公开(公告)号：US11927435B2

公开(公告)日：2024-03-12

申请号：US17534539

申请日：2021-11-24

Applicant: CKD CORPORATION

Inventor： Manabu Okuda ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: G01B11/25

CPC classification number: G01B11/2527 ,  G01B11/2513 ,  G01B11/254

Abstract: A three-dimensional measurement device performs three-dimensional measurement of a measured object using a phase shift method. The three-dimensional measurement device includes: an irradiator that irradiates the measured object with a predetermined light pattern having a light intensity distribution in a fringe shape; a control device that shifts a phase of the light pattern radiated from the irradiator in N different ways, where N is a natural number of not less than 3; and an imaging device that takes an image of the measured object irradiated with the light pattern. The control device executes three-dimensional measurement of the measured object by the phase shift method based on N different image data taken under the light pattern having the phase shifted in the N different ways.

公开(公告)号：US11452250B2

公开(公告)日：2022-09-20

申请号：US16535563

申请日：2019-08-08

Applicant: CKD Corporation

Inventor： Ikuo Futamura ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: H05K13/08 ,  G06T7/11 ,  G01N21/956 ,  G06T7/00 ,  H05K3/34 ,  H05K13/04

Abstract: A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

公开(公告)号：US11184984B2

公开(公告)日：2021-11-23

申请号：US16527947

申请日：2019-07-31

Applicant: CKD Corporation

Inventor： Manabu Okuda ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: H05K3/00 ,  B23K1/00 ,  B23K3/00 ,  H05K3/34 ,  G06T7/70 ,  B23K1/005 ,  G01B11/24 ,  G06T7/00 ,  B23K101/42

Abstract: A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.

公开(公告)号：US11039561B2

公开(公告)日：2021-06-15

申请号：US16574412

申请日：2019-09-18

Applicant: CKD Corporation

Inventor： Ikuo Futamura ,  Tsuyoshi Ohyama ,  Norihiko Sakaida ,  Kazuyoshi Kikuchi

IPC: B23K31/00 ,  H05K13/08 ,  G06T7/50 ,  B23K31/02 ,  G01B11/06 ,  G01B11/25 ,  G01N21/95 ,  G06T7/00 ,  H05K3/34 ,  B23K101/42

Abstract: A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

公开(公告)号：US20210047066A1

公开(公告)日：2021-02-18

申请号：US17088752

申请日：2020-11-04

Applicant: CKD CORPORATION

Inventor： Yukihiro Taguchi ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: B65B57/10 ,  G01N21/95 ,  G01N21/90 ,  G01N21/359 ,  B65B9/04

Abstract: An inspection device is used in manufacture of a PTP sheet that comprises a container film including a pocket portion in which a content is placed and a cover film closing the pocket portion. The inspection device includes: an illumination device that emits near infrared light; a light shield that is placed between the illumination device and the container film and prevents the near infrared light from entering the container film; a through hole in the light shield that allows the near infrared light to pass through; a spectroscope that disperses reflected light from the content; an imaging device that images an optical spectrum of the reflected light and obtains spectroscopic image data; and a controller that: obtains spectral data of the content based on the spectroscopic image data; and performs a predetermined inspection with regard to the content based on the spectral data of the content.

公开(公告)号：US10914574B2

公开(公告)日：2021-02-09

申请号：US16538934

申请日：2019-08-13

Applicant: CKD CORPORATION

Inventor： Nobuyuki Umemura ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: G01B11/25 ,  G01N21/88 ,  G01N21/956

Abstract: A three-dimensional measurement device includes: a projector that includes: a light source that emits predetermined light; and a reflective optical modulator that converts the predetermined light into a predetermined striped pattern, wherein the projector projects the predetermined striped pattern onto a measurement object at a predetermined number of frames per unit time; an imaging device that takes an image of the measurement object projected with the predetermined striped pattern; a processor that: controls the projector and the imaging device to sequentially project a plurality of different ones of the predetermined striped pattern and take images of the plurality of different ones of the predetermined striped pattern to obtain a plurality of image data having different light intensity distributions; and executes three-dimensional measurement of the measurement object based on the plurality of image data.

公开(公告)号：US20200031511A1

公开(公告)日：2020-01-30

申请号：US16592902

申请日：2019-10-04

Applicant: CKD CORPORATION

Inventor： Yukihiro Taguchi ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: B65B57/10 ,  B65B9/04 ,  B65D75/36 ,  G01N21/95 ,  G01N21/359 ,  G01N21/3563

Abstract: An inspection device includes: an irradiator that irradiates an object with near-infrared light; a spectroscope that has a slit where reflected light enters and that disperses the reflected light into wavelength component lights; an imaging device that comprises an imaging element that takes a spectroscopic image of the wavelength component lights; and a processor that: obtains spectral data based on the spectroscopic image; and detects a type of the object using a predetermined analysis based on the spectral data. Each of the wavelength component lights is a single wavelength light, the inspection device satisfies L≥2P, where L is a width of each of the wavelength component lights in a wavelength dispersion direction on a light receiving surface of the imaging element and P is a width of a pixel in the wavelength dispersion direction on the light receiving surface.

公开(公告)号：US20190357361A1

公开(公告)日：2019-11-21

申请号：US16527947

申请日：2019-07-31

Applicant: CKD Corporation

Inventor： Manabu Okuda ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: H05K3/34 ,  G06T7/00 ,  G06T7/70 ,  B23K1/005 ,  B23K1/00 ,  G01B11/24

Abstract: A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.

公开(公告)号：US10295479B2

公开(公告)日：2019-05-21

申请号：US15385999

申请日：2016-12-21

Applicant: CKD Corporation

Inventor： Nobuyuki Umemura ,  Akira Kato ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: G01N21/956 ,  G01N21/95 ,  H04N5/225 ,  H04N5/247

Abstract: A board inspection apparatus is disclosed, which includes one surface-side irradiator that irradiates a first area on a surface side of a board with first light, a surface-side camera that takes an image of the first area, one rear face-side irradiator that irradiates a second area on a rear face side of the board with second light, a rear face-side camera that takes an image of the second area; and a controller that inspects the first area based on image data obtained from the surface-side camera and the second area based on image data obtained from the rear face-side camera.

公开(公告)号：US20190025048A1

公开(公告)日：2019-01-24

申请号：US16059210

申请日：2018-08-09

Applicant: CKD Corporation

Inventor： Tsuyoshi Ohyama ,  Norihiko Sakaida ,  Ikuo Futamura

IPC: G01B11/25 ,  G01B11/16 ,  G01B11/06

CPC classification number: G01B11/25 ,  G01B11/0608 ,  G01B11/16 ,  G01B11/24 ,  G01B2210/56 ,  H05K3/34

Abstract: A three-dimensional measurement device includes: an illuminator that irradiates a measured object with a predetermined light; an imaging device that comprises: an imaging sensor displaceable at least in a vertical direction; and a both-sided telecentric optical system that causes the imaging sensor to form an image of a predetermined area on the measured object irradiated with the predetermined light; a conveyor that moves the illuminator and the imaging device relative to the measured object; and a controller that: executes three-dimensional measurement of a predetermined measurement object on the measured object, based on the taken image; measures a height of the predetermined area at least at a time prior to imaging of the predetermined area under the predetermined light; and changes a height position of the imaging sensor based on a measurement result to adjust an interval between the predetermined area and the imaging sensor to a predetermined distance.