed.

Abstract translation: 用于检查电子设备的测试系统包括第一透明盘，设置在第一透明盘下方的第一图像捕获单元，邻近第一透明盘设置的第二盘，设置在透明盘与第二透明盘之间相邻区域上的引导单元 盘，以及设置在第二盘周围的多个第二图像捕获单元。 多个电子设备被连续地提供到第一透明盘上，并且第一图像捕获单元用于捕获电子设备的底面的图像。 然后，电子设备经由引导单元被引导到第二盘，并且第二图像捕获单元用于捕获电子设备的其他表面的图像。 进一步公开了一种电子设备的测试方法。

公开(公告)号：US08017969B2

公开(公告)日：2011-09-13

申请号：US12232835

申请日：2008-09-25

Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC: H01L33/00

CPC classification number: H01L24/97 ,  F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0031 ,  G02B6/0073 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.

Abstract translation: 通过粗糙表面具有高效发光的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片。 各LED芯片分别具有正极侧和负极侧，与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖LED芯片的多个封装胶体。 每个包装胶体具有分别形成在其顶表面及其侧表面上的弧形胶体表面和发光胶体表面。

公开(公告)号：US08002436B2

公开(公告)日：2011-08-23

申请号：US12243026

申请日：2008-10-01

Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC: F21S4/00 ,  F21V21/00

CPC classification number: H05K1/189 ,  F21K9/68 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K1/056 ,  H05K2201/047 ,  H05K2201/09036 ,  H05K2201/2054 ,  H05K2203/302 ,  H01L2924/00

Abstract: An LED chip package structure using a substrate as a lampshade includes a substrate unit and a light-emitting unit. The substrate unit has a substrate body with a lampshade shape. The light-emitting unit has a plurality of light-emitting elements electrically disposed on an inner surface of the substrate body. Therefore, one part of light beams projected by the light emitting elements is reflected out of the lampshade by the inner surface of the substrate body.

Abstract translation: 使用基板作为灯罩的LED芯片封装结构包括基板单元和发光单元。 基板单元具有带灯罩形状的基板主体。 发光单元具有多个发光元件，电子设置在基板主体的内表面上。 因此，由发光元件投影的光束的一部分被基板主体的内表面反射出灯罩。