SENSOR SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    33.
    发明申请
    SENSOR SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    传感器半导体器件及其制造方法

    公开(公告)号:US20060267125A1

    公开(公告)日:2006-11-30

    申请号:US11162135

    申请日:2005-08-30

    CPC classification number: H01L27/14683 H01L27/14618 H01L2224/24226

    Abstract: A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.

    Abstract translation: 提出了一种传感器半导体器件及其制造方法。 传感器芯片安装在基板上,并且在基板上形成电介质层和电路层,其中电路层电连接到基板和传感器芯片。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口,使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 传感器芯片可以通过植入在基板的表面上的多个焊球电连接到外部设备,而不用于安装传感器芯片。 因此,传感器半导体器件以成本有效的方式制造,并且防止了电路破裂和知道的裸芯片(KGD)问题。

    Method for fabricating semiconductor packages
    34.
    发明授权
    Method for fabricating semiconductor packages 有权
    半导体封装的制造方法

    公开(公告)号:US07129119B2

    公开(公告)日:2006-10-31

    申请号:US11049054

    申请日:2005-02-01

    Abstract: A method for fabricating semiconductor packages is proposed. A plurality of substrates are prepared each having a chip thereon. Length and width of each substrate are equal to predetermined length and width of the semiconductor package. A carrier having a plurality of openings is prepared. A protruded portion is formed at each corner of each opening, wherein a distance between two diagonal protruded portions is slightly larger than that between two diagonal corners of the substrate. The substrates are fixed in the openings of the carrier by means of the protruded portions, and gaps between the substrates and the carrier are sealed. An encapsulant is formed over each opening to encapsulate the corresponding chip by a molding process. An area on the carrier covered by the encapsulant is larger in length and width than the opening. A plurality of the semiconductor packages are formed after performing mold-releasing and singulation processes.

    Abstract translation: 提出了制造半导体封装的方法。 准备了各自具有芯片的多个基板。 每个基片的长度和宽度等于半导体封装的预定长度和宽度。 制备具有多个开口的载体。 在每个开口的每个角部处形成突出部分,其中两个对角线突出部分之间的距离略大于基板的两个对角线之间的距离。 基板通过突出部固定在载体的开口中,基板和载体之间的间隙被密封。 在每个开口上形成密封剂,以通过模制工艺封装相应的芯片。 由密封剂覆盖的载体上的区域的长度和宽度大于开口的宽度。 在进行脱模和切割处理之后形成多个半导体封装。

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